Meetings & Events

Fall 2006 logo2006 MRS Fall Meeting & Exhibit

November 27 - December 1, 2006 | Boston
Meeting Chairs:
 Babu R. Chalamala, Louis J. Terminello, Helena Van Swygenhoven

 

Symposium V : Advanced Electronic Packaging

2006-11-27   Show All Abstracts

Symposium Organizers

Vasudeva P. Atluri Intel Corporation
Sujit Sharan Intel Corporation
Ching-Ping Wong Georgia Institute of Technology
Darrel Frear Freescale Semiconductor
V1/W2: Joint Session: System in Package
Session Chairs
Bill Chen
Fred Roozeboom
Monday PM, November 27, 2006
Room 206 (Hynes)

2:30 PM - **V1.1/W2.1
Silicon Based System-in-Package : Breakthroughs in Miniaturization and ”nano”-integration Supported by Very High Quality Passives and System Level Design Tools.

Franck Murray 1 , François LeCornec 1 , Serge Bardy 1 , Catherine Bunel 1 , Jan Verhoeven 2 , Erik van der Heuvel 2 , Johan Klootwijk 2 , Fred Roozeboom 2
1 , NXP Research, Caen France, 2 , Philips Research, Eindhoven Netherlands

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3:00 PM - **V1.2/W2.2
Process and Material Requirements for Successful Heterogonous Passive Component Integration in RF System.

Eric Beyne 1 , Walter De Raedt 1 , Geert Carchon 1 , Philippe Soussan 1
1 , IMEC, Leuven Belgium

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3:30 PM -
BREAK

4:30 PM - **V1.3/W2.3
Through Wafer Interconnects – a Technology not only for Medical Applications.

Gereon Vogtmeier 1 , Christian Drabe 3 , Ralf Dorscheid 2 , Roger Steadman 1 , Alexander Wolter 3
1 X-ray Imaging Systems, Philips Research Europe, Aachen Germany, 3 , Fraunhofer Institute Photonic Microsystems, Dresden Germany, 2 Engineering and Technology, Philips Research Europe, Aachen Germany

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5:00 PM - V1.4/W2.4
FsCSP Packaging Technology: Case Studies on Package Processability and Reliability Performance and its Dependence on Material Properties

Rahul Manepalli 1 , Chris Matayabas 1 , Eduardo Gacho 1
1 Assembly Technology Development, Intel Corporation, Chandler, Arizona, United States

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5:15 PM - V1.5/W2.5
The Flexible Physiological Monitor of Patch Type Package Based on Non-weave Material.

Wen-Yang Chang 1 2 , Hung-Hsin Tsai 1 , Ying-Chiang Hu 1
1 , Industrial Technology Research Institute, Tainan Taiwan, 2 Microsystems Technology Center, Industrial Technology Research Institute, Tainan Taiwan

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5:30 PM - V1.6/W2.6
An Approach for Characterizing Residual Mechanical Stress by Packaging Processes.

Soeren Hirsch 1
1 FEIT-IMOS, University of Magdeburg, Magdeburg Germany

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5:45 PM - V1.7/W2.7
Laser Printing Method for Manufacturing of Flexible Copper Electrodes and Interconnects

Nurdan Demirci Sankir 1 , Andrea Hill 1 , Jennifer Lalli 1 , Brad Davis 1 , Hang Ruan 1 , Richard Goff 2 , Richard Claus 3 4
1 , NanoSonic Inc., Blacksburg, Virginia, United States, 2 Department of Engineering Education, Virginia Tech, Blacksburg, Virginia, United States, 3 Department of Materials Science and Engineering, Virginia Tech, Blacksburg, Virginia, United States, 4 Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, Virginia, United States

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2006-11-28   Show All Abstracts

Symposium Organizers

Vasudeva P. Atluri Intel Corporation
Sujit Sharan Intel Corporation
Ching-Ping Wong Georgia Institute of Technology
Darrel Frear Freescale Semiconductor
V2: Advanced Packaging
Session Chairs
C. Robert Kao
King-Ning Tu
Tuesday AM, November 28, 2006
Room 301 (Hynes)

9:30 AM - **V2.1
Packaging and Packaging Materials in the 2006 ITRS Roadmap.

William Chen 1 , Bill Bottoms 1
1 , ASE, Santa Clara, California, United States

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10:00 AM - **V2.2
Trends and Challenges in Advanced Packaging.

Debendra Mallik 1
1 , Intel, Chandler, Arizona, United States

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10:30 AM - **V2.3
Challenges in High Density Interconnect Packaging.

Ravi Mahajan 1
1 , Intel, Chandler, Arizona, United States

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11:00 AM -
BREAK

11:15 AM - **V2.4
Optoelectronics is Again Vibrant and Penetrating Many New MarketS.

Michael Lebby 1
1 , Optoelectronics Industry Development Association, Washington, District of Columbia, United States

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11:45 AM - **V2.5
Methodologies for Next Generation Semiconductor Packaging.

Tarun Verma 1
1 , Altera Corporation, San Jose, California, United States

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12:15 PM - V2.6
Reactive Multilayer Foils for Wafer Level Packaging.

Xiaotun Qiu 1 , Jiaping Wang 1
1 ME, Louisiana State University, Baton Rouge, Louisiana, United States

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12:30 PM - **V2.7
The Increasing Importance of Materials in Electronic Packaging.

Ken Brown 1
1 , Intel, Chandler, Arizona, United States

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V3: Physical Behavior in Packaging
Session Chairs
Nikhilesh Chawla
Ravi Mahajan
Tuesday PM, November 28, 2006
Room 301 (Hynes)

2:30 PM - **V3.1
Massive Spalling of Intermetallic Compound in Lead-Free Solder Joints.

Cheng En Ho 1 , Su Yang 1 , C Robert Kao 1
1 Dept. of Chemical & Materials Eng., National Central University, Jhungli City Taiwan

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3:00 PM - **V3.2
Phase Separation in Eutectic Solder Joints Driven by External Forces.

King-Ning Tu 1
1 Materials Science and Engineering, UCLA, Los Angeles, California, United States

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3:30 PM - **V3.3
Effect of Zn Addition on the Interfacial Reactions between Cu and Lead-Free Solders.

Su-Chun Yang 1 , C. Robert Kao 1 2 , Cheng-En Ho 1 , Chien-Wei Chang 1
1 National Central University, Department of Chemical & Materials Engineering, Jhongli City Taiwan, 2 National Central University, Institute of Materials Science & Engineering, Jhongli Taiwan

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4:00 PM -
BREAK

4:45 PM - V3.5
Controlled Study of Effect of Stress on Growth of Interfacial Intermetallic Compounds in Pb-free Solder Interconnects

Wei Zhou 1 , Shwu Lan Ngoh 1 , John Pang 1
1 School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore Singapore

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5:00 PM - V3.6
Bonding Interface Analysis of Au-Ag Bonding Wire.

Eun Kyu Her 1 , Hee-Suk Chung 1 , Suk Hoon Kang 1 , Kyu Hwan Oh 1 , Jong Soo Cho 2 , Jeong Tak Moon 2
1 school of materials science and engineering, Seoul National University, Seoul Korea (the Republic of), 2 , MK electron, Yongin-si, Gyeonggi-do, Korea (the Republic of)

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5:15 PM - V3.7
Thermodynamics and Kinetics of Oxidation of Pure Indium Solders.

Harry Schoeller 1 , Junghyun Cho 1
1 Mechanical Engineering, SUNY Binghamton, Binghamton, New York, United States

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5:30 PM - V3.8
A Novel PPF Technique— Sn-PPF: Effects of in-situ Formation Cu-Sn-Ni Intermetallic Nano-layer on Electronic Packaging Performances.

Lilin Liu 1 , Tongyi Zhang 1 , Ran Fu 2 , Deming Liu 2
1 Department of Mechanical Engineering, Hongkong University of Science and Technology, Hong Kong China, 2 , ASM Assembly Automation Ltd, Hong Kong China

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5:45 PM - V3.9
Challenges for large form factor Land Grid Array Sockets: Surface Mount Technology and Beyond.

Subhadarshi Nayak 1 , Gregorio Murtagian 1 , Brent Stone 1 , Pramod Malatkar 1 , Donald Tran 1 , Jagdish Umaretiya 1
1 , Intel, Chandler, Arizona, United States

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2006-11-29   Show All Abstracts

Symposium Organizers

Vasudeva P. Atluri Intel Corporation
Sujit Sharan Intel Corporation
Ching-Ping Wong Georgia Institute of Technology
Darrel Frear Freescale Semiconductor
V4: Mechanical Behavior in Packaging
Session Chairs
Ken Brown
Indranath Dutta
Wednesday AM, November 29, 2006
Room 301 (Hynes)

9:30 AM - **V4.1
Technology Development and Integration Challenges with Pb-Free Solder Interconnects.

Nasser Grayeli 1
1 , Intel Corporation, Chandler, Arizona, United States

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10:00 AM - **V4.2
Compression Creep Behavior of the 95.5Sn-(4.3, 3.9, 3.8)Ag-(0.2, 0.6, 0.7)Cu Solders.

Paul Vianco 1 , Jerome Rejent 1 , Alice Kilgo 1 , Joseph Martin 2
1 , Sandia National Laboratories, Albuquerque, New Mexico, United States, 2 , Orion International, Inc., Albuquerque, New Mexico, United States

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10:30 AM - **V4.3
Thermomechanical Behavior and Reliability of Pb-Free Solders

Nik Chawla 1
1 School of Materials, Arizona State University, Tempe, Arizona, United States

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11:00 AM -
BREAK

11:30 AM - V4.4
Factors Affecting the Mechanical Properties of Cu/electroless Ni-P/Sn-3.5Ag Solder Joint.

Aditya Kumar 1 2 , Zhong Chen 1 , Chee Cheong Wong 1 , Subodh Gautam Mhaisalkar 1 , Kripesh Vaidyanathan 2
1 School of Materials Science and Engineering, Nanyang Technological University, Singapore Singapore, 2 , Institute of Microelectronics, Singapore Singapore

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12:00 PM - V4.6
Time-Lapse Measurements of Creep in Au-Sn Die Bonds.

Ryan Marinis 2 , Adam Klempner 2 , Ryszard Pryputniewicz 2 , Peter Hefti 2 , Thomas Marinis 1 , Joseph Soucy 1
2 Mechanical Engineering, Worcester Polytechnic Institute, Worcester, Massachusetts, United States, 1 , Draper Laboratory, Cambridge, Massachusetts, United States

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12:15 PM - V4.7
Mechanical Property Measurement of Interconnect Materials by Magnetostrictive Sensors

Cai Liang 1 , Bart Prorok 1 , Leslie Mathison 1 , Charles Ellis 2
1 Materials Engineering, Auburn University, Auburn, Alabama, United States, 2 Electrical and Computer Engineering, Auburn University, Auburn, Alabama, United States

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12:30 PM - V4.8
Mixed-Mode Testing of Wafer Bonded Interfaces

Rajappa Tadepalli 1 , Kevin Turner 2
1 Materials Science and Engineering, M.I.T., Cambridge, Massachusetts, United States, 2 Mechanical Engineering, University of Wisconsin-Madison, Madison, Wisconsin, United States

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12:45 PM - V4.9
Fracture of Organosilicate Glass Coatings at Low Temperature.

Youbo Lin 1 , Joost Vlassak 1
1 DEAS, Harvard University, Cambridge, Massachusetts, United States

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V5: Electromigration and Thermal Behavior in Packaging
Session Chairs
Paul Vianco
Vijay Wakharkar
Wednesday PM, November 29, 2006
Room 301 (Hynes)

2:30 PM - V5.1
Electromigration Driving Force and Threshold Product of Current Density and Line Length for Sn-based Alloy Solders

Bit-Na Kim 1 , Min-Seung Yoon 1 , Byoung-Joon Kim 1 , Young-Bae Park 2 , Young-Chang Joo 1
1 School of Materials Science and Engineering, Seoul National University, Seoul Korea (the Republic of), 2 School of Materials Science and Engineering, Andong National University, Andong Korea (the Republic of)

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2:45 PM - V5.2
Morphology of the Electromigration Damage of Lead-free Solders on Electroless NiP/Cu Metallization.

Jin-Wook Jang 1 , Lakshmi Ramanathan 1 , Jong-Kai Lin 1 , Darrel Frear 1
1 , Freescale Semiconductor, Inc., Tempe, Arizona, United States

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3:00 PM - V5.3
In-situ Investigation of Electromigration Characteristics of Eutectic SnPb and SnAgCu Interconnects.

Young-Bae Park 1 , Oh-Han Kim 2 , Min-Seung Yoon 3 , Yong-Duk Lee 1 , Young-Chang Joo 3
1 School of Materials Science and Engineering, Andong National University, Andong Korea (the Republic of), 2 , STATSchipPAC R&D Center, Icheon Korea (the Republic of), 3 School of Materials Science and Engineering, Seoul National University, Seoul Korea (the Republic of)

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3:15 PM - V5.4
Geometrical Effect of Bump Resistance for Flip-Chip Solder Joints during Electromigration Test measured by Kelvin Probes.

Shih-Wei Liang 1 , Yun-Wei Chang 1 , Chih Chen 1
1 Materials Science & Engineering, National Chiao Tung University, Hsinchu Taiwan

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3:30 PM - V5.5
Kinetic Study of Grain Rotation of Tin Under Electromigration.

Albert TzuChia Wu 1 , Ming-Hsung Chen 1 , Cheng-Ping Huang 1 , C. Robert Kao 2
1 Materials and Mineral Resources Engineering, National Taipei University of Technology, Taipei City Taiwan, 2 Chemical and Materials Engineering, National Central University, Chungli City Taiwan

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3:45 PM -
BREAK

4:15 PM - V5.6
Electric Current Induced Brittle Failure of Lead and Lead-free Solder Joints with Electroless Ni-P Metallization.

Aditya Kumar 1 2 , Zhong Chen 1 , Chee Cheong Wong 1 , Subodh Gautam Mhaisalkar 1 , Kripesh Vaidhyanathan 2
1 School of Materials Science and Engineering, Nanyang Technological University, Singapore Singapore, 2 , Institute of Microelectronics, Singapore Singapore

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4:30 PM - V5.7
Evaluation of Void Formation Mechanism in Cu Thin Films; Separation of The Effect of Electron Wind Force and Stress

Yousuke Fujii 1 , Masanori Tsutsumi 2 , Junya Inoue 1 , Toshihiko Koseki 1
1 Materials Engneering, The University of Tokyo, Tokyo Japan, 2 , FUJITSU Co. Ltd. , Tokyo Japan

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4:45 PM - V5.8
Thermal Management in High-Density, Stacked-Die, Multi-chip Modules.

Thomas Marinis 1 , Darek Pryputniewicz 1 , Caroline Kondoleon 1 , Jason Haley 1
1 , Draper Laboratory, Cambridge, Massachusetts, United States

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5:00 PM - V5.9
Thermal Resistance of the Solder Joint in High Brightness Light Emitting Diode (HB LED) Packages.

Jin-Woo Park 1 , Young-Bok Yoon 1 , Sang-Hyun Shin 2 , Sang-Hyun Choi 2
1 Fundamental Technology Center, Samsung Electro-Mechanics, Suwon, Gyunggi-Do, Korea (the Republic of), 2 Packaging Technology Team, Samsung Electro-Mechanics, Suwon, Gyunggi-Do, Korea (the Republic of)

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5:15 PM - V5.10
Advanced Thermal Interface Materials

Yimin Zhang 1 , Daniel Duffy 1 , Jeff McVey 1 , Allison Xiao 1
1 Corporate Research, National Starch & Chemical, Bridgewater, New Jersey, United States

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2006-11-30   Show All Abstracts

Symposium Organizers

Vasudeva P. Atluri Intel Corporation
Sujit Sharan Intel Corporation
Ching-Ping Wong Georgia Institute of Technology
Darrel Frear Freescale Semiconductor
V6: Nanotechnology in Packaging
Session Chairs
Jin-Wook Jang
Ching-Ping Wong
Thursday AM, November 30, 2006
Room 301 (Hynes)

9:30 AM - **V6.1
Nanomaterials for Advanced Interconnection and Packaging.

Sungho Jin 1
1 Materials Science & Engineering, University of California, San Diego, La Jolla, California, United States

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10:00 AM - **V6.2
Shape Controlled Nanoparticles for Nanoelectronics.

Zhong Wang 1
1 School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia, United States

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10:30 AM - **V6.3
Opportunities and Challenges in the use of Nanotechnology & Nano-Materials.

Vijay Wakharkar 1 , Chris Matayabas 1
1 , Intel, Chandler, Arizona, United States

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11:00 AM -
BREAK

11:30 AM - **V6.4
Development of Smart Lead-free Solders via Shape-Memory Alloy Reinforcement.

Indranath Dutta 1 , Bhaskar Majumdar 2 , Tiandan Chen 1 , Koh Choon Chung 1
1 Mechanical & Astronautical Engineering, Naval Postgraduate School, Monterey, California, United States, 2 Dept of Materials Science & Engineering, New Mexico Institute of Mining & Technology, Socorro, New Mexico, United States

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12:00 PM - V6.5
Well-Aligned In-situ formed Open-end Carbon Nanotube for Device and Assembly Applications.

Lingbo Zhu 2 1 , ChingPing Wong 1
2 Chemical and Biomolecular Engr, Georgia Institute of Technology, Atlanta, Georgia, United States, 1 Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia, United States

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12:15 PM - V6.6
Effect of Single-walled Carbon Nanotube Purity on the Performance of Nanotube-based Composites for Thermal Management.

Aiping Yu 1 2 , Mikhail Itkis 1 2 , Elena Bekyarova 1 2 , Robert Haddon 1 2
1 , UC-Riverside, Riverside, California, United States, 2 , Center for Nanoscale Science and Engineering, Riverside, California, United States

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12:30 PM - V6.7
Examination of the Melting Point of Sn Nano-Particles for Nanosolder Applications

Kevin Grossklaus 1 , Carol Handwerker 1 , Eric Stach 1
1 Materials Science and Engineering, Purdue University, West Lafayette, Indiana, United States

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12:45 PM - V6.8
Water Diffusion and Fracture in Nano-porous Organosilicate Glass Coatings.

Youbo Lin 1 , Joost Vlassak 1
1 DEAS, Harvard University, Cambridge, Massachusetts, United States

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V7: Thin Films and Adhesives in Packaging
Session Chairs
Thursday PM, November 30, 2006
Room 301 (Hynes)

2:30 PM - V7.1
High Performance Conductive Adhesives for Lead-free Interconnects.

Yi Li 1 , ChingPing Wong 1
1 Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia, United States

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2:45 PM - V7.2
Impact of Die Attach Material Properties on Stress Evolution in Stacked Die Packages.

Rahul Manepalli 1 , Prasanna Raghavan 1 , Yi He 1 , Amram Eitan 1
1 Assembly Technology Development, Intel Corporation, Chandler, Arizona, United States

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3:00 PM - V7.3
Adhesion Measurement of Polymer-dielectric Interfaces using Laser Spallation.

Soma Kandula 1 , Cheryl Hartfield 2 , Nancy Sottos 3
1 Aerospace Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois, United States, 2 Semiconductor Packaging Development, Texas Instruments, Dallas, Texas, United States, 3 Theoretical and Applied Mechanics, University of Illinois at Urbana-Champaign, Urbana, Illinois, United States

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3:15 PM - V7.4
Rational Design of Highly Filled Polymers and Reactive Resins for Target Properties in Electronic Materials with Multiple Performance Constraints.

Daniel Duffy 1 , Allison Xiao 1
1 Corporate Research, National Starch & Chemical Company, Bridgewater, New Jersey, United States

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3:30 PM - V7.5
Orientation Fixing of Conductive NiP Hollow Microrods in Thermosetting Resins Under a Magnetic Field.

Hirokazu Oda 1 , Taichi Nagashima 2 , Shin-ichi Kawasaki 2 , Mitsuaki Yamada 2 , Tomokazu Iyoda 1 , Masaru Nakagawa 1
1 Chemical Resources Laboratory, Tokyo Institute of Technology, Yokohama Japan, 2 , Osaka Gas Co. Ltd., Osaka Japan

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3:45 PM -
BREAK

4:15 PM - V7.6
Impact of Environment and Mechanical Fatigue Effects on the Reliability of Silane-Modified Polymer/Silicon Interfaces

Bree Sharratt 1 , Reinhold Dauskardt 2
1 Aeronautics and Astronautics, Stanford University, Stanford, California, United States, 2 Materials Science and Engineering, Stanford University, Stanford, California, United States

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4:30 PM - V7.7
Parylene-PDMS Bilayer Coatings for Microelectronic and MEMS Packaging.

Hyungsuk Lee 1 , Junghyun Cho 1
1 Mechanical Engineering, SUNY Binghamton, Binghamton, New York, United States

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4:45 PM - V7.8
Preparation and Magnetic and Conductive Properties of Magnetic Conductive Au/NiP Hollow Microrods.

Hirokazu Oda 1 , Tomokazu Iyoda 1 , Masaru Nakagawa 1
1 Chemical Resources Laboratory, Tokyo Institute of Technology, Yokohama Japan

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5:00 PM - V7.9
Anisotropic Deposition of Electroplated Copper for Resistless Wiring Process

Toshio Haba 1 , Hiroshi Yoshida 1 , Haruo Akahoshi 1 , Akira Chinda 2
1 Department of Electronic Materials and Devices Research, Hitachi, Ltd. Materials Research Laboratory, Hitachi-shi, Ibaraki-ken, Japan, 2 , Hitachi Cable, Ltd., Hitachi-shi, Ibaraki-ken, Japan

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5:15 PM - V7.10
Surface Flatness and Interface Stability of Ni-P Film using New Electroless Plating Method with the Emulsion of Supercritical CO2

Hiroki Uchiyama 1 , Masato Sone 1 , Chiemi Ishiyama 1 , Yakichi Higo 1
1 Precision and Intelligence Laboratory, Tokyo Institute of Technology, Yokohama Japan

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5:30 PM - V7.11
The Effects of the Crystallinity and the Sintering Density of Ca-based Glass-ceramic on Bonding Strength Between Ceramic and Electrode.

Minji Ko 1 , SooHyun Lyoo 1 , EunTae Park 1 , HoSung Choo 1 , Yongseok Choi 1 , BeomJoon Cho 1 , HyoungHo Kim 1
1 , Samsung electro-mechanics, Suwon City, Gyeonggi Province Korea (the Republic of)

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5:45 PM - V7.12
Solvent-Less Flux Removal Using Atmospheric Plasma for Advanced Microelectronic Packaging Applications

Donovan Leonard 1 , Peter Yancey 2 , Michael Salmon 2
1 Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina, United States, 2 , Atmospheric Plasma Solutions, Cary, North Carolina, United States

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