Meetings & Events

Fall 2006 logo2006 MRS Fall Meeting & Exhibit

November 27 - December 1, 2006 | Boston
Meeting Chairs:
 Babu R. Chalamala, Louis J. Terminello, Helena Van Swygenhoven

 

Symposium W : Heterogeneous Integration of Materials for Passive Components and Smart Systems

2006-11-27   Show All Abstracts

Symposium Organizers

Juan C. Nino University of Florida
Fred Roozeboom NXP Research
Susan Trolier-McKinstry The Pennsylvania State University
Paul Muralt Swiss Federal Institute of Technology EPFL
David LaVan Yale University
W1: Packaging and Embedded Components
Session Chairs
Juan Nino
Monday AM, November 27, 2006
Room 303 (Hynes)

9:30 AM - **W1.1
Using Low-firing Microwave Ceramics in LTCC Type Components.

Danilo Suvorov 1 , C. Hoffmann 2
1 , Institute Jozef Stefan, Ljubljana Slovenia, 2 , EPCOS OHG, Deutschlandsberg Austria

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10:00 AM - W1.2
Reaction Mechanism of Chemically-Driven Zero Shrinkage LTCC

Yong Jun Seo 1 , Yong Soo Cho 1
1 Materials Science and Engineering, Yonsei University , Seoul Korea (the Republic of)

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10:15 AM - W1.3
Chemical Leaching Resistance of Glass-Based LTCC Systems.

Wonbae Lim 1 , Yong Soo Cho 1 , Jae Gwan Park 2
1 Department of Materials Science and Engineering, Yonsei University , Seoul, Seoul, Korea (the Republic of), 2 Materials Science and Technology Division, Korea Institute of Science and Technology, Seoul, Seoul, Korea (the Republic of)

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10:30 AM - W1.4
Investigation of Ultralow Loss Interconnection Technique for LTCC based System-in-Package(SIP) Technology at 60GHz.

Dong-Young Kim 1 , Jae Kyoung Mun 1 , Dong-Suk Jun 1 , Haechoen Kim 1
1 , ETRI, Daejeon Korea (the Republic of)

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10:45 AM -
BREAK

11:15 AM - **W1.5
Influence of Full-filled Polymer Molding on High-frequency Circuits.

Masayuki Fujimoto 1 , Kiyoshi Nakanishi 1
1 , Shizuoka University, Hamamatsu Japan

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11:45 AM - **W1.6
Thin Film Dielectrics for Embedded Applications.

Jon-Paul Maria 1 , Jon Ihlefeld 1 , Patrick Daniels 1 , William Borland 2
1 Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina, United States, 2 , Dupont Electronic Technologies, Research Triangle Park, North Carolina, United States

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12:15 PM - W1.7
Dielectric Properties of PCB Embedded bismuth-zinc-niobium Films Prepared using RF Magnetron Sputtering.

Seungeun Lee 1 , Jungwon Lee 1 , Yulkyo Chung 1
1 , Samsung Electromechanics, Suwon Korea (the Republic of)

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12:30 PM - **W1.8
Active Microelectronic Circuit Elements on Silicon, Ceramic and Polymer Substrates.

Angus Kingon 1 , Taeyun Kim 1 , Jon-Paul Maria 1 , Peter Lam 1 , Michael Steer 1 , Dan Lictenwalner 1
1 , North Carolina State University, Raleigh, North Carolina, United States

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W2/V1: Joint Session: System in Package
Session Chairs
Bill Chen
Fred Roozeboom
Monday PM, November 27, 2006
Room 206 (Hynes)

2:30 PM - **W2.1/V2.1
Silicon Based System-in-Package : Breakthroughs in Miniaturization and ”nano”-integration Supported by Very High Quality Passives and System Level Design Tools.

Franck Murray 1 , François LeCornec 1 , Serge Bardy 1 , Catherine Bunel 1 , Jan Verhoeven 2 , Erik van der Heuvel 2 , Johan Klootwijk 2 , Fred Roozeboom 2
1 , NXP Research, Caen France, 2 , Philips Research, Eindhoven Netherlands

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3:00 PM - **W2.2/V2.2
Process and Material Requirements for Successful Heterogonous Passive Component Integration in RF System.

Eric Beyne 1 , Walter De Raedt 1 , Geert Carchon 1 , Philippe Soussan 1
1 , IMEC, Leuven Belgium

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3:30 PM -
BREAK

4:30 PM - **W2.3/V2.3
Through Wafer Interconnects – a Technology not only for Medical Applications.

Gereon Vogtmeier 1 , Christian Drabe 3 , Ralf Dorscheid 2 , Roger Steadman 1 , Alexander Wolter 3
1 X-ray Imaging Systems, Philips Research Europe, Aachen Germany, 3 , Fraunhofer Institute Photonic Microsystems, Dresden Germany, 2 Engineering and Technology, Philips Research Europe, Aachen Germany

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5:00 PM - W2.4/V2.4
FsCSP Packaging Technology: Case Studies on Package Processability and Reliability Performance and its Dependence on Material Properties

Rahul Manepalli 1 , Chris Matayabas 1 , Eduardo Gacho 1
1 Assembly Technology Development, Intel Corporation, Chandler, Arizona, United States

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5:15 PM - W2.5/V2.5
The Flexible Physiological Monitor of Patch Type Package Based on Non-weave Material.

Wen-Yang Chang 1 2 , Hung-Hsin Tsai 1 , Ying-Chiang Hu 1
1 , Industrial Technology Research Institute, Tainan Taiwan, 2 Microsystems Technology Center, Industrial Technology Research Institute, Tainan Taiwan

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5:30 PM - W2.6/V2.6
An Approach for Characterizing Residual Mechanical Stress by Packaging Processes.

Soeren Hirsch 1
1 FEIT-IMOS, University of Magdeburg, Magdeburg Germany

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5:45 PM - W2.7/V2.7
Laser Printing Method for Manufacturing of Flexible Copper Electrodes and Interconnects

Nurdan Demirci Sankir 1 , Andrea Hill 1 , Jennifer Lalli 1 , Brad Davis 1 , Hang Ruan 1 , Richard Goff 2 , Richard Claus 3 4
1 , NanoSonic Inc., Blacksburg, Virginia, United States, 2 Department of Engineering Education, Virginia Tech, Blacksburg, Virginia, United States, 3 Department of Materials Science and Engineering, Virginia Tech, Blacksburg, Virginia, United States, 4 Department of Electrical and Computer Engineering, Virginia Tech, Blacksburg, Virginia, United States

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W3: Poster Session
Session Chairs
Monday PM, November 27, 2006
Exhibition Hall D (Hynes)

9:00 PM - W3.1
Ferrite Plating By Spin Spray Technique Without Using Any Strong Oxidizing Agents.

Subramani Ailoor Krishnan 1 , Matsushita Nobuhiro 1 , Watanabe Tomoaki 1 , Tada Masaru 2 , Abe Masanori 2 , Yoshimura Masahiro 1
1 Materials and Structures Laboratory, Tokyo Institute of Technology, Yokohama Japan, 2 Department of Physical Electronics, Tokyo Institute of Technology, Tokyo Japan

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9:00 PM - W3.10
Fabrication of SiN-assisted 0.12um AlGaAs/InGaAs PHEMT and 60GHz-bands MMICs for 60GHz WPAN system

Hokyun Ahn 1 , Jong-Won Lim 1 , Hong-Gu Ji 1 , Woo-Jin Chang 1 , Jae-Kyoung Mun 1 , Haecheon Kim 1
1 RF Circuit Group, Electronics and Telecommunications Research Institute, Daejeon Korea (the Republic of)

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9:00 PM - W3.11
Tailoring Bio-Inspired Magnetic Vesicles for Controlled Release.

Muhammet Toprak 1 , Brandon McKenna 1 , Herbert Waite 2 , Galen Stucky 1 3
1 Chemistry and Biochemistry, UCSB, Santa Barbara, California, United States, 2 Marine Science Institute and MCDB , UCSB, Santa Barbara, California, United States, 3 Materials, UCSB, Santa Barbara, California, United States

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9:00 PM - W3.12
A Charge Feedback Controller for a Piezoelectric Voltage Amplifier/Driver.

Maciej Noras 1 , Peter McAnn 1 , Jerzy Kieres 1
1 , Trek, Inc., Medina, New York, United States

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9:00 PM - W3.13
Ohmic Contacts on Single Crystal Si and SiC by Thermal Spray Technique

Sumit Taraphdar 1 , Juan Rojo 1 , Richard Gambino 1 , Sanjay Sampath 1
1 , Stony Brook University, Stony Brook, New York, United States

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9:00 PM - W3.14
Effect of Disorder in Zirconia Thin Films for High Energy Density Capacitors

Guneet Sethi 1 , Michael Lanagan 1 , Mark Horn 1
1 Engineering Science and Mechanics, Pennsylvania State University, University Park, Pennsylvania, United States

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9:00 PM - W3.15
Growth, Characterization and THz Applications of III-VI Semiconductor GaSe.

Krishna Mandal 1 , Michael Choi 1 , Sung Kang 1 , R. David Rauh 1
1 Materials Science Research Department, EIC Laboratories, Inc., Norwood, Massachusetts, United States

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9:00 PM - W3.2
Improved Microwave Dielectric Properties Of Alkaline Earth-Containing Lanthanum Borates.

Yeon Hwa Jo 1 , Yong Jun Seo 1 , Yong Soo Cho 1 , Dong Heon Kang 2
1 Materials Science & Engineering, Yonsei University, Seoul Korea (the Republic of), 2 Electronic Materials Engineering, The University of Suwon, Suwon Korea (the Republic of)

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9:00 PM - W3.3
High Performance Low Temperature Co-fired Ceramic Modules for 60 GHz WPAN Systems.

Jae Kyoung Mun 1 , Dong-Young Kim 1 , Woo-Jin Chang 1 , Jong-Won Lim 1 , Hokyun Ahn 1 , Hong Gu Ji 1 , Haecheon Kim 1
1 IT components & Material Research Division, ETRI, Daejeon Korea (the Republic of)

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9:00 PM - W3.4
Investigation of Millimeter-Wave Characteristics of Transmission Lines Manufactured using LTCC Technology.

Dong-Young Kim 1 , Jae Kyoung Mun 1 , Dong-Suk Jun 1 , Haechoen Kim 1
1 , ETRI, Daejeon Korea (the Republic of)

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9:00 PM - W3.5
Influences of Particle Size of Alumina Filler In An LTCC System.

Jinhyun Jeong 1 , Yong Jun Seo 1 , Yong Soo Cho 1 , Jun Chul Kim 2 , Nam Kee Kang 2
1 Department of Materials Science and Engineering, yonsei university, Seoul Korea (the Republic of), 2 , Korea Electronics Technology Institute, Seongnam Korea (the Republic of)

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9:00 PM - W3.6
Effects of Pb-content Interlayer on PZT Composite Thick Film.

Yu-Kuang Ko 1 , Chang Horng-Yi 1 , Cheng Syh-Yuh 1
1 Material and Chemical Research Laboratories, Industrial Technology Research Institute, Chutung Taiwan

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9:00 PM - W3.7
Strategies for the Integration of Ferroelectric Thin Films on Base-Metal Foils for High Voltage Embedded Passives.

David Kaufman 1 , Krishna Uprety 1 , Beihai Ma 1 , U. (Balu) Balachandran 1
1 , Argonne National Laboratory, Argonne, Illinois, United States

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9:00 PM - W3.8
Roles of Fluoride Additives In Pb-Free Thick Film Capacitors on CU Foils.

Dong Joo Shin 1 , Jong Won Lee 1 , Yong Soo Cho 1 , Jun Chul Kim 2 , Woo Sung Lee 2 , Nam Ki Kang 2
1 Department of Materials Science and Engineering, Yonsei University , Seoul Korea (the Republic of), 2 , Korea Electronics Technology Institute, Seongnam, Gyeonggi-do, Korea (the Republic of)

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9:00 PM - W3.9
γ-Irradiation Stimulated Change of Recycled Polypropylene Composites Dielectric Permittivity

Ulmas Gafurov 1
1 , Institute of Nuclear Physics, Tashkent Uzbekistan

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2006-11-28   Show All Abstracts

Symposium Organizers

Juan C. Nino University of Florida
Fred Roozeboom NXP Research
Susan Trolier-McKinstry The Pennsylvania State University
Paul Muralt Swiss Federal Institute of Technology EPFL
David LaVan Yale University
W4/T4: Joint Session: Capacitors
Session Chairs
Paul Muralt
Tuesday AM, November 28, 2006
Room 302 (Hynes)

9:30 AM - **W4.1/T4.1
An Engineering Perspective: Toward Temperature Insensitive Electric-Field Tunable Material and Devices.

Steven Tidrow 1 , Frank Crowne 1 , Arthur Tauber 1 , Daniel Potrepka 1 , Steven Weiss 1 , Bernie Rod 1
1 Sensors & Electron Devices Directorate, U.S. Army Research Laboratory, Adelphi, Maryland, United States

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10:00 AM - **W4.2/T4.2
Integrated BST Tunable Dielectrics for Frequency Agile GHz Applications.

Paul Clem 1 , Jennifer Sigman 1 , Patrick Finnegan 1 , Chris Nordquist 1
1 , Sandia National Laboratories, Albuquerque, New Mexico, United States

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10:30 AM - W4.3/T4.3
Fabrication of Frequency Agile Microwave Circuits Using (Ba,Sr)TiO3 Thin Film Capacitors

Jennifer Sigman 1 , Paul Clem 1 , Chris Nordquist 1 , Patrick Finnegan 1
1 , Sandia National Laboratories, Albuquerque, New Mexico, United States

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10:45 AM -
BREAK

11:15 AM - **W4.4/T4.4
BST Technology for RF/Microwave Applications.

Robert York 1
1 , University of California - Santa Barbara, Santa Barbara, California, United States

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11:45 AM - **W4.5/T4.5
Ferroelectric/electrode Interface: ab initio Description and Impact on the Film Properties.

Alexander Tagantsev 1 , Guido Gerra 1 , Nava Setter 1
1 IMX Ceramics Laboratory, Swiss Federal Institute of Technology (EPFL), Lausanne Switzerland

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12:15 PM - **W4.6/T4.6
Aerosol Deposition Method for Low Temperature Ceramic Fabrications.

Takaaki Tsurumi 1 , Jun Akedo 2
1 Graduate School of Science and Engineering, Tokyo Institute of Technology, Meguro, Tokyo, Japan, 2 Advanced Manufacturing Research Institute, National Institute of Advanced Industrial Science and Technology, Tsukuba, Ibaragi, Japan

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12:45 PM - W4.7/T4.7
Micro-contact Printed Thin Film Capacitors.

Song-Won Ko 1 , Hajime Nagata 1 , Eunki Hong 1 , Clive Randall 1 , Susan Trolier-McKinstry 1 , Pascal Pinceloup 2 , Mike Randall 2 , Aziz Tajuddin 2
1 Materials Science and Engineering, Penn State, University Park, Pennsylvania, United States, 2 , Kemet Electronics Corporation, Fountain Inn, South Carolina, United States

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W5: MEMS
Session Chairs
David LaVan
Tuesday PM, November 28, 2006
Room 303 (Hynes)

2:30 PM - W5.1
Studies on Curvature Deformation Control of Bilayer Cantilever Fabricated by Surface Micromachining of SOI Wafer

Huang Yu-Ming 1 , Masayuki Sohgawa 1 , Minoru Noda 1 , Kaoru Yamashita 1 , Masanori Okuyama 1 , Haruo Noma 2
1 Graduate School of Engineering Science, Osaka university , Toyonaka Japan, 2 Media Information Science Laboratories, ATR , Keihanna Science City Japan

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2:45 PM - W5.2
MEMS Capacitive Switch Fabrication using Photodefinable Mixed Metal Oxide Dielectrics

Michael Romeo 1 , Guoan Wang 2 , John Papapolymerou 2 , Clifford Henderson 1
1 School of Chemical & Biomolecular Engineering, Georgia Institute of Technology, Atlanta, Georgia, United States, 2 School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, Georgia, United States

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3:00 PM - **W5.3
Multi-domain and Multi-technology Integration for the Next Generation MNT Products.

Mark McNie 1 , Christopher Reeves 1 , Christopher Pickering 1 , Timothy Cox 1 , Tom Harvey 2 , Christian Bosshard 3 , Helmut Knapp 3
1 , QinetiQ Ltd., Malvern United Kingdom, 2 , Epigem Ltd., Redcar United Kingdom, 3 , CSEM, Alpnach Dorf Switzerland

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3:30 PM - W5.4
Metal Insulator Semiconductor Mesostructured Fibers.

Fabien Sorin 1 4 , Ayman Abouraddy 2 , Ofer Shapira 3 2 , Jeff Viens 1 2 4 , Nick Orf 1 4 , John Joannopoulos 2 5 , Yoel Fink 1 2 4
1 Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, United States, 4 Center for Materials Science and Engineering, Massachusetts Institue of Technology, Cambridge, Massachusetts, United States, 2 Research Laboratory of Electronics, Massachusetts Institue of Technology, Cambridge, Massachusetts, United States, 3 Electrical Engineering and Computer Science, Massachusetts Institue of Technology, Cambridge, Massachusetts, United States, 5 Department of Physics, Massachusetts Institue of Technology, Cambridge, Massachusetts, United States

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3:45 PM - W5.5
Single-Mode Polymer Optical Fiber Sensors for Large Strain Applications.

Sharon Kiesel 1 , Kara Peters 1 , Tasnim Hassan 2 , Mervyn Kowalsky 2
1 Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina, United States, 2 Department of Civil, Construction and Environmental Engineering, North Carolina State University, Raleigh, North Carolina, United States

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4:00 PM -
BREAK

4:30 PM - W5.6
BCB Based Packaging for Low Actuation Voltage RF MEMS Devices.

Robert Plana 1 , David Peyrou 1 , Fabienne Pennec 1 , Patrick Pons 1 , Karim Yacine 1
1 Micro and Nanosystem, LAAS-CNRS, Toulouse France

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4:45 PM - W5.7
Photodefinable Sacrificial Polycarbonate Materials & Methods for Microdevice Fabrication

Yueming Hua 1 , Clifford Henderson 1
1 School of Chemical & Biomolecular Engineering, Georgia Institute of Technology, Atlanta, Georgia, United States

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5:00 PM - **W5.8
Above-IC Bulk Acoustic Wave Technology for Wireless Applications.

Marc-Alexandre Dubois 1
1 RF & piezo components, CSEM, Neuchatel Switzerland

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5:30 PM - W5.9
Integration of PZT on SOI Wafers: Increasing Piezoelectric Film Thickness for Providing a Wide Range of Ultrasonic MEMS Applications.

Brahim Belgacem 1 , Florian Calame 1 , Paul Muralt 1
1 Ceramics Laboratory, EPFL, Lausanne Switzerland

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5:45 PM - W5.10
Science and Technology of Piezoelectric/Diamond Hybrid Heterostructures for High Performance MEMS/NEMS Devices

Sudarsan Srinivasan 1 , Jon Hiller 2 , Bernd Kabius 2 , Orlando Auciello 1 3
1 Materials Science Division, Argonne National Laboratory, Argonne, Illinois, United States, 2 Center for Electron Microscopy, Argonne National Laboratory, Argonne, Illinois, United States, 3 Center for Nanoscale Materials, Argonne National Laboratory, Argonne, Illinois, United States

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2006-11-29   Show All Abstracts

Symposium Organizers

Juan C. Nino University of Florida
Fred Roozeboom NXP Research
Susan Trolier-McKinstry The Pennsylvania State University
Paul Muralt Swiss Federal Institute of Technology EPFL
David LaVan Yale University
W6: Magnetic Components
Session Chairs
Susan Trolier-McKinstry
Wednesday AM, November 29, 2006
Room 303 (Hynes)

10:00 AM - **W6.1
Self-Assembled Nanostructures in Epitaxial Oxide Films

Igor Levin 1
1 , NIST, Gaithersburg, Maryland, United States

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10:30 AM - W6.2
Ferrite Plating By Spin Spray Technique Using Iron Dextran Complex.

Subramani Ailoor Krishnan 1 , Matsushita Nobuhiro 1 , Watanabe Tomoiki 1 , Tada Masaru 2 , Abe Masanori 2 , Yohimura Masahiro 1
1 Materials and Structures Laboratory, Tokyo Institute of Technology, Yokohama Japan, 2 Department of Physical Electronics, Tokyo Institute of Technology, Tokyo Japan

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10:45 AM - W6.3
Technological Study of Ni-Zn Ferrite Film on IC for Compatibility Improvement

Liang Zheng 1 , Huibin Qin 1 , Junming Xu 1 , Ji Hu 1 , Jian Liu 1
1 School of electronics and information, Hangzhou Dianzi university, Hangzhou, Zhejiang, China

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11:00 AM -
BREAK

11:30 AM - **W6.4
Power and Radio Frequency Inductors Using a Hybrid Ferrite-flex Foil Technology.

Martin Gijs 1
1 Inst of Microelectricons and Microsystems, Swiss Federal Institute of Technology Lausanne (EPFL), Lausanne Switzerland

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12:00 PM - W6.5
High Frequency Properties of Layered Ferromagnetic Thin Films for RF-applications in the GHz Range such as Toroidal Microinductors or Transformers.

Andreas Gerber 1 , Clemens Schmutz 1 , Eckhard Quandt 1
1 Smart Materials, Research Center caesar, Bonn Germany

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12:15 PM - W6.6
Towards the Integration of Barium Ferrite Sputtered Films for Coplanar Isolators and Circulators in the Millimeter Wave Range.

A.S. Dehlinger 1 2 3 , Martine Le Berre 2 , V. Larrey 1 , E. Benevent 1 3 , D. Vincent 3 , D. Givord 4 , J.J. Rousseau 3
1 , Radiall, Voiron France, 2 LPM, INSA Lyon, Villeurbanne France, 3 DIOM, Univ. J. Monnet, Saing-Etienne France, 4 LLN, CNRS, Grenoble France

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