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• X-Ray Diffraction Analysis and Modeling of Strain Induced Thermal Cycling in a Thin Aluminum (011) Bicrystal Film L1.2
  Authors: D.E. Nowak, O. Thomas, S.P. Baker, E.A. Stach, K. Balzuweit, and U. Dahmen


• Direction Dependent Grain-Interaction Models for the Diffraction Stress Analysis of Thin Films L1.3
  Authors: Udo Welzel, Matteo Leoni, and Eric J. Mittemeijer


• Plastic Relaxation in Thin Copper Films L1.6
  Authors: Jonathan B. Shu and Shefford P. Baker


• Microscopic Phenomenology of Plastic Deformation in Polymer-Metal Laminates L1.9
  Authors: W.P.Vellinga, R.Rastogi, and H.E.H.Meijer


• Residual Stress and Microstructure of Electroplated Cu Film on Different Barrier Layers L1.11
  Authors: Alex A. Volinsky, Meike Hauschildt, Joseph B. Vella, N.V. Edwards, Rich Gregory, and William W. Gerberich


• Fundamental Criteria for the Propagation of Telephone Cord Buckles Beneath DLC Films on Glass Substrates L2.4
  Authors: Myoung-Woon Moon, Kyang-Ryel Lee, Jin-Won Chung, and Kyu Hwan Oh


• MOCVD ZnS:Mn Films: Crystal Structure and Defect Microstructure as a Function of the Growth Parameters L2.5
  Authors: Kathleen A. Dunn, Katharine Dovidenko, Anna W. Topol, Gajendra S. Shekhawat, Robert E. Geer, and Alain E. Kaloyeros


• Relaxation of Grain Boundaries in Au {110} Mazed Bicrystal Thin Films Observed by HREM L2.6
  Authors: Tamara Radetic and Ulrich Dahmen


• A New Type of Dislocation Mechanism in Ultrathin Copper Films L2.7
  Authors: T. John Balk, Gerhard Dehm, and Eduard Arzt


• Texture of Sputtered Thin Copper Films on Amorphous SiO2 and Si3N4 Substrates L2.9
  Authors: Brando Okolo, Udo Welzel, Peter Lamparter, Thomas Wagner and Eric J. Mittemeijer


• Effects of Surface Constraints on Stresses in Heteroepitaxial Films Grown on Compliant Substrates L2.10
  Authors: Zhaohua Feng, Edward G. Lovell, Roxann L. Engelstad, and Thomas F. Kuech


• Adaptive Protocol for Robust Estimates of Coatings Properties by Nanoindentation L3.1
  Authors: Nigel M. Jennett and Andrew J.Bushby


• Postbuckled Square Thin Film Membranes Under Differential Pressure L3.4
  Authors: Torsten Kramer and Oliver Paul


• Nanoindentation and Nanowear Studies of Sputter-Deposited Ultrathin Tin Oxide Films on Glass Substrates L3.6
  Authors: J. G. Wang, M. E. Stahley, C. G. Pantano, D. H. Yang, T. Anderson, and L. Kuhn


• Stress Hysteresis and Mechanical Characterization of Plasma-Enhanced Chemical Vapor Deposited Dielectrics L3.9
  Authors: Jeremy Thurn, Robert F. Cook, Mallika Kamarajugadda, and Laura C. Stearns


• Effects of Pressure on the Vibrational, Structural and Electronic Properties of C60 Powder and Thin Films L3.10
  Authors: S. C. Sharma, B. Ha, J. H. Rhee, Y. Li, D. Singh, and R. Govinthasamy


• Structural Properties of Carbon Nitride Films Deposited by Reactive-Pulsed Laser Deposition Technique L3.11
  Authors: A.R.Phani, J.E.Krzanowski, and J.J.Nainaparampil


• Modification of Stress in CVD Tungsten Silicide (Polycide) Film By SiO2 Capping L3.12
  Authors: Joshua Pelleg and E. Elish


• Relaxation of a Strained Elastic Film on a Viscous Layer L3.14
  Authors: R. Huang, H. Yin, J. Liang, K. D. Hobart, J. C. Sturm, and Z. Suo


• Nanoindentation Analysis of Viscoelastic Thin Films: Strain Rate and Adhesion Effects L3.15
  Authors: Manuel Luis B. Palacio, Tracey Scherban, Brad Sun, Jessica Xu, and William W. Gerberich


• Bulge Test Characterization of Static Softening and Dynamic Instabilities in Foils of an Al-Based Alloy L3.18
  Authors: Miroslav Cieslar, Ayatollah Karimi, and Jean-Luc Martin


• Self-Formed Aluminum Nitride Microtubes That Exhibit a Large Bending Stress L3.23
  Authors: Morito Akiyama, Kazuhisa Shobu, Chao-Nan Xu, and Kazuhiro Nonaka


• Near-Edge X-ray Absorption Fine Structure of Hard Carbon Film Formed by Gas Cluster Ion Beam Assisted Deposition L3.25
  Authors: Kazuhiro Kanda, Yutaka Shimizugawa, Yuichi Haruyama, Isao Yamada, Shinji Matsui, Teruyuki Kitagawa, Mititaka Terasawa, Harushige Tsubakino, Tatsuo Gejo, and Masao Kamada


• Thin Film Characterization Using the Point-Deflection Method L3.27
  Authors: Ning Tang, Roxann L. Engelstad, and Edward G. Lovell


• Nanoindentation and Magneto-Optical Study of Oxidized Co Thin Films L3.28
  Authors: S. R. Mishra, J. Rho, G. Sherfy, M. Roy, and T. Buckner


• Strain Rate Dependent Behavior of Pure Aluminum and Copper Micro-Wires L4.2
  Authors: P. A. El-Deiry and R. P. Vinci


• A Method for Extracting Quantitative Data During In Situ TEM Nanoindentation L4.4
  Authors: A.M. Minor, E.T. Lilleodden, E.A. Stach, and J.W. Morris, Jr.


• Infrared Photoelastic Study of Thin-Film-Edge-Induced Stresses in Silicon Substrates L4.5
  Authors: H. J. Peng, S.P. Wong, and Shounan Zhao


• Nano-Creep Test for Anatase Polycrystalline Films L4.7
  Authors: Hironori Sugata, Shigeo Ohshio, and Hidetoshi Saitoh


• Accurate Determination of the Elastic properties of Near Surface Regions and Thin Films Using Nanoindentation and Acoustic Microscopy L4.8
  Authors: Matthew Bamber, Adrian Mann, and Brian Derby


• The Mechanical Properties of Electroplated Cu Thin Films Measured by Means of the Bulge Test Technique L4.9
  Authors: Yong Xiang, Xi Chen, and Joost J. Vlassak


• Mechanical Properties and Stresses in Thin Gold Films on a Silicon Substrate L5.2
  Authors: Changjin Xie, Richard D. Emery, Seung-Yong Yang, and Wei Tong


• Effect of Microstructure on Microhardness of AlN Thin Films L5.3
  Authors: Shuichi Miyabe, Masami Aono, Nobuaki Kitazawa, and Yoshihisa Watanabe


• Void Intergranual Motion Under the Action of Electromigration Forces in Thin Film Interconnects with Bamboo Structure L5.5
  Authors: Ersin Emre Oren and Tarik Omer Ogurtani


• Spherical Indentation Testing of Polymers at Various Temperatures L5.8
  Authors: Vincent D. Jardret, Pierre Morel, and Nicolas Conté


• Mechanics of Indium-Tin-Oxide Films on Polymer Substrates With Organic Buffer Layer L5.9
  Authors: Sung Kyu Park, Jeong In Han, and Won Keun Kim


• Tribological Behavior of Nanocomposite Diamondlike Carbon-Aluminum Films L5.10
  Authors: E. Liu, J.X. Gao, A.P. Zeng, B.K. Tay, and X. Shi


• Viscous Creep in Metallic Wires at Elevated Temperatures and Low Stresses L6.3
  Authors: Jaroslav Fiala, Lubos Kloc, and Vaclav Sklenicka


• A Study on the Behavior of Water Absorption of SiOF Thin Films Deposited by Electron Cyclotron Resonance Plasma Enhanced Chemical Vapor Deposition Method L6.4
  Authors: S. P. Kim, S. K. Choi, Youngsoo Park, and Ilsub Chung


• A New Force-Displacement Model for Continuous Indentation of Bilayer Materials L6.5
  Authors: A. Nayebi, R. El Abdi, G. Mauvoisin, and O. Bartier


• Constitutive Response of Passivated Copper Films: Experiments and Analyses L6.8
  Authors: Y.-L. Shen and U. Ramamurty


• Mechanical Behavior of Contact Aluminum Alloy L6.11
  Authors: David T. Read, Yi-Wen Cheng, J. David McColskey, and Robert R. Keller


• Residual Stress Measurement in a Pt-Aluminide Bond Coat L6.14
  Authors: Makoto Watanabe, Daniel R. Mumm, Stefanie Chiras, and Anthony G. Evans


• Mechanistic Understanding of the Stress-Induced Failure of Si3N4 Metal-Insulator-Metal Capacitors L6.15
  Authors: Dongwoo Suh, Bongki Mheen, Seung-Yun Lee, Kyu-Hwan Shim, and Jin-Yeong Kang


• An Analytical Model for Intrinsic Residual Stress Effect on Out-of-Plane Deflection in Chemical-Vapor-Deposited Free-Standing Thick Film L6.20
  Authors: Jeung-hyun Jeong, Young-Joon Baik, and Dongil Kwon


• Magnetoresistive, Mechanically Hard Superlattices of CrN, NbN, TiN Multilayers Deposited on Monocrystalline Si Wafers L6.21
  Authors: Andrzej Wolkenberg, Hanna Wrzesinska, Andrzej Bochenek, Adam Tokarz, Zygmunt Nitkiewicz,TomaszPrzeslawski, Jacek Ratajczak, and Piotr Dluzewski


• Gold/Niobium Thin Film Metallizations for GaAs Devices and Circuits L6.23
  Authors: Robert Esser and Aris Christou


• Effects of Various Passivation Dielectrics and Via Reservoir Lengths on Stress and Electromigration Reliability of Metal Interconnects L6.24
  Authors: Young-Bae Park, Young-Ah Cho, and Won-Gyu Lee


• Mechanical Properties and Porosity of Organo-silicate Glass (OSG) Low-k Dielectric Films L6.25
  Authors: J. B. Vella, Q. Xie, N. V. Edwards, J. Kulik, K. H. Junker


• Thin Film Fracture During Nanoindentation of Hard Film­Soft Substrate Systems L7.2
  Authors: M. Pang, K.D. Weaver, and D.F. Bahr


• The Effects of Copper on the Interfacial Failure of Gold Films
  N. R. Moody, D. P. Adams, M. J. Cordill, N. Yang, and D. F. Bahr


• Interfacial Adhesion of Cu to Self-Assembled Monolayers on SiO2 L7.7
  Authors: Guangchun Cui, M. Lane, K. Vijayamohanan, and G. Ramanath


• Nanoindentation Induced Fracture in Hard Multilayer Thin Films L7.8
  Authors: A. Karimi, D. Bethmont, and Y. Wang


• Metal Adhesion to <100> Si Substrates with Varying Surface Conditions L7.9
  Authors: Nicholas Barbosa III, Rodney S. Ridley, Sr., Christopher H. Strate, Robert S. Dwyer, Thomas Grebs, and Richard P. Vinci


• Effects of Film Thickness on the Yielding Behavior of Polycrystalline Gold Films L8.3
  Authors: H.D. Espinosa and B.C. Prorok


• Fracture Behavior of Micro-Sized Specimens Prepared From an Amorphous Alloy Thin Film at Ambient and Elevated Temperatures L8.4
  Authors: K. Takashima, R. Tarumi, and Y. Higo


• In Situ Mechanical Characterization of a Freestanding 100 Nanometer Thick Aluminum Film in SEM Using MEMS Sensors L8.7
  Authors: Aman Haque and Taher Saif


• Adsorption-Induced Failure Modes of Thin-Film Resonators L8.8
  Authors: R. Kazinczi, J.R. Mollinger, and A. Bossche


• Low Temperature Silicon Dioxide Thin Films Deposited Using Tetramethylsilane for Stress Control and Coverage Applications L8.9
  Authors: Xin Lin and Stephen J. Fonash


• The Design of Multilayered Polysilicon for MOEMS Applications L8.10
  Authors: D. Sherman, H. Kahn, S.M. Phillips, R. Ballarini, and A.H. Heuer


• Real-Time In Situ Imaging of the Delamination of Thin Ta Films on Si(100) Substrates Via a Synchrotron Radiation Technique L9.2
  Authors: B.L. French and J.C. Bilello


• Multiple Cracks of a Thin Film on a Ductile Substrate L9.3
  Authors: Ming-Hao Zhao, Ran Fu, and Tong-Yi Zhang


• Stress Development and Adhesion Behavior in Thin Ceramic Coatings Monitored by Positron Annihilation During Bending L9.4
  Authors: R.Escobar Galindo, A.van Veen, H.Schut, N.J.M.Carvalho, C.Strondl, and J. Th. M. de Hosson


• Wear and Adhesion Optimization of Thin TiAlN Films by Structure Design L9.5
  Authors: E. Lugscheider, O. Knotek, K. Bobzin, M. Beckers, C. Colmenares, A. Leyendecker, and G. Erkens


• The Role of Chemical Composition for the Ductility and Microstructure of Thin NiAl Films L9.6
  Authors: Patrick Wellner, Oliver Kraft and Eduard Arzt


• Plastic Deformation of Thin Films L10.2
  Authors: T. Nozaki, Y. Kogure, and Masao Doyama


• Stress-Strain Response of Free-Standing Nano-Crystalline Gold Thin-Films L10.8
  Authors: Sauri Gudlavalleti, Sharvan Kumar, and Lallit Anand


• Assessment of New Relation for the Elastic Compliance of a Film-Substrate System L10.10
  Authors: Andrei Rar, H. Song, and G.M. Pharr


• Analysis of Nucleation of Dislocation Loops from Stressed Surfaces Based on the Peierls-Nabarro Dislocation Model L11.1
  Authors: Guanshui Xu


• The Correlation of Indentation Size Effect Experiments With Pyramidal and Spherical Indenters L11.5
  Authors: J. G. Swadener, E. P. George, and G. M. Pharr


• Stressed States and Self-Organized Structuring of W/C Multilayers L12.2
  Authors: D.C. Meyer, A. Klingner, T. Leisegang, Th. Holz, R. Dietsch, and P. Paufler


• Highly Oriented NiTiCu Shape Memory Thin Films Grown by Molecular Beam Epitaxy L12.3
  Authors: R. Hassdorf, J. Feydt, R. Pascal, S. Thienhaus, M. Boese, T. Sterzl, B. Winzek, and M. Moske


• Depth Profile Of Structure, Strain, and Composition in an Annealed Al-Cu-Fe-Cr Quasicrystalline Film L12.4
  Authors: M.J. Daniels, D. King, J.S. Zabinski, Z.U. Rek, and J.C. Bilello


• Pressure Assisted Crystallization of MnAl Thin Films L13.5
  Authors: Gregory A. Fischer, M. Lea Rudee, Vitali F. Nesterenko, and Sastry Indrakanti


• Controlled Stress Refractory Metallizations L13.8
  Authors: Ilan Golecki and Margaret Eagan


• Thermal Stability of Self-Supported Metallic Multilayered Thin Films L13.9
  Authors: A. Misra, H. Kung, and R.G. Hoagland


• Coarse-Grained Molecular Dynamics: Dissipation due to Internal Modes T10.2
  Authors: T. Nozaki, Y. Kogure, and Masao Doyama