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• Developing Nanoscale Materials using Biomimetic Assembly Processes A1.1
  Authors: George D. Bachand, Susan B. Rivera, Andrew K. Boal, Joseph M. Bauer, Steven J. Koch, Ronald P. Manginell, Jun Liu, and Bruce C. Bunker


• Carbon Nanotube Modification Using BaF2 Vapor in Ultra-High Vacuum Environment A1.3
  Authors: Francisco Santiago, Victor H. Gehman Jr., Karen Long, and Kevin A. Boulais


• Tunneling Current-Distance Characteristic of Scanning Vibrating Probe/1-Alkanethiol Self-Assembled Monolayer (SAM)/Au (111) Structure A1.4
  Authors: Yuhsuke Yasutake, Yasuo Azuma, Kouhei Nagano, and Yutaka Majima


• Poly-SiGe: A Superb Material for MEMS A2.1
  Authors: Ann Witvrouw, Maria Gromova, Anshu Mehta, Sherif Sedky, Piet De Moor, Kris Baert, Chris van Hoof


• Fabrication of Micro- and Nanoscale SiC Structures Using Selective Deposition Processes A2.2
  Authors: L. Chen, X.A. Fu , C.A. Zorman, and M. Mehregany


• Optimization of Poly-SiGe Deposition Processes for Modular MEMS Integration A2.4
  Authors: Blake C.-Y. Lin, Tsu-Jae King, and Roger T. Howe


• Thin-Film Electrostatic Actuators on Flexible Plastic Substrates A2.5
  Authors: J. Gaspar, V. Chu, and J.P. Conde


• Scanning Probe Characterization of Localized pH Changes on a Sapphire Surface in the Presence of an Applied Field A3.1
  Authors: Joseph W. Bullard, Ryan J. Kershner, and Michael J. Cima


• Monolithic Three-Dimensional Integration of Micro-Fluidic Channels and Optical Waveguides in Fused Silica A3.2
  Authors: Yves Bellouard, Ali Said, Mark Dugan, and Philippe Bado


• Damage and Failure Mechanisms in High Pressure Silicon-Glass-Metal Microfluidic Connections A3.3
  Authors: Dong-Jin Shim, Hong-Wei Sun, Srikar T. Vengallatore, and S. Mark Spearing


• Nanostructured Materials for Microfluidic Sensing Application A3.4
  Authors: Nancy N. Kariuki, Laura Moussa, Tanya Menard, Asif Hassan, Li Han, Elizabeth Crew, Jin Luo, and Chuan-Jian Zhong


• Characterization of 0.5 MHz Silicon-Based Ultrasonic Nozzles Using Multiple Fourier Horns A3.5
  Authors: Shirley C. Tsai, Yu L. Song, Yuan F. Chou, Terry K. Tseng, W.J. Chen, J.H. Yang, J.W. Chen, and Chen S. Tsai


• A Scheme of Micromanipulation using a Liquid Bridge A3.6
  Authors: Kenichi J. Obata, Shigeki Saito, and Kunio Takahashi


• Characterization of Electrostatic Micromembrane Actuator Performance Using A Mass Probing Method A4.2
  Authors: Xingtao Wu, Jeremy Hui, Pat Kayatta, Dedeian Kenneth, Mariam Young, and Cardinal Warde


• Polymer Microvalve Based on Anisotropic Expansion of Polypyrrole A4.4
  Authors: Yevgeny Berdichevsky and Y.-H. Lo


• Self-Organized Criticality in Nanotribology A5.1
  Authors: Micha Adler, John Ferrante, Alan Schilowitz, Dalia Yablon, and Fredy Zypman


• Optimization of Mesoporous Silicon Microcavities for Proteomic Sensing A5.3
  Authors: L.A. DeLouise and B.L. Miller


• Thermal Effects in Plasma Treatment of Patterned PDMS for Bonding Stacked Channels A5.5
  Authors: Jin Zou and Peter Y. Wong


• Statistical Thermodynamics of Two-Dimensional Fluids of Solid Nanoparticles A5.6
  Authors: Liudmila A. Pozhar and John Maguire


• Single Osteoblast Chemical Sensor via Non-Invasive Bio-Electronic Interface A5.9
  Authors: Mo Yang, Xuan Zhang, Bonnie Kohr, Andre Morgan, and Cengiz S. Ozkan


• Ellipsometry Measurement Accuracy of Gate Oxides under Polysilicon A5.10
  Authors: Gary Jiang, Don Pelcher, Daewon Kwon, Jana Clerico, and George Collins


• Controlling the Position and Morphology of Nanotubes Within a Polymer Thin Film A5.11
  Authors: Emer Lahiff, Andrew I. Minett, Seamus Curran, Chang Y. Ryu, Werner J. Blau, and Pulickel M. Ajayan


• Fabrication of Micro-Contact Probe Using Mo-Cr Spring with Au Plating Bump A5.12
  Authors: Chinami Kaneshiro and Kohji Hohkawa


• Microwave Molecular Sieves Synthesis and Capillary Crystal Growth by Geometric Confinement A5.13
  Authors: Steven B. Ogunwumi, John F. Wight, and James C. Fajardo


• Micromechanical Characterization of GaSb by Microbeam Deflection and Using Nanoprobe and Finite Element Analysis A5.14
  Authors: M. Ospina, S.R. Vangala, D. Yang, J.A. Sherwood, C. Sung, and W.D. Goodhue


• 3D Small Angle X-ray Scattering (SAXS) on Deformed PVDF Foils A5.17
  Authors: Guenther Maier, Gernot Wallner, and Peter Fratzl


• Effects of Softbake Parameters on a Benzocyclobutene (BCB) Adhesive Wafer Bond A5.20
  Authors: Daniel N. Pascual


• Characterization of Mechanical Properties of Silicon Nitride Thin Films for Space Applications A5.21
  Authors: Wen-Hsien Chuang, Thomas Luger, Rainer K. Fettig, and Reza Ghodssi


• Polyurethane Nanofiber Webs for Sensor and Actuator Applications in Microelectromechanical Systems (MEMS) A5.29
  Authors: Mustafa M. Demir, Mansoor Naseer, Thomas F. Bechteler, Yasar Gurbuz, and Yusuf Z. Menceloglu


• Ceramic Microfabrication Techniques for Microdevices With Three-Dimensional Architecture A5.30
  Authors: Balakrishnan Nair, Merrill Wilson, Akash Akash, Joe Crandall, Charles Lewinsohn, Raymond Cutler, and Marc Flinders


• Localized, In-Situ Vacuum Measurements For MEMS Packaging A5.32
  Authors: Nicholas Moelders, James T. Daly, Anton C. Greenwald, Edward A. Johnson, Mark P. McNeal, Ramesh Patel, Martin U. Pralle, and Irina Puscasu


• Electromechanical Behavior in Micromachined Piezoelectric Membranes A5.33
  Authors: M.C. Robinson, J.C. Raupp, I. Demir, C.D. Richards, R.F. Richards, and D.F. Bahr


• Structural and Morphological Study of Zirconia and Titania Sol-Gel Monolayered Films Supported on Soda-Lime Glass Substrates A5.36
  Authors: Luisa F. Cueto, Enrique Sánchez, Leticia M. Torres-Martínez, Gustavo A. Hirata


• Dissipation Mechanisms in Thin-Film Silicon Microresonators on Glass Substrates A5.37
  Authors: J. Gaspar, V. Chu, and J.P. Conde


• Cavitation Erosion and Friction Behavior of Stainless Steel as a Function of Grain Size A5.38
  Authors: Giuseppe Bregliozzi, Syed Imad-Uddin Ahmed, Andrea Di Schino, Josè M. Kenny, and Henry Haefke


• Layer-by-Layer Engineered Microreactors for Bio-Polymerization of 4-(2-aminoethyl) Phenol Hydrochloride A5.43
  Authors: R. Ghan, T. Shutava, A. Patel, V. John, and Y. Lvov


• Effect of Polymer Substrates on Nano Scale Hot Embossing A5.50
  Authors: Jin-Hyung Lee, Hyun-Woo Lim , Jin-Goo Park, Eun-Kyu Lee, and Yangsun Kim


• Evaluation of Design and Performance of a Cryogenic MEMS Micropump Realized With Si-Based Diaphragm Using Combination of ZYGO/WYKO Interferometer and Raman Spectroscopy A5.52
  Authors: Yi Zhao, Daryl Ludlow, Biao Li, and Xin Zhang


• Adhesion Force and Nanotribological Characteristics of Chemical Vapor Deposited Fluorocarbon Films A5.55
  Authors: Nam-Kyun Kim, Tae-Gon Kim, Jin-Goo Park, Woon-Bae Kim, and Hyung- Jae Shin


• A Novel AFM Chip for Fountain Pen Nanolithography—Design and Microfabrication A5.56
  Authors: Keun-Ho Kim, Nicolaie Moldovan, Changhong Ke, and Horacio D. Espinosa


• Novel Electro-Optic Ceramic Materials for Microchip and High Power Lasers A5.57
  Authors: Xuesheng Chen, Kewen Li, Kevin Zou, Run Zhang, Hua Jiang, Gonul Ozen, and B. Di Bartolo


• 2D InP Etching Simulation Under High Density Plasma of Chlorine A5.62
  Authors: A. Rhallabi, B. Liu, G. Marcos, and J.P. Landesman


• Interface Adhesion and Reliability of Microsystem Packaging A5.64
  Authors: Marvin I. Francis, Kellen Wadach, Satyajit Walwadkar, and Junghyun Cho


• Pattern Formation in Directional Solidification A5.65
  Authors: Mike Greenwood, Mikko Haataja, and Nikolas Provatas


• Field Emission From The Carbon Nanotubes Grown Over Cylindrical Surface A5.66
  Authors: D. Sarangi and A. Karimi


• Electrical Characterization of BCB for Electrostatic Microelectromechanical Devices A5.69
  Authors: Alireza Modafe, Nima Ghalichechian, Benjamin Kleber, and Reza Ghodssi


• Measurement of Shape and Deformation of MEMS at the Wafer Level A5.72
  Authors: Cosme Furlong, Curtis F. Ferguson, Michael J. Melson, and Ryszard J. Pryputniewicz


• Evolution of Mesas on Si(111) Surface Under Sublimation: Nanofabrication Through the Control of Atomic Steps A5.75
  Authors: Kee-Chul Chang and Jack M. Blakely


• Application of FIB/SEM and TEM to Bit Failure Analyses in SRAM Arrays A5.77
  Authors: Wentao Qin, Alex Volinsky, Larry Rice, Lorraine Johnston, and David Theodore


• Study of High Aspect Ratio Etching in Silicon by a Mixture of SF₆/O₂ Using a 2-D Model Based on a Monte Carlo Approach A5.78
  Authors: G. Marcos, A. Rhallabi, and P. Ranson


• Advanced Anodic Bonding Processes for MEMS Applications A5.80
  Authors: V. Dragoi, P. Lindner, T. Glinsner, M. Wimplinger, and S. Farrens


• Mechanical Characterizations of Laser Microwelds for MEMS Packaging A5.82
  Authors: Wei Han and Ryszard J. Pryputniewicz


• Formation of a Ba-Te Surface on GaAs A5.84
  Authors: Kevin A. Boulais, Francisco Santiago, Karen J. Long, and Victor H. Gehman


• Study of the Pull-In Voltage for MEMS Parallel Plate Capacitor Actuators A5.86
  Authors: Emmanuel Saucedo-Flores, Rubén Ruelas, Martín Flores, and Jung-Chih Chiao


• Resist Poisoning-Free Advanced PECVD-Based Anti-Reflective Coating (ARC) for 90 nm Technology and Beyond A5.91
  Authors: Sang H. Ahn, Sudha Rathi, Jean Liu, Heraldo Botelho, Wendy Yeh, Martin Seamons, Derek Witty, and Hichem M'Saad


• Thermophysical Properties of Ni Films for LIGA Microsystems A6.2
  Authors: Diana-Andra Borca-Tasciuc, Rajesh Nimbalkar, Gang Chen, Samuel Graham, and Theodorian Borca-Tasciuc


• Mechanical Properties of Metallic Thin Films: Tensile Tests vs Indentation Tests A6.3
  Authors: Nian Zhang, Changjin Xie, and Wei Tong


• Electrical Porous Silicon Microarray for DNA Hybridization Detection A7.2
  Authors: Marie Archer, Marc Christophersen, Philippe M. Fauchet, Deoram Persaud, and Karl D. Hirschman


• Potentiometric Detection of DNA Molecules Hybridization Using Gene Field Effect Transistor and Intercalator A7.6
  Authors: Toshiya Sakata, Hidenori Otsuka, and Yuji Miyahara


• Control of Stress in a Metal–Nitride–Metal Sandwich for CMOS-Compatible Surface Micromachining A8.5
  Authors: Rhodri R. Davies, David J. Combes, Mark E. McNie, and Kevin M. Brunson


• Microfrictional Properties of Titanium Carbide A8.6
  Authors: Syed Imad-Uddin Ahmed, Giuseppe Bregliozzi, and Henry Haefke


• Ferroelectric Lead Zirconate Titanate and Barium Titanate Nanoshell Tubes A9.4
  Authors: Yun Luo, Izabela Szafraniak, Valanoor Nagarajan, Ralf B. Wehrspohn, Martin Steinhart, Joachim H. Wendorff, Nicolai D. Zakharov, Ramamoorthy Ramesh, and Marin Alexe


• Gas Adsorption Evidence of Single-Wall and Multi-Wall Carbon Nanotube Opening A9.5
  Authors: Moulay-Rachid Babaa, Edward McRae, Nicole Dupont-Pavlovsky, Sandrine Delpeux, Francois Beguin, Fabrice Valsaque, and Jaafar Ghanbaja


• Characterization and Modeling of Wafer and Die Level Uniformity in Deep Reactive Ion Etching (DRIE) A10.2
  Authors: Hongwei Sun, Tyrone Hill, Martin Schmidt, and Duane Boning


• Non-Impact Electrostatic Micromanipulation by Voltage Sequence for Timeostatic micromanipulation by voltage sequence for time A10.5
  Authors: Shigeki Saito, Kunio Takahashi, and Masataka Urago


• Evaluating the Mechanical Properties of MEMS by Combining the Resonance Frequency and Microtensile Methods A10.6
  Authors: Dongil Son, Jong-jin Kim, Dong Won Kim, Tae Won Lim, and Dongil Kwon


• Direct Writing of 3D Microstructures Using a Scanning Laser System A11.5
  Authors: Hui Yu, Alexander Grüntzig, Yi Zhao, André Sharon, Biao Li, and Xin Zhang


• Measurement of Work of Adhesion on Wafers for Direct Bonding A12.4
  Authors: Kevin T. Turner and S. Mark Spearing


• Semiconductor Surface–Molecule Interactions: A Case Study in the Wet Etching of InP by α-Hydroxy Acids A13.5
  Authors: Prabhakar Bandaru