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  • 2012 MRS Spring Meeting & Exhibit
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      • Symposium A: Amorphous and Polycrystalline Thin-Film Silicon Science and Technology
      • Symposium B: Heterogeneous Integration Challenges of MEMS, Sensor and CMOS LSI
      • Symposium C: Interconnect Challenges for CMOS Technology -- Materials, Processes, and Reliability for Downscaling, Packaging, and 3D Stacking
      • Symposium D: Nanocontacts -- Emerging Materials and Processing for Ohmicity and Rectification
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Symposium C: Interconnect Challenges for CMOS Technology -- Materials, Processes, and Reliability for Downscaling, Packaging, and 3D Stacking

• 2012 MRS Spring Meeting & Exhibit

• April 9 - April 13, 2012
• Moscone West Convention Center | Marriott Marquis - San Francisco, California-
• Meeting Chairs: Lara A. Estroff, Jun Liu, Kornelius Nielsch, Kazumi Wada

Interconnect Challenges for CMOS Technology -- Materials, Processes, and Reliability for Downscaling, Packaging, and 3D Stacking

The ever-growing complexity of each new technology node in the semiconductor industry offers tremendous innovation opportunities for material scientists.  For advanced interconnects, new materials and processes are required to maintain excellent device performances and structure reliability.  Regarding the latter, mechanical integrity is a topic of great concern as chip-packaging interaction failures are not yet fully understood; and this issue implies knowledge on both Si technology and assembly sides.  Finally, the development of complex 3D architectures comes with a new set of material challenges to relieve stresses and thermal issues.

The principal focus of this symposium is to discuss the latest advances in low- and ultralow-k materials, metallization, chip-packaging integration, reliability, 3D stacking, and emerging technologies.

Session topics will include (but will not be limited to):

• Low- and ultralow-dielectric materials
  - New spin-on and PECVD precursors
  - Porogens, porosity characterization, and pore sealing
  - Ultralow-k mechanical properties
  - Modeling 
• Metallization for advanced interconnects and integration
  - Advances in CVD, PVD, ALD, electrochemical and electroless deposition
  - Advances in liner; Cu seed and fill technologies
  - Electromigration, TDDB, and stress voiding
  - Ultralow-k damage and repair
  - RIE, plasma processing, planarization, and cleaning technologies
  - Novel integration concepts 
• Chip-packaging interaction and reliability
  - Failure mechanisms
  - Testing and modeling methods
  - Materials and approaches for risk mitigation 
• 2.5D and 3D stacking
  - Manufacturing challenges
  - Thermomechanical management
  - Reliability 

Invited speakers include:

Paul Besser (GLOBALFOUNDRIES), Thierry Chevolleau (CNRS/LTM, France), Roy Gordon (Harvard Univ.), Dimitri Kioussis (GLOBALFOUNDRIES), Pol Marchal (IMEC, Belgium), Bahgat Sammakia (SUNY, Binghamton), Thomas Shaw (IBM T. J. Watson Research Ctr.), Willi Volksen (IBM Almaden Research Ctr.), Ehrenfried Zschech (Fraunhofer Inst. for Nondestructive Testing, Germany).

Symposium Organizers

Geraud Dubois
IBM Almaden Research Center
K17/E1
650 Harry Rd.
San Jose, CA 95120
Tel 408-927-1584, Fax 408-927-3310
gdubois@us.ibm.com 

Francesca Iacopi
Griffith University
Queensland Micro and Nanotechnology Centre
Nathan Campus, N74
4111 Nathan, QLD, Australia
Tel 61-7-373-58014
f.iacopi@griffith.edu.au

Atsuko Sekiguchi
National Institute of Advanced Industrial Science and Technology
Central 5
1-1-1 Higashi, Tsukuba, Ibaraki 305-8565, Japan
Tel 81-29-861-4654, Fax 81-29-861-4851
atsuko-sekiguchi@aist.go.jp 

Sean W. King
Intel Corporation
Portland Technology Development
MS RA3/301
5200 NE Elam Young Pkwy.
Hillsboro, OR 97124
Tel 503-613-7547, Fax 503-613-8964
sean.king@intel.com 

Christian Dussarat
Air Liquide, Delaware Research and Technology Center
200 GBC Dr.
Newark, DE 19702
Tel 302-229-5891, Fax 302-286-5583
christian.dussarrat@airliquide.com