Symposium K: Advanced Materials and Processes for “Systems-on-Plastic”

2012 MRS Spring Meeting logo

Advanced Materials and Processes for “Systems-on-Plastic”

JSAP logo This symposium is co-sponsored by the Japan Society of Applied Physics  

“Systems-on-plastic” is an emerging concept that targets to integrate multiple devices and multiple functions on plastic films.  This concept is expected to open up the possibility of many new applications ranging from ubiquitous electronic displays; flexible electronic systems; and large-area, wearable electronics for healthcare, medical, and implantable electronics.  One of the most difficult hurdles in the development of system-on-plastic technologies is to achieve the compatibility that is necessary at all levels of the hierarchy, like in a living body.  In addition to matched device performance with consistent current and voltage levels, processes and materials compatibility should be achieved simultaneously.  This symposium aims to gather and evaluate the materials, designs, modeling, and technologies that will enable “systems-on-plastic,” and review specific applications that will directly benefit from integrated multiple electronic active devices such as transistors, photonic devices, solar cells, batteries, displays, soft actuators, and biosensors.  The symposium will mainly include the integration of multiple devices and/or multiple functions on plastic substrates; however, discrete devices and/or devices on rigid substrates will be also considered as topics.  The possibility of integration from the context of “sytems-on-plastic“ will be discussed.

Session topics will include:

  • Synthesis of emerging organic, polymeric materials, characterization, and analysis
  • Electrically functional inks for printed electronics
  • Nanowires, nanoparticle, and nanosheets
  • Biomolecular and biological materials, and DNA
  • Ionic liquids, conducting gels, and nanocomposites
  • Spectroscopy and microscopy of surfaces and interfaces
  • Fabrication and processes, high-throughput micro- and nanopattering
  • Large-area printing and coating
  • Soft lithography and wet nanotechnology for functional nanostructures
  • Self assembly of (bio)molecules and biomimetic process
  • Integrated systems for molecular- and bioelectronics
  • Flexible TFTs, integrated circuits, memory, imagers, photovoltaic cells, and OLED
  • Biomedical and biosensors
  • Transducers: flexible microsensors and MEMS; wearable electronics, e-textile, e-skin, and actuators
  • Power: flexible batteries, interconnect, and packaging issues

Invited speakers include:

Zhenan Bao (Stanford Univ.), Dago M. de Leeuw (Phillips Research Labs, Netherlands), Stephen Forrest (Univ. of Michigan), Richard Friend (Univ. of Cambridge, United Kingdom), Martin Heeneyl (Imperial College London, United Kingdom), Paul Heremans (IMEC, Belgium), Olle Inganas (Linköping Univ., Sweden), Jin Jang (Kyung Hee Univ., S. Korea), Ali Javey (Univ. of California, Berkeley), Kazuhiro Kudo (Chiba Univ., Japan), George Malliaras (ENSM-SE, France), Kazumasa Nomoto (Sony, Japan), Beng Ong (Nanyang Technological Univ., Singapore), John Rogers (Univ. of Illinois, Urbana-Champaign), Alberto Salleo (Stanford Univ.), Dan Steingart (City College of New York), Ichiro Yamashita (Panasonic, Japan).

Symposium Organizers


Takao Someya
The University of Tokyo
School of Engineering
Dept. of Electric and Electronic Engineering
7-3-1 Hongo, Bunkyo-ku
Tokyo 113-8656, Japan
Tel 81-3-5841-0411, Fax 81-3-5841-6709
someya@ee.t.u-tokyo.ac.jp 

Ana Claudia Arias
University of California, Berkeley
Dept. of Electrical Engineering and Computer Sciences
508 Cory Hall
Berkeley, CA 94720
Tel 510-642-1728
acarias@eecs.berkeley.edu 

Iain McCulloch
Imperial College London
Dept. of Chemistry
S. Kensington Campus
London SW7 2AZ, United Kingdom
Tel 44-20-7594-5669
i.mcculloch@imperial.ac.uk 

Taishi Takenobu
Waseda University
Dept. of Applied Physics
Okubo 3-4-1, Shinjuku-ku
Tokyo 169-8555, Japan
Tel/Fax 81-3-5286-2981
takenobu@waseda.jp 

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