Symposium M: Optical Interconnects -- Materials, Performance, and Applications

Optical Interconnects -- Materials, Performance, and Applications

This symposium is intended to bring together materials scientists, as well as optical, mechanical, and reliability engineers to address and discuss state-of-the-art and challenges in the optical- interconnect-materials-science (OIMS) field, considering all the aspects of various types of optical interconnect design, fabrication, performance, and  applications.  Abstracts are sought on the physical, chemical, mechanical, electrical, and optical properties of interconnect materials and optical interfaces that are important to the manufacturability, performance, and reliability of optical interconnect systems.

Session topics will include (but will not be limited to) the following major areas:

  • Optical interconnect materials: optical and mechanical behavior and performance
  • Bare and coated optical fiber interconnects subjected to thermal and/or mechanical loading:
    physical optical design for reliability
  • Photonic crystal fiber (PCF) interconnects
  • On-chip interconnects
  • Photonic interfaces
  • Board-to-board and chip-to-chip interconnects
  • Interconnects in micro-optic systems and integrated micro-optics
  • Planar light guides
  • 3D optical signal routing on planar PC assemblies
  • Advanced photonic packaging materials
  • Interconnects in hybrid electro-optical printed circuit assemblies
  • Organic optical waveguides; micro-optic components and devices
  • Polymers for integrated optics and interconnects
  • Organic optical interconnects for harsh environmental applications
  • Flexible optical interconnects
  • High-density optical interconnects
  • Free-space optical interconnections
  • Adhesives in optical interconnect technologies and their performance
  • Optical nonlinearities: utilization, characterization, causes, use for detection, signal processing, modulation of light signal at very rapid signal rates, etc.
  • Optical materials nonlinearities (including those leading to degradation of useful optical properties at high light amplitudes)

Invited speakers (partial list) include:

Philippe Absil (IMEC, Belgium): Silicon Photonics Technology; Slavisa Aleksic (Technical Univ., Vienna, Austria): Large-scale Intrasystem Optical Interconnects; Solomon Assefa (IBM T.J. Watson Research Ctr.): Silicon Nanophotonics Integration with CMOS; Mark Brongersma (Stanford Univ.): Nano-photonics and Plasmonics; Ray Chen (Univ. of Texas, Austin): Opto-electronic Interconnects; Doug Coleman (Corning, Inc.): State-of-the-Art and Challenges in Optical Interconnect Technologies; Jack Cunningham (Sun Microsystems): Next Generations of Optical Interconnects; Alexey Glebov (Optigrate): Micro-optic Interconnects; Claire Gu (Univ. of California, Santa Cruz): Nanophotonic Interconnects; Tetsuo Sato (Nissan Chemical, Japan): Optical Interconnect Materials; Jurgen Stampfl (Vienna Univ. of Technology, Austria): Photopolymer-based Interconnects for Biomedical Applications; Sönke Steenhusen (Fraunhofer ISC, Germany): Optical Inter-connects by 3D Lithography; Hiren Thacker (Oracle, San Diego): Nanophotonic Intercon-nects and Optical Interconnects on Chip; Peter van Daele (IMEC, Belgium): Interconnects in Flexible Optics.

Symposium Organizers

Ephraim Suhir
University of California
Baskin School of Engineering
Dept. of Electrical Engineering
1156 High St.
Santa Cruz, CA 95064
Tel 650-969-1530, Fax 650-968-4611
suhire@aol.com 

David Read
National Institute of Standards and Technology
MS 853.05
325 Broadway
Boulder, CO 80305
Tel 303-497-3853, Fax 303-497-5030
read@boulder.nist.gov 

Ruth Houbertz
Fraunhofer ISC
Neunerplatz 2
97082 Wurzburg, Germany
Tel 49-931-4100-520, Fax 49-931-4100-559
ruth.houbertz@isc.fraunhofer.de 

Allen M. Earman
Intersil Corporation
1001 Murphy Ranch Rd.
Milpitas, CA 95035
Tel 408-546-3525
aearman@ieee.org 

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