Symposium T: Electrical Contacts to Nanomaterials and Nanodevices

Electrical Contacts to Nanomaterials and Nanodevices

The rapid advances in synthesis and fabrication of nanostructures have fueled tremendous growth in the areas of nanoscience and nano-engineering. Nanostructures such as carbon nanotubes, nanowires, and graphene are being intensively explored for future electronic, photonic, and energy storage applications. In order for these systems to progress from the research laboratory to technology, it is critical to precisely understand and control our ability to inject charge at electrical contacts to nanomaterials. In parallel, because of the continued shrinking of semiconductor device dimensions, incorporation of novel materials, integration of new geometries, and demand for ultralow-resistance source/drain contacts in next-generation device applications, the underlying physics of contact formation and carrier transport must be re-examined.

This symposium will focus on challenges and strategies for fabricating ohmic and rectifying contacts relevant to emerging nanomaterials as well as advanced semiconductor technology; the underlying physics of contact formation and charge injection into nano- and molecular-scale devices; novel techniques for contact characterization; contact reliability; and contact issues for large-scale nanostructure integration into nontraditional, low-cost, and flexible device applications.

Session topics will include

  • Contacts to nanotubes, nanowires, quantum dots, and graphene
  • Electrical contacts in molecular electronics
  • Metal/semiconductor contact formation at the nanoscale
  • Contacts for next-generation semiconductor devices
  • Nanocontacts and transport at the organic-inorganic interfaces
  • Contacts for spintronics
  • Contacts to nanomaterials in energy conversion/storage
  • Transparent contacts based on nanostructures
  • New approaches for nanoscale contact characterization

Joint sessions with Symposia P: Graphene and Related Carbon Nanomaterials, and AA: Advanced Interconnects for Micro- and Nanoelectronics–Materials, Processes, and Reliability, are being considered.

Invited Speakers Include:

Aaron Franklin (IBM T. J. Watson Research Ctr.), Michael Garner (Garner Nanotechnology Solutions), Ali Javey (Univ. of California, Berkeley), George Kirczenow (Simon Fraser Univ.), Ahmet Ozcan (IBM T. J. Watson Research Ctr.), Alec Talin (National Inst. of Standards and Technology), Kang Wang (Univ. of California, Los Angeles).

Symposium Organizers

François Léonard
Sandia National Laboratories
MS 9161, 7011 East Ave., Livermore, CA 94551
Tel 925-294-3511, fleonar@sandia.gov

Christian Lavoie
IBM T. J. Watson Research Center
1101 Kitchawan Rd., Yorktown Heights, NY 10598
Tel 914-945-2180, clavoie@us.ibm.com

Yu Huang
University of California, Los Angeles
Dept. of Materials Science and Engineering
Los Angeles, CA 90095-1595
Tel 310-794-9589, yhuang@seas.ucla.edu

Karen Kavanagh
Simon Fraser University
Dept. of Physics
Burnaby, BC, V5A 1S6, Canada
Tel 778-782-4244, kavanagh@sfu.ca 

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