
| L. Jay Guo | University of Michigan | |
| Ghassan E. Jabbour | Arizona State University | |
| Arokia Nathan | University of Waterloo | |
| John A. Rogers | University of Illinois, Urbana-Champaign | |
| James W. Stasiak | Hewlett Packard Company |
8:00 AM *M1.1
6 nm Half-Pitch Nanoimprint Lithography and Applications in SRAMs, OTFTs, and Biochips. Stephen Chou1, Michael D. Austin1, Nihua Li1, Xiaogang Liang1, Haixiong Ge1,2, Zenli Fu1, Keith Morton1, Hua Tan2, Wei Zhang2 and Linshu Kong2; 1Department of Electrical Engineering, Princeton University, Princeton, New Jersey; 2Nanonex Corporation, Monmouth Junction, New Jersey.
8:30 AM *M1.2
The Use of Nanoimprint Lithography for Creation of Biomaterial Surfaces and Structures. Lars Montelius1, Patrick Carlberg1, Richard Bunk1, Mark Sundberg2, Jenny Rosengren2, Ian Nicholls2, Sven Tagerud2, Alf Mansson2, Waldemar Hallstroem1,3, Christelle Prinz1, Fredrik Johansson3,1 and Martin Kanje3; 1Physics Department, University of Lund, Lund, Sweden; 2Chemistry and Biomedical Sciences, University of Kalmar, Kalmar, Sweden; 3Cell and Organism Biology, University of Lund, Lund, Sweden.
9:00 AM M1.3
Hot Embossing as a Dry Transfer Printing Process for Flexible Electronic Devices. Ashante' C. Allen, Erik Sunden, Andrew Cannon, William King and Samuel Graham; Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia.
9:15 AM M1.4
Chemical Nanopatterning via Nanoimprint Lithography for Liquid Crystal Displays Sunggook Park1, Helmut Schift2, Celestino Padeste2, Jens Gobrecht2, Toralf Scharf3, Joachim Grupp4 and Naci Basturk4; 1Mechanical Engineering, Louisiana State University, Baton Rouge, Louisiana; 2Laboratory for Micro- and Nanotechnology, Paul Scherrer Institut, Villigen PSI, Switzerland; 3Institute for Microtechnology, Neuchatel, Switzerland; 4ASULAB, Marin, Switzerland.
9:30 AM *M1.5
Spin-on UV and Thermal-Curable Siloxane Liquid Resist for Nanoimprint Application. Peng-Fei Fu1, Xing Cheng2, Carlos Pina-Hernandezb2, Wayne Fung2 and L. Jay Guo2; 1Dow Corning Corporation, Midland, Michigan; 2Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, Michigan.
10:00 AM BREAK
10:30 AM *M1.6
Nanoimprint lithography for 3D nanopatterning Clivia M. Sotomayor Torres, Marc Zelsmann, Nikolaos Kehagias and Claus Jeppessen; Tyndall National Institue, University College Cork, Cork, Ireland.
11:00 AM *M1.7
High aspect ratio pattern fabrication by nanoimprint and nano casting lithography Yoshihiko Hirai, Physics and Electronics Eng., Osaka Pref.Univ., Sakai, Japan.
11:30 AM M1.8
Directly Patternable Dielectric Materials for Step and Flash Imprint Lithography. Frank L. Palmieri1, Jianjun Hao1, Yukio Nishimura1, Colm Flannery2, Michael D. Stewart1,3, Andrew S. Chan1, Bin Li1, Soo Young1, Brook Chao1 and C. Grant Willson1; 1Chemical Engineering, University of Texas at Austin, Austin, Texas; 2Materials Reliability Division, NIST, Boulder, Colorado; 3Molecular Imprints, Inc., Austin, Texas.
11:45 AM M1.9
Simulations for Process Design of Nanoembossing and Atomic Force Microscope Thermomechanical Nanoindentation Harry Dwight Rowland1, William P. King1, Amy C. Sun2 and P. Randy Schunk2; 1Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia; 2Multiphase Transport Processes, Sandia National Laboratories, Albuquerque, New Mexico.
1:30 PM *M2.1
Building with Macromolecules on Surfaces with Nanometer Precision Ashutosh Chilkoti, Duke University, Durham, North Carolina.
2:00 PM *M2.2
Patterning of Single DNA Molecules on Polymer Surface for Medical and Electronic Applications. Jingjiao Guan1 and L. James Lee1,2; 1Center for Affordable Nanoengineering of Polymer Biomedical Devices, The Ohio State University, Columbus, Ohio; 2Chemical and Biomolecular Engineering, The Ohio State University, Columbus, Ohio.
2:30 PM BREAK
3:30 PM *M2.3
Light-Directed Synthesis of DNA Molecules. Franco Cerrina, Electrical & Computer Engineering, University of Wisconsin, Madison, Wisconsin.
4:00 PM M2.4
Fabrication of Patterned Apatite by Electrophoretic Deposition Seiji Yamaguchi, Takeshi Yabutsuka, Mitsuhiro Hibino and Takeshi Yao; Graduate School of Energy Science, Kyoto University, Kyoto City, Japan.
4:15 PM M2.5
Biphase Ceramic Lattices for Bone Repair. Hongyi Yang1, Julian R. G. Evans1, Shoufeng Yang1, Xiaopeng Chi1, Ian Thompson2, Richard James Cook2 and Paul Robinson2; 1Materials Department, Queen Mary University of London, London, United Kingdom; 2GKT Dental Institute, Kings College, London, United Kingdom.
M3.1
A Novel Approach of Developing Hybrid Biomaterials: Two Photon Induced Polymerization of ORMOCERs for Drug Delivery, Tissue Engineering and Beyond. Anand Doraiswamy1, R. J. Narayan1, B. Chichkov2, A. Ovsianikov2, R. Houbertz3, R. Modi4 and D. B. Chrisey4; 1Bioengineering Program, School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia; 2Laser Zentrum Hannover, Hannover, Germany; 3Fraunhofer Institute for Silicate Research, Wurzburg, Germany; 4US Naval Research Laboratory, Washington, District of Columbia.
M3.2
DNA Directed Assembly of Colloidal Particles on Patterned Substrates for Sensors and Photonics. Paul V. Braun1, Margaret H. S. Shyr1, Daryl P. Wernette2, Pierre Wiltzius1,3 and Yi Lu2; 1Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois; 2Chemistry, University of Illinois at Urbana-Champaign, Urbana, Illinois; 3Physics, University of Illinois at Urbana-Champaign, Urbana, Illinois.
M3.3
Patterning of Biomolecules/Materials Using PECVD Generated Surfaces. Joseph M. Slocik, Eric R. Beckel, Timothy J. Bunning, Hao Jiang and Rajesh R. Naik; Materials and Manufacturing Directorate, Air Force Research Laboratory, Wright-Patterson AFB.
M3.4
Stability of Some Non-Precious Dental Alloys in Artificial Saliva Julia Claudia Mirza Rosca1, Juan Rodriguez Castro1, Daniel Mareci2 and Delia Aelenei2; 1Mechanical Engineering, Las Palmas de Gran Canaria University, Las Palmas de GC, Spain; 2Technical University Gh. Asachi, Iasi, Romania.
M3.5
Effects of Fluorides and Surface Treatment on Titanium and Titanium Alloys in Dentistry Julia Claudia Mirza Rosca1, Domingo Herrera Santana1 and Heinz Sturm2; 1Mechanical Engineering, Las Palmas de Gran Canaria University, Las Palmas de GC, Spain; 2Federal Institute of Materials Research, BAM VI 2901, Berlin, Germany.
M3.6
Controlling the size, orientation, density and nucleation of calcium oxalate monohydrate crystals using self-assembled monolayers. Tania M. Cabrera, Leigh M. Friguglietti and Richard W. Gurney; Department of Chemistry, Simmons College, Boston, Massachusetts.
M3.7
Method for the investigation of the relaxation time and viscosity of embossable films Maud Foresti1, Elin Sondergard1, Etienne Barthel1, Caroline Heitz1 and Lena Saint Marcary1; 1Laboratoire du Surface du Verre et Interfaces, UMR 125 CNRS/Saint-Gobain, Aubervilliers, France; 21Capteurs, Mesures, Controles, Saint-Gobain Recherche, Aubervilliers, France.
M3.8
Directed Assembly of Nanomaterials on Topographically Patterned Substrates Using Inbuilt Fringing Fields Chad R. Barry and Heiko O. Jacobs; Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, Minnesota.
M3.9
Dynamic all-optical tuning of transverse resonant cavity modes in photonic bandgap fibers and applications for tunable dispersion compensation. Gilles Benoit1,2, Ken Kuriki1,2, Jean-Francois Viens1,2, John D. Joannopoulos3 and Yoel Fink1,2; 1DMSE, MIT, Cambridge, Massachusetts; 2Research Laboratory of Electronics, MIT, Cambridge, Massachusetts; 3Physics Department, MIT, Canbridge, Massachusetts.
M3.10
Ruthenium(II) Complexes and Polymers: Potential Materials for Applications in Solar Cells. Veronica Marin1,2, Elisabeth Holder1,2, Martijn M. Wienk2,3, Dmitry Kozodaev1,2 and Ulrich S. Schubert1,2; 1Laboratory of Macromolecular Chemistry and Nanoscience, Eindhoven University of Technology (TU/e), Eindhoven, Netherlands; 2Dutch Polymer Institute (DPI), Eindhoven, Netherlands; 3Laboratory of Molecular Materials and Nanosystems, Eindhoven University of Technology (TU/e), Eindhoven, Netherlands.
M3.11
Abstract Withdrawn
M3.12
Photoresist-free Lithographic Deposition of Amorphous Titanium Oxide Films from a Photosensitive Titanium Complex. Xin Zhang and Ross H. Hill; Chemistry, Simon Fraser University, Burnaby, British Columbia, Canada.
M3.13
Gold nanotube membranes with tunable tube diameter and their applications Woo Lee, Hong Jin Fan, Sung Kyun Lee, Steffen Richter, Sven Matthias, Marin Alexe, Roland Scholz, Margit Zacharias, Dietrich Hesse, Kornelius Nielsch and Ulrich Goesele; Max Planck Institute of Microstructure Physics, Halle, Germany.
M3.14
Abstract Withdrawn
M3.15
Abstract Withdrawn
M3.16
Synthesis and Characterization of Nanowire based Anisotropic Conductors Mahnaz El-Kouedi1, Emile Charles Sykes2, Aja Andreu1 and Kasra Daneshvar3; 1Chemistry, UNC-Charlotte, Charlotte, North Carolina; 2Center for Optics and Optical Communications, UNC-Charlotte, Charlotte, North Carolina; 3Electrical and Computer Engineering, UNC-Charlotte, Charlotte, North Carolina.
M3.17
A Large Scale Synthesis of Silver Nano Particle in Aqueous Phase. Young Ah Song, Taehoon Kim and Sung Il Oh; Manufacturing Engineering Team, Samsung Electro-Mechanics, Suwon, Gyunggi-Do, South Korea.
M3.18
Vibrational Coupling in Conjugated š Systems in Relation to Optimization of Fluorescence Yield through Phonon Confinement. Luke Andrew O'Neill1,3, Hugh James Byrne1,3, Patrick Lynch1,2 and Mary McNamara1,2; 1Focas Research Institute, D.I.T., Dublin, Ireland; 2Chemistry, Focas Research Institute, D.I.T., Dublin, Ireland; 3Physics, Focas Research Institute, D.I.T., Dublin, Ireland.
M3.19
Fully Mass Printed Integrated Circuits. Florian Dotz1, Ingolf Hennig1, Peter Eckerle1, Arved C. Hubler2,4, Heiko Kempa2, Howard E. Katz5, Matthias Bartzsch2, Nicole Brandt2, Uta Fugemann2, Subramanian Vaidyanathn3, Jimmy Granstrom3, Sen Liu3, Tino Zillger2, Georg Schmidt2, Elsa Reichmanis3, Thomas Weber1, Frauke Richter1, Thomas Fischer2, Ulrich Hahn2; 1BASF AG, Ludwigshafen, Germany; 2Institute for Print and Media Technology, Chemnitz University of Technology, Chemnitz, Germany; 3Lucent Technology Bell Labs, Murray Hill, New Jersey; 4Printed Systems GmbH, Chemnitz, Germany; 5Johns Hopkins University, Baltimore, Maryland.
8:00 AM *M4.1
Nanoscale Electric Lithography Yong Chen, Mechanical Eng, UCLA, Los Angeles, California.
8:30 AM *M4.2
The Physics and Limits of Femtosecond Laser Micromachining Alan J. Hunt, Biomedical Engineering, University of Michigan, Ann Arbor, Michigan; Center for Ultrafast Optical Science, University of Michigan, Ann Arbor, Michigan.
9:00 AM M4.3
The Direct Nanoscale Deposition of Molecular Electronic Materials with Thermal Dip Pen Nanolithography. Paul E. Sheehan1, Minchul Yang1, Arnauldo R. Laracuente1, Brent A. Nelson2, William P. King2 and Lloyd J. Whitman1; 1Chemistry, Naval Research Laboratory, Washington, District of Columbia; 2Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, Georgia.
9:15 AM M4.4
Non-Lithographic Subtractive Micropatterning of Thin Crystal Films and Bulk Micro-Machining via Hydrogel Stamping. Stoyan K. Smoukov, Christopher J. Campbell, Kyle J. M. Bishop and Bartosz Grzybowski; Chemical & Biological Engineering Dept., Northwestern University, Evanston, Illinois.
9:30 AM BREAK
10:00 AM *M4.5
Rigiflex Lithography: Nano-Patterning and Printing. Hong H. Lee, Dongchul Suh, Dahl-Young Khang, Hyunsik Yoon, Young Park and Joon Kim; School of Chemical Engineering, Seoul National University, Seoul, South Korea.
10:30 AM *M4.6
Coulomb-Force Directed Assembly and Transfer of Nanomaterials. Chad R. Barry1, Aaron M. Welle1, Thomas J. Hatch2, Uwe Kortshagen2, Stephen A. Campbell1 and Heiko O. Jacobs1,2; 1Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, Minnesota; 2Department of Mechanical Engineering, University of Minnesota, Minneapolis, Minnesota.
11:00 AM M4.7
Direct-Write Assembly of 3-D Micro-Periodic Silicon Structures Gregory Gratson1, Floren Garcia-Santamaria1, Mingjie Xu1, Virginie Lousse2, Paul V. Braun1, Shanhui Fan2 and Jennifer A. Lewis1; 1University of Illinois, Urbana, Illinois; 2, Stanford University, Palo Alto, California.
11:15 AM M4.8
Optical-Maskless Lithography for Fast, Flexible Patterning of Complex Geometries at the Nanoscale. Rajesh Menon1,2, Michael Walsh2, David Chao1, Amil Patel1 and Henry I. Smith1,2; 1MIT, Cambridge, Massachusetts; 2LumArray Inc., Somerville, Massachusetts.
11:30 AM M4.9
Novel Methods for the Direct Fabrication and Packaging of MEMS Devices using Sacrificial Polymers. Yueming Hua and Clifford L. Henderson; School of Chemical & Biomolecular Engineering, Georgia Institute of Technology, Atlanta, Georgia.
1:30 PM *M5.1
Inkjet Printed Backplanes for Displays: Polymer Based Self-Encapsulated TFTs. Ana Claudia Arias, Fred Endicott and Robert Street; Palo Alto Research Center, Palo Alto, California.
2:00 PM M5.2
Laser-Assisted Patterning of Conjugated Polymer Light Emitting Diodes. David George Lidzey1, Alastair Buckley2, Monika Voigt3, Carsten Giebeler2, Karl Boehlen4, Jeff Wright2, Phil Rumsby4 and Jim Fieret4; 1Physics and Astronomy, University of Sheffield, Sheffield, United Kingdom; 2MicroEmissive Displays Ltd., Edinburgh, United Kingdom; 3Department of Physics, Imperial College of Science, Technology and Medicine, London, United Kingdom; 4Exitech Ltd., Oxford, United Kingdom.
2:15 PM M5.3
Organic-Inorganic Nanocomposite Material Synthesis and Properties . YuanQiao Rao, Samuel Chen, and Tomohiro Ishikawa; Research Labs, Eastman Kodak Co, Rochester, New York.
2:30 PM BREAK
3:30 PM *M5.4
Roll-to-Roll Manufacturing Technologies for Flexible Device Applications. Harri Kopola, VTT Electronics, Oulu, Finland.
4:00 PM M5.5
Modification of Metal-laminated Plastic Foils for Flexible Displays. Furong Zhu, Li-Wei Tan, Kian Soo Ong and Xiao-Tao Hao; OESC, Institute of Materials Research and Engineering, Singapore, Singapore.
4:15 PM M5.6
Low Frequency Noise Measurement and Analysis in Organic Light Emitting Diode. Lin Ke, Xin Yue Zhao and Soo Jin Chua; OESC, Institute of Materials Research & Engineering, Singapore, Singapore.
4:30 PM M5.7
Preparation and Properties of Reinforced Silicone Resin Films: A New Class of High Temperature, Lightweight, Flexible Substrates. Bizhong Zhu, Carl Fairbank, Nicole Anderson, Dimitris E. Katsoulis and Herschel Reese; Advanced Technologies and Ventures Business R&D, Dow Corning Corp, Midland, Michigan.
8:00 AM *M7.1
Printed Integrated Electronic and Electrochemical Systems on Paper. Magnus Berggren1, Lars-Olov Hennerdal3, David Nilsson1, Anurak Sawadtee3, Robert Forchheimer2 and Nathaniel Robinson1; 1ITN, Linkoping University, Norrkoping, Sweden; 2ISY, Linkoping University, Linkoping, Sweden; 3Acreo AB, Norrkoping, Sweden.
8:30 AM *M7.2
Novel Contacts for Flexible Electronics: Amorphous TCO's and Direct Write Metals and Polymers. David S. Ginley1, Alex Miedaner1, Lee Smith2, Andrew Leenher2, John Perkins1, Tanya Kaydanova1, Maikel Van Hest1, Rubin Collins2, Sean Shaheen1, Matthew Taylor2, Dana Olson2, Matthew Dabney1 and Calvin Curtis1; 1Process Technology and Advanced Concepts, NREL, Golden, Colorado; 2Colorado School of Mines, Golden, Colorado.
9:00 AM M7.3
Room-temperature deposited high-k gate dielectrics for low-voltage flexible electronics Il-Doo Kim1,3, YongWoo Choi1,2, Akintunde I. Akinwande2 and Harry L. Tuller1; 1Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts; 2Microsystems Technology Laboratory (MTL), Massachusetts Institute of Technology, Cambridge, Massachusetts; 3Optoelectronic Materials Research Center, Korea Institute of Science and Technology, Seoul, South Korea.
9:15 AM M7.4
Ultra-Thin Crosslinked Polymeric Gate Insulators for Organic Field-Effect Transistors. Optimization via Polymer and Crosslinker Design Myung-Han Yoon, Hyuk-Jin Choi, He Yan, Antonio Facchetti and Tobin J. Marks; Chemistry, Northwestern University, Evanston, Illinois.
9:30 AM BREAK
10:00 AM M7.5
Nanotransfer Printing as a Method for Fabricating Organic and Carbon Nanotube Thin-Film Transistors on Flexible Substrates. Daniel Hines2,1, Sergey Mezhenny2,1, Michaela Breban2,1, Vinod Sangwan2,1, Ellen Williams2,1, Vince Ballarotto1, Gokhan Esen2 and Michael Fuhrer2; 1Laboratory for Physical Sciences, University of Maryland, College Park, Maryland; 2Department of Physics, University of Maryland, College Park, Maryland.
10:15 AM M7.6
Micron-scale Organic Thin Film Transistors with PEDOT Electrodes Patterned by Polymer Inking. Dawen Li and L. Jay Guo; Electrical Engineering and Computer Science, The University of Michigan, Ann Arbor, Michigan.
10:30 AM M7.7
Monolayer Formation in Oligothiophene Based OTFTs. Paul Chang1, Amanda R. Murphy2, Jean M. J. Frechet2 and Vivek Subramanian1; 1Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, California; 2Department of Chemistry, University of California, Berkeley, California.
10:45 AM M7.8
Organic Thin Film Transistors from Uniaxially Aligned Films of Hexa-peri-hexabenzocoronenes (HBCs). Jason Christopher Pinto1, Richard Friend1, Henning Sirringhaus1, Wojciech Pisula2, Tadeusz Pakula2 and Klaus Muellen2; 1Optoelectronics Group, Cavendish Laboratory, University of Cambridge, Cambridge, United Kingdom; 2Max Planck Institute for Polymer Research, Mainz, Germany.
11:00 AM M7.9
Fused thiophene semiconducting polymers for OFETs: Solutions to high mobility and stability. Steven Tierney, Clare Bailey, Kristijonas Genevicius, Martin Heeney, Iain MacDonald, Ruth Rawcliffe, Richard Simms, David Sparrowe, Maxim Shkunov, Weimin Zhang and Iain McCulloch; Merck Chemicals Ltd., Southampton, United Kingdom.
11:15 AM M7.10
Non-Volatile Memory Effect of Ferroelectric Field-Effect Transistors based on a Printed Polypeptide Film Sei Uemura1, Manabu Yoshida1, Toshihide Kamata1, Masahiko Kojima2, Takeshi Kondo2 and Takeshi Kawai2; 1AIST, Tsukuba, Ibaraki, Japan; 2Department of Industrial Chemistry, Tokyo University of Science, Shinjuku, Tokyo, Japan.
11:30 AM M7.11
Organic Field-Effect Transistors with Suppressed DC Bias-stress Degradations. Tsuyoshi Sekitani1, Shingo Iba1, Yusaku Kato1, Yoshiaki Noguchi1, Takayasu Sakurai2 and Takao Someya1; 1Quantum-Phase Electronics Center, The University of Tokyo, Tokyo, Japan; 2Center for Collaborative Research, The University of Tokyo, Tokyo, Japan.
11:45 AM M7.12
High performance vertical-type organic transistors using a metal base structure Ken-ichi Nakayama, Shin-ya Fujimoto and Masaaki Yokoyama; Graduate School of Engineering, Osaka University, Osaka, Japan.
1:30 PM *M8.1
Inkjet Printing of Functional Polymers and Nanoparticles. Ulrich S. Schubert, Berend-Jan Gans, Emine Tekin, Jolke Perelaer, Antje van den Berg and Elisabeth Holder; Laboratory of Macromolecular Chemistry and Nanoscience, Eindhoven University of Technology and Dutch Polymer Institute, Eindhoven, Netherlands.
2:00 PM *M8.2
Enabling Desktop Inkjet Printers as a Tool to Pattern Conductive Polymers. Yuka Yoshioka1 and Ghassan E. Jabbour2; 1Flexible Display Center, Arizona State University, Tempe, Arizona; 2Chemical and Materials Engineering, Arizona State University, Tempe, Arizona.
2:30 PM BREAK
3:30 PM *M8.3
Inkjet Printing for Flexible Electronics and Smart Textiles. Paul Calvert, Amit Sawhney and Aminesh Agrawal; Textile Sciences, University of Massachusetts, Dartmouth, North Dartmouth, Massachusetts.
4:00 PM M8.4
Inkjet Printing of Polyimide Precursors and its Application to Organic Field-Effect Transistors. Yoshiaki Noguchi1, Tsuyoshi Sekitani1, Yusaku Kato1, Shingo Iba1, Takayasu Sakurai2 and Takao Someya1; 1School of Engineering, The University of Tokyo, Tokyo, Japan; 2Center for Collaborative Research, The University of Tokyo, Tokyo, Japan.
4:15 PM M8.5
Organic FET Grown by Direct Printing of Pentacene Channel and Metal Contacts Using a Molecular Jet Printer Jianglong Chen1, Valerie Leblanc1, Annie Wang1, Marc A. Baldo1, Paul J. Benning2, Martin A. Schmidt1, David M. Schut2 and Vladimir Bulovic1; 1Microelectronics Technology Laboratory, Massachusetts Institute of Technology, Cambridge, Massachusetts; 2, Hewlett-Packard Company, Corvallis, Oregon.
4:30 PM M8.6
Inkjet Printed Inorganic Channel Materials for Thin Film Transistors Yu-Jen Chang, Doo-Hyoung Lee and Chih-Hung Chang; Chemical Engineering, Oregon State University, Corvallis, Oregon.
4:45 PM M8.7
A novel high-Q printed inductor technology for RFID applications David Redinger and Vivek Subramanian; EECS, University of California, Berkeley, Berkeley, California.
8:00 AM *M10.1
Optics and Microfluidics. George Whitesides1, Dmitri Vezenov1, Brian Mayers1, Richard Conroy2, Daniel Wolfe1, Mara Prentiss2, Piotr Garstecki1 and Sindy Tang1; 1Department of Chemistry and Chemical Biology, Harvard University, Cambridge, Massachusetts; 2Department of Physics, Harvard University, Cambridge, Massachusetts.
8:30 AM *M10.2
A New Roadmap: Macro and High Performance Devices via Printing. Ralph Nuzzo, Materials Research Laboratory, University of Illinois, Urbana, Illinois.
9:00 AM M10.3
Rate-controlled Transfer Printing of Solid Objects. Matthew Meitl1 and John A. Rogers1,2; 1Materials Science and Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois; 2Department of Chemistry, University of Illinois at Urbana-Champaign, Urbana, Illinois.
9:15 AM M10.4
Patterned Flat Stamps and Catalytically Active Stamps for Improved Microcontact Printing. Jurriaan Huskens, Supramolecular Chemistry & Technology, University of Twente, MESA, Enschede, Netherlands; Strategic Research Orientation "Nanofabrication", University of Twente, MESA+, Enschede, Netherlands.
9:30 AM *M10.5
Charge Transport at Organic-Organic Heterointerfaces. Henning Sirringhaus, Cavendish Laboratory, University of Cambridge, Cambridge, United Kingdom.
10:00 AM BREAK
10:30 AM *M10.6
Silicone for Advanced Lithography. Anne Shim1, John Rogers2, and Feng Hua3, Ralph Nuzzo2; 1Dow Corning Corporation, Midland, Michigan; 2University of Illinois, Urbana-Champaign, Illinois, 3Clarkson University, Potsdam, New York .
11:00 AM M10.7
The origin of large elastic stretchability of thin gold films on elastomeric substrates Stephanie Perichon Lacour1, Donald Chan1, Sigurd Wagner1, Teng Li2 and Zhigang Suo2; 1Electrical Engineering, Princeton University, Princeton, New Jersey; 2Division of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts.
11:15 AM M10.8
Design Aspects of Multi-user 3D Displays using Deformable Lenticulars. Mostafa El-Ashry and Henry Daniel Young; Dept. of Mech. and Mat. Eng., Wright State University, Dayton, Ohio.