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• Rapid Communications: Positive Hall coefficients obtained from contact misplacement on evident n-type ZnO films and crystals 2293-2295
  Authors: Takeshi Ohgaki, Naoki Ohashi, Shigeaki Sugimura, Haruki Ryoken, Isao Sakaguchi, Yutaka Adachi, Hajime Haneda


• Morphology, mechanical, and thermal properties of aramid/layered silicate nanocomposite materials 2296-2304
  Authors: Sonia Zulfiqar, Muhammad Ilyas Sarwar, Ingo Lieberwirth, Zahoor Ahmad


• Influence of processing route and SiO₂ on sintering ability, CTE, and dielectric constant of ß-Si₄Al₂O₂N₆ 2305-2311
  Authors: Ibram Ganesh, N. Thiyagarajan, D.C. Jana, G. Sundararajan, S.M. Olhero, J.M.F. Ferreira


• Investigation into the effect of nucleation parameters on grain formation during solidification using a cellular automaton-finite control volume method 2312-2325
  Authors: X. Yao, M.S. Dargusch, A.K. Dahle, C.J. Davidson, D.H. StJohn


• Polyaniline nanofibers prepared by a facile electrochemical approach and their supercapacitor performance 2326-2332
  Authors: Haibin Zhang, Hanlu Li, Fengbao Zhang, Jixiao Wang, Zhi Wang, Shichang Wang


• Electromigration and thermomigration behavior of flip chip solder joints in high current density packages 2333-2339
  Authors: D. Yang, Y.C. Chan, B.Y. Wu, M. Pecht


• Investigation of nitrogen-doped TiO₂ thin films grown by reactive pulsed laser deposition 2340-2345
  Authors: G. Sauthier, E. György, A. Figueras


• Preparation of Zr₆₀Ni₂₁Al₁₉ bulk metallic glass and compression behavior under high pressure 2346-2349
  Authors: G. Li, Q. Jing, T. Xu, L. Huang, R.P. Liu, J. Liu


• Electronic structure and chemical bonding of α- and ß-Ta₄AlC₃ phases: Full-potential calculation 2350-2356
  Authors: Wei Lu, Xiaohui Deng, Hai Wang, Haitao Huang, Lianlong He


• Nanoindentation hardness, Young’s modulus, and creep behavior of organic–inorganic silica-based sol-gel thin films on copper 2357-2365
  Authors: Bruno A. Latella, Bee K. Gan, Christophe J. Barbé, David J. Cassidy


• Study of high-pressure sintering behavior of cBN composites starting with cBN–Al mixtures 2366-2372
  Authors: Yongjun Li, Sicheng Li, Ran Lv, Jiaqian Qin, Jian Zhang, Jianghua Wang, Fulong Wang, Zili Kou, Duanwei He


• Adhesion of nanostructured diamond film on a copper–beryllium alloy 2373-2381
  Authors: Shane A. Catledge, Yogesh K. Vohra, Damon D. Jackson, Samuel T. Weir


• Delamination toughness of electron beam physical vapor deposition (EB-PVD) Y₂O₃–ZrO₂ thermal barrier coatings by the pushout method: Effect of thermal cycling temperature 2382-2392
  Authors: M. Tanaka, Y.F. Liu, S.S. Kim, Y. Kagawa


• Combustion synthesis of ultrafine tungsten carbide powder 2393-2397
  Authors: H.I. Won, H.H. Nersisyan, C.W. Won


• Synthesis and performance of a photocatalytic titania-hydroxyapatite composite 2398-2405
  Authors: N. Phonthammachai, J. Kim, T.J. White


• Temperature dependence of mechanical properties in ultrathin Au films with and without passivation 2406-2419
  Authors: Patric A. Gruber, Sven Olliges, Eduard Arzt, Ralph Spolenak


• On the oxidation resistance of superhard Ti–Si–C–N coatings 2420-2428
  Authors: Yan Guo, Shengli Ma, Kewei Xu, Tom Bell, Xiaoying Li, Hanshan Dong


• Indentation fracture of low-dielectric constant films: Part I. Experiments and observations 2429-2442
  Authors: Dylan J. Morris, Robert F. Cook


• Indentation fracture of low-dielectric constant films: Part II. Indentation fracture mechanics model 2443-2457
  Authors: Dylan J. Morris, Robert F. Cook


• Improved lithium insertion/extraction properties of single-walled carbon nanotubes by high-energy ball milling 2458-2466
  Authors: JiYong Eom, HyukSang Kwon


• Electron energy loss spectroscopy of Na in Na, Na₂O, and silicate glasses 2467-2471
  Authors: Nan Jiang, D. Su, J.C.H. Spence, S. Zhou, J. Qiu


• Amorphous to anatase transformation in atomic layer deposited titania thin films induced by hydrothermal treatment at 120 °C 2472-2479
  Authors: Zhaoming Zhang, Gerry Triani, Liang-Jen Fan


• Continuous electrical in situ contact area measurement during instrumented indentation 2480-2485
  Authors: Lei Fang, Christopher L. Muhlstein, James G. Collins, Amber L. Romasco, Lawrence H. Friedman


• Determination of the internal stress and dislocation velocity stress exponent with indentation stress relaxation test 2486-2490
  Authors: B.X. Xu, X.M. Wang, Z.F. Yue


• Fabrication of titanium-based microstructured surfaces and study on their superhydrophobic stability 2491-2499
  Authors: Baojia Li, Ming Zhou, Run Yuan, Lan Cai


• Optical and electrical properties of indium tin oxide thin films with tilted and spiral microstructures prepared by oblique angle deposition 2500-2505
  Authors: Y. Zhong, Y.C. Shin, C.M. Kim, B.G. Lee, E.H. Kim, Y.J. Park, K.M.A. Sobahan, C.K. Hwangbo, Y.P. Lee, T.G. Kim


• Investigation of silicon nanoclusters embedded in ZnO matrices deposited by cosputtering system 2506-2511
  Authors: Li-Wen Lai, Chih-Hong Liu, Ching-Ting Lee, Li-Ren Lou, Wen-Yung Yeh, Mu-Tao Chu


• Ba₃Yb(BO₃)₃ single crystals: Growth and spectroscopic characterization 2512-2518
  Authors: R. Solé, F. Güell, Jna. Gavaldà, M. Aguiló, F. Díaz


• Reaction mechanism of self-propagating high-temperature synthesis reaction in the Ni–Ti–B₄C system 2519-2527
  Authors: Y.F. Yang, H.Y. Wang, R.Y. Zhao, Y.H. Liang, Q.C. Jiang


• A numerical approach to evaluation of elastic modulus using conical indenter with finite tip radius 2528-2537
  Authors: Jin Haeng Lee, Hyungyil Lee, Deok Hoon Kim


• Evaluation of true interlamellar spacing from microstructural observations 2538-2544
  Authors: Teruyuki Ikeda, Vilupanur A. Ravi, G. Jeffrey Snyder


• Intermetallic formation induced substrate dissolution in electroless Ni(P)-solder interconnections 2545-2554
  Authors: Jenn-Ming Song, Yao-Ren Liu, Chien-Wei Su, Yi-Shao Lai, Ying-Ta Chiu