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Real Time In Situ Stress Evolution Investigation of Highly Textured Electrodeposited Bismuth Thin Films

Author(s):
Donglei Fan, Frank Q. Zhu, Ingrid X. Shao, P. C. Searson, and R. C. Cammarata
Materials Science and Engineering , Johns Hopkins University
United States

Bismuth, a semi-metal with very long mean free path and large magnetoresistance (MR) effect, is a novel candidate material for thin film spintronic devices. Electrochemical deposition followed by a post-deposition anneal has resulted in highly textured bismuth films as characterized by x-ray diffractometry and pole figure measurements. A highly sensitive, real time in-situ stress measurement system was designed and employed to study stress generation during bismuth film growth. Bismuth films displayed a monotonically increasing compressive stress during deposition. The magnitude of the compressive stress decreased with the deposition rate in the range 1.5 ?sec to 50 ?sec. Growth interrupts revealed a large stress relaxation with over 90% relaxation observed for the deposition rate of 50 ?sec.

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Track ID:
Paper #: Z4.2
DOI:

Elsevier/Materials Today