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Call for Papers

Symposium EP7—Material and Device Frontiers for Integrated Photonics

Chip-scale integration of photonic devices plays an important role in the Internet-of-Things (IoT) era by enabling energy-efficient optical communications as well as optical sensing with a high sensitivity. Various materials have been utilized for discrete photonic devices, and as a result, several platforms of materials, such as Si, III-V, glass, and flexible substrates, have been independently examined for monolithic/hybrid integrations of photonic devices on a small chip. Although significant progress has been achieved in each of the platforms, discussions are mostly limited to within specific material systems. The symposium will bring together researchers working on a diverse range of photonic material systems (group-IV semiconductors, III-V compound semiconductors, chalcogenides, oxides, graphene, organic materials etc.), and provide a cross-disciplinary forum to share latest research progress with the aim of expanding the material repertoire towards next-generation photonic integration for higher-performance optical communication and optical sensing applications.

Topics will include:

  • III-V compound semiconductors for integrated photonics
  • Chalcogenides for integrated photonics
  • Quantum-nanostructured photonic devices
  • Plasmonic and nonlinear effects for on-chip photonic devices
  • Heterogeneous photonic integration
  • Defects and doping in photonic devices
  • Group-IV semiconductors (Si, Ge, Sn and their alloys) for integrated photonics
  • Oxides, graphene, and organic materials for integrated photonics
  • On-chip photonic devices such as light sources, photodetectors, optical resonators and optical waveguides
  • Photonic crystals and metamaterials for on-chip photonic devices
  • Synthesis, epitaxy and bonding of materials and devices for photonic integration

Invited Speakers:

  • Philippe Boucaud (University of Paris Sud, France)
  • Nader Engheta (University of Pennsylvania, USA)
  • Erich Kasper (Univesity of Stuttgart, Germany)
  • Lionel C. Kimerling (Massachusetts Institute of Technology, USA)
  • Barry Luther-Davies (Australia National University, Australia)
  • Tetsuya Mizumoto (Tokyo Institute of Technology, Japan)
  • Nobuhiko Nishiyama (Tokyo Institute of Technology, Japan)
  • Erik J. Norberg (Aurrion Inc., USA)
  • Jeremy O’Brien (University of Bristol, United Kingdom)
  • Douglas J. Paul (University of Glasgow, United Kingdom)
  • Lorenzo Pavesi (University of Trento, Italy)
  • Gunther Roelkens (Ghent University, Belgium)
  • Ren-Jye Shiue (Massachusetts Institute of Technology, USA)
  • Dan-Xia Xu (National Research Council, Canada)
  • Jongseung Yoon (University of Southern California, USA)
  • Weidong Zhou (University of Texas, Arlington, USA)

Symposium Organizers

Yasuhiko Ishikawa
The University of Tokyo
Department of Materials Engineering

Brian Corbett
Tyndall National Institute
University College Cork
353-21-490-4380, brian.corbett@tyndall.ie

Juejun Hu
Massachusetts Institute of Technology
Department of Materials Science and Engineering
302-766-3083, hujuejun@mit.edu

Shinichi Saito
University of Southampton
Faculty of Physical Science and Engineering
United Kingdom
44-23-8059-3169, s.saito@soton.ac.uk

Chee Hing Tan
The University of Sheffield
Department of Electronic and Electrical Engineering
United Kingdom
44-114-2225144, c.h.tan@sheffield.ac.uk