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Tutorial NT7: Fundamentals of Nanoparticle Adhesion and Removal

Mar 28, 2016
01:30 PM - 05:00 PM
PCC North, 100 Level, Room 128 A

1:30 pm-3:00 pm
Parts I and II: Cetin Cetinkaya

The first segment reviews the fundamentals of nano/micro-particle adhesion and main techniques for adhesion characterization at nano/micro-length scales. A review of the current particle adhesion research will be provided and some of the key emerging adhesion characterization techniques will be discussed in detail.
The second segment focuses on the practical issues and technical challenges associated with nano/micro-particles adhesion and removal in semiconductor industry. Following a general discussion and an overall review, some specific cases, such as post-CMP particle removal, silicon wafer cleaning and photomask cleaning, will be discussed in detail.

3:00 pm Break

3:30 pm-5:00 pm
Parts III and IV: Steve Beaudoin

The first segment focuses on van der Waals forces on particle adhesion to surfaces, with an emphasis on effects of particle size, shape, roughness and composition. A review of classic methods for describing the adhesion and new developments in particle and powder adhesion characterization will be presented.

The second segment will focus on the effects of relative humidity and capillary forces on particle adhesion. A review of classical approaches to describing humidity/moisture effects will be included, as will an evaluation of low relative humidity conditions where condensed liquid droplets are unlikely to exist on surfaces, yet where moisture strongly influences the particle adhesion.

  • Cetin Cetinkaya, Clarkson University
  • Stephen Beaudoin, Purdue University