Advances in micro-scale manufacturing techniques, high resolution testing apparatus and the ability to carry out complementary modeling on similar length scales has led to significant advances in the range and applications of mechanical testing at the micro- and nano-scale. Techniques such as micro-compression and bending, nanoindentation and thin film testing in uniaxial tension, biaxial tension and bending have advanced beyond mere properties measurements; they now are regularly used for both investigations of fundamental deformation mechanisms and applications to engineering and reliability problems where conventional testing techniques are not suitable.
The applications of these techniques have been greatly widened by the development of advanced in-situ deformation experimental equipment (both X-ray and electron microscope based) and an increased ability to perform micro-scale tests at elevated temperatures, under liquids and at non-ambient conditions. This has resulted in research efforts probing a range of advanced materials and cutting edge techniques are now finding use in solving industrial as well as academic questions in applications as diverse as aerospace failure investigations, deformation of biological implants, understanding radiation damage, energy storage materials, and fracture in complex flexible electronic devices.
This symposium aims to bring together experts in both the development of advanced small scale testing techniques and instruments together with users from both academic and industrial settings. It is hoped that this will speed up the take up of these techniques into industry as well as providing a new set of challenges for experimental design and implementation.
Student symposium posters will be eligible for in-symposium awards (1st - $500, 2nd-$350 and 3rd-$150).