Symposium EM10—Solution-Processed Inorganics for Electronic and Photonic Device Applications

In recent years, printed device research is getting increasing attention due to its potential of reducing device production cost and energy consumption by solution-processing of materials building blocks at low temperature, as well as its ease of device integration and promise to adopt flexible form factors. Although the idea of fabricating device components by printing is quite intriguing, its maturity and widespread adoption will only be possible through the combined efforts of materials development, ink formulations, advanced processing, tool engineering, and system integration. In this area, much of the work has been emphasized on devices (solar cells, transistors, memory and many other types) based on easily printable carbon-containing organic materials, but poor performance is the major issue impeding potential applications. In contrast, pure inorganic materials are difficult to print, but once printed generally exhibit better device performances compared to their organic counterparts. This symposium will focus on recent developments in selection of inorganic materials, ink formulations, processing and integration approaches for printed device applications. It will also address some of the scientific and engineering challenges researchers are facing in solution depositing a variety of inorganic films for applications in the area of sensors, displays, solar cells and computing devices. The aspects to be covered in this symposium include solution based material growth, chemistry of inorganic inks, fabrication of functional thin films, patterning, high throughput processing, advanced characterization techniques, establishment of processing-structure-property relationship and device level integration.

Topics will include:

  • Chalcogenide, kesterite, black phosphorus and oxide-solution-processed films
  • Solution-based deposition of 2D transition metal dichalcogenides for printed devices
  • Nanomaterials as soluble precursors for printed device applications
  • Ink development for inorganic materials: Metal, semiconductor, dielectric, transparent conductive oxides
  • Solution processing of silicon, germanium and III/Vs
  • Direct-write techniques for inorganic materials
  • Solution-based 3D printing techniques for inorganic materials
  • Chemical bath and plating techniques
  • High throughput deposition of inorganic inks
  • Solution-based patterning and self-assembly techniques
  • Device integration
  • Properties and applications (e.g., photovoltaics, transistors, sensors and displays) of solution-processed pure inorganic materials

Invited Speakers:

  • Michael Dickey (North Carolina State University, USA)
  • Ahmed Ennaoui (Institute for Research in Solar Energy and New Energies (IRESEN), Morocco)
  • Antonio Facchetti (Polyera, USA)
  • Tawfique Hasan (University of Cambridge, United Kingdom)
  • Mark C. Hersam (Northwestern University, USA)
  • Hugh W. Hillhouse (University of Washington, USA)
  • Yeon Sik Jung (Korea Advanced Institute of Science and Technology, Republic of Korea)
  • Cherie R Kagan (University of Pennsylvania, USA)
  • Doo Hyun Ko (Kyung Hee University, Republic of Korea)
  • Alison Lennon (University of New South Wales, Australia)
  • Shlomo Magdassi (The Hebrew University of Jerusalem, Israel)
  • Delia Milliron (University of Texas at Austin, USA)
  • David Mitzi (Duke University, USA)
  • Jooho Moon (Yonsei University, Republic of Korea)
  • Aoife Morrin (Dublin City University, Ireland)
  • Arokia Nathan (University of Cambridge, United Kingdom)
  • Tse Nga Ng (University of California, San Diego, USA)
  • Edgardo Saucedo (Catalonia Institute for Energy Research, Spain)
  • Takao Someya (University of Tokyo, Japan)
  • Dmitri V. Talapin (University of Chicago, USA)
  • Jiang Tang (Huazhong University of Science and Technology, China)
  • Susanna Thon (Johns Hopkins University, USA)
  • Ayodhya Tiwari (Empa Swiss Federal Labs for Materials Science & Technology, Switzerland)
  • Veit Wagner (Jacobs University, Germany)

Symposium Organizers

Santanu Bag
Air Force Research Laboratory, WPAFB
Materials and Manufacturing Directorate
USA
937-255-3037, sbag.ibm@gmail.com

Edward (Ted) H Sargent
University of Toronto
Department of Electrical and Computer Engineering
Canada

Patrick J Smith
The University of Sheffield
Department of Mechanical Engineering
United Kingdom

Teodor K Todorov
IBM Thomas J. Watson Research Centre
Physical Sciences and Technology Division
USA
914-945-2547, tktodoro@us.ibm.com