2025 MRS Fall Meeting & Exhibit

Symposium EL10-Materials for Heterogeneous Integration and Advanced Packaging

Application-specific demands, particularly in high-performance computing, power electronics/electrification, and sub-THz communications infrastructure, drive the specification of new material capabilities to enhance system-level performance in advanced packaging. Key areas of focus include advancements to enable higher package-routing density and miniaturization, improved electrical performance, and enhancements in mechanical and thermal properties to improve processability, and reliability. Advanced thermal solutions are crucial for achieving system-level performance while adhering to constraints such as maximum device-junction temperature, size, and cost. Advanced packaging materials play a critical role in enabling the miniaturization, performance enhancement, and reliability of semiconductor devices, and their properties must be carefully tailored to meet specific application requirements.
As packaging technologies are advancing rapidly the need and demand for novel materials is growing including interconnects, substrates, embedded active and passive devices, thermal interface materials, dielectrics, encapsulants, etc. are important drivers to scaling, performance and reliability of heterogeneously integrated devices beyond Moore’s Law. As the substrate evolves from a chip carrier to an integration platform, certain key attributes or elements of this substrate platform need to adapt to new scaling terms and targets.
Through the proposed symposium we intend to gather the community to address challenges and highlight materials innovations in the area of Advanced and Heterogenous Packaging for applications including high performance computing (HPC), harsh environment packaging, artificial intelligence (AI), quantum computing, 5G/6G communications, and commercial leap ahead technologies. A tutorial in materials for heterogeneous integration will be offered at the symposium that will address challenges of materials in advanced packaging.

Topics will include:

Substrate Materials and Processes
3D Integration and Hybrid Bonding
Materials and Processes for Fine-Pitch/ High Density Interconnects
Thermal Interface Materials
Optical Interconnections and Photonics Packaging
Reliability of Advanced Substrates and Interconnections
Encapsulants, Die Attach Materials, and Underfills
Embedded Actives and Passives
Interposers (Silicon, Glass, Organics, etc.)
Materials for Harsh Environment Electronics Packaging
Flexible Electronics
Advanced Packaging Materials for Quantum Computing
MEMS and Sensor Packaging
Materials Design for Sustainability of Advanced Packaging
Workforce Development
Sustainable Materials for Heterogeneous Integration and Advanced Packaging

Invited Speakers:

Hidenori Abe (Resonac, USA)
Hitoshi Araki (Toray, Japan)
Surya Bhattacharya (Agency for Science, Technology and Research, Institute of Microelectronics, Singapore)
Nikhlesh Chawla (Purdue University, USA)
Gaurang Choksi (Intel Corporation, USA)
Reinhold Dauskardt (Stanford University, USA)
Ellie Najjar (MacDermid Alpha, USA)
Takahumi Fukushima (Tohoku University, Japan)
Carol Handwerker (Purdue University, USA)
Shailesh Joshi (Toyota Research Institute of North America, USA)
Yogendra Joshi (Georgia Institute of Technology, USA)
Jin Hee Kim (Bruker, USA)
Meredith LaBeau (Calumet Electronics Corporation, USA)
Ravi Mahajan (Intel Corporation, USA)
Alan Mantooth (University of Arkansas, USA)
Patrick McCluskey (University of Maryland, USA)
Hirohisa Narahashi (Ajinomoto, Japan)
Toshihisa Nonaka (Rapidus Corporation, Japan)
Kunal Parekh (Micron Technology, USA)
Jed Pitera (IBM Almaden Research Center, USA)
Morgana Ribas (MacDermid Alpha Electronics Solutions, USA)
Christina Seeholzer (HRL Laboratories, LLC., USA)
Nancy Stoffel (National Institute of Standards and Technology, USA)
Katsuaki Suganuma (Osaka University, Japan)
Madhavan Swaminathan (The Pennsylvania State University, USA)
Jean Trewhella (Global Foundries, USA)
James Warren (National Institute of Standards and Technology, USA)
Hongwen Zhang (Indium Corporation, USA)