2025 MRS Fall Meeting & Exhibit

Symposium NM01-Scalable 2D Materials—Synthesis, Processing, Metrology and Device Implementation

2D materials enable seemingly endless possibilities for a wide range of applications in electrical engineering, including e.g., light emitting or light sensing devices, transistors, memory devices, gas sensors, supercapacitors, or batteries. Their technological implementation, however, is lacking behind due to a considerable gap in scalable processing technologies and device architectures, characterization across all length scales, and fundamental understanding of related interface phenomena in realistic environments. This symposium will bring together leading international experts with the intention to cover the full processing chain from synthesis and processing to device implementation of 2D material units considering scalability and including sophisticated characterization and simulation concepts. Chemical synthesis and exfoliation of micron-sized 2D flakes with functionalized surfaces that can be processed through printing and coating techniques as well as area-select crystal growth and chemical vapor deposition approaches for large-area 2D material films that can be used as-synthesized or transferred to arbitrary substrates in fab compatible processes will be considered.
The sessions will cover (i) scalable synthesis and processing routes for 2D materials with high yield and control; (ii) characterization, modelling and manipulation of interface-controlled functionality of scalable 2D materials architectures, (iii) implementation of scalable 2D material units in realistic device architectures and (iv) industrialization aspects such as fab compatible growth, patterning, lithography and encapsulation. A profound understanding of the complete processing chain and the resulting device performance will help to identify key barriers that currently limit the transition of 2D materials from lab to fab.

Topics will include:

  • Large area synthesis of 2D material films and their heterostructures including scalable transfer techniques
  • Novel approaches for 2D TMDCs synthesis including selective deposition, epitaxy, and low temperature BEOL compatible growth
  • Integration of 2D materials into FAB platforms, considering aspects of lithography, dielectric deposition and encapsulation
  • Chemical exfoliation and gas phase synthesis of 2D material flakes
  • Printing and coating techniques of 2D material films
  • In-line and off-line metrology and standards
  • Novel approaches for characterization of 0D, 1D and interface defects including defect passivation
  • Characterization and modelling of scalable 2D materials and their heterostructures
  • Contact resistance and thermal management in 2D material devices
  • Performance, functionality and modelling of electronic devices
  • Performance, functionality and modelling of optoelectronic devices
  • Performance, functionality and modelling of energy storage devices
  • Artificial intelligence for material and device design as well as metrology

Invited Speakers:

  • Pulickel Ajayan (Rice University, USA)
  • Raul Arenal (Universidad de Zaragoza, Spain)
  • Claudia Backes (University of Kassel, Germany)
  • Jiang Cao (ETH Zürich, Switzerland)
  • Manish Chhowalla (University of Cambridge, United Kingdom)
  • Seungjun Chung (Korea University, Republic of Korea)
  • Chelsey Dorow (Intel Corporation, USA)
  • Tibor Grasser (Technische Universität Wien, Austria)
  • Ali Javey (University of California, Berkeley, USA)
  • Kibum Kang (Korea Advanced Institute of Science and Technology, Republic of Korea)
  • Jeehwan Kim (Massachusetts Institute of Technology, USA)
  • Pawan Kumar (Interuniversity Microelectronics Centre, Belgium)
  • Mario Lanza (National University of Singapore, Singapore)
  • Chul-Ho Lee (Seoul National University, Republic of Korea)
  • Li Lin (Peking University, China)
  • Cecillia Mattevi (Imperial College, United Kingdom)
  • Hirotomo Nishihara (Tohoku University, USA)
  • Andrew Pollard (National Physics Laboratory, United Kingdom)
  • Iuliana Radu (TSMC Ltd., Taiwan)
  • Yuanyuan Shi (University of Science and Technology of China, China)
  • Miika Soikkeli (VTT Technical Research Centre, Finland)
  • Zhipei Sun (Aalto University, Finland)
  • Klass-Jan Tielrooij (Technische Universiteit Eindhoven, Netherlands)
  • Angela Walker (National Institute of Standards and Technology, USA)
  • Hartmut Wiggers (Universität Duisburg-Essen, Germany)
  • Hadis Zarrin (Toronto University, Canada)

Symposium Organizers

Gerd Bacher
Universität Duisburg-Essen
Werkstoffe der Elektrotechnik
Germany

Vina Faramarzi
ASML
Netherlands

Jimin Kwon
Ulsan National Institute of Science and Technology
Department of Electrical Engineering
Republic of Korea

Michael Pope
University of Waterloo
Department of Chemical Engineering
Canada

Topics

2D materials chemical composition devices energy storage metrology optoelectronic standards