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Call for Papers

Abstracts were due June 15, 2020.

Symposium F.FL03-Flexible, Wearable Electronics and Textiles

The rapidly evolving technology developments in the flexible materials space on both polymer-based planar films and 3D forms, such as textiles, are enabling novel applications for health and information wearables applications (i.e. Internet of The Body). At its core, wearable electronics applications are critically linked to the interrelationship of materials, process and system design which should be inspired by reliability in manufacturing and data acquired their incorporation in a wearable system. This symposium will aim to provide a forum for collaborative discussions around technical presentation on recent developments in four primary themes, each with a primary focus on electronics for flexible planar films and on textile for the application to wearable electronic applications: 1) Novel materials and processing techniques for scale-ability of electronic materials on flexible films and textiles; 2) Structure design and modeling for enhancing flexibility and stretch of electronic materials on flexible films and textiles; 3) Advanced methods on the assessment of flexible materials and their applied use in wearables, including methods in human trial studies; and 4) Opportunities and use-case criteria for future wearables applications. Of particular interest in this symposium are the advancements in thin film 3D printing and low temperature processing of the broad range of materials, from organic, inorganic and hybrid conducting and dielectric materials. From a textile perspective, this would also include patterning designs of device architectures using vapor and solution based processing. Applications will be explored with a focus on integrate wearables for multimodal sensing, energy harvesting, and energy storage that are validated based on their use-case analysis and human-performance validation. Lastly, a focus will be provided on industrial research needs that meets the needs of scaling opportunities for product development from the lab to market.

Topics will include:

  • Flexible Electronics Materials Design
  • Textile Electronics Design
  • Design to Performance Relationships for Wearables
  • Materials to Performance Relationships for Wearables
  • Flexible Materials and Packaging
  • Electronics Materials Processing Strategies for Wearables
  • Manufacturing Scalability of Flexible and Stretchable materials
  • Conductive Printing on Non-Planar Surfaces
  • 3D Printing Methods for Flexible Electronics
  • Conductive Textiles, Fibers, and Inks
  • Artificial Skins and E-Textiles
  • System-level Evaluation for Flexible and Textile Electronic Systems
  • In-vitro Stretchable Sensors and Biosensors
  • Local Drug Delivery Devices and Wearable Hollow Needle Devices
  • Wearable Textile for Chemical and Biological Detection

Invited Speakers:

  • Aram Amassian (KAUST Solar Center, Saudi Arabia)
  • Tricia Carmichael (University of Windsor, Canada)
  • Jun Chen (University of California, Los Angeles, USA)
  • Kenjiro Fukuda (University of Tokyo, Japan)
  • Wei Gao (California Institute of Technology, USA)
  • Tushar Ghosh (North Carolina State University, USA)
  • Brad Holschuh (University of Minnesota, USA)
  • Youfan Hu (Peking University, China)
  • Esma Ismailova (École des Mines de Saint-Étienne, France)
  • Do Hwan Kim (Hanyang University, Republic of Korea)
  • Veena Misra (North Carolina State University, USA)
  • Cheolmin Park (Yonsei University, Republic of Korea)
  • Jang-Ung Park (Yonsei University, Republic of Korea)
  • Huisheng Peng (Fudan University, China)
  • Oliver Schmidt (IFW Dresden, Germany)
  • Sameer Sonkusale (Tufts University, USA)
  • Xiaoming Tao (Hong Kong Polytechnic University, Hong Kong)
  • Susan Trolier-Mckinstry (The Pennsylvania State University, USA)
  • Diana Wagner (Harvard University, USA)
  • Zhonglin Wang (Georgia Institute of Technology, USA)
  • Feng Yan (Soochow University, China)
  • Shu Yang (University of Pennsylvania, USA)
  • Seunghyup Yoo (Korea Advanced Institute of Science and Technology, Republic of Korea)

Symposium Organizers

Zijian Zheng
The Hong Kong Polytechnic University
Institute of Textiles and Clothing
Hong Kong
852-2766-6441, zijian.zheng@polyu.edu.hk

Wenlong Cheng
Monash University
Department of Chemical Engineering
+61 3 990 53147, Wenlong.Cheng@monash.edu

Trisha Andrew
University of Massachusetts Amherst
413-545-1651, tandrew@umass.edu

Jesse Jur
North Carolina State University
Textile Engineering, Chemistry & Science
919-515-1676, jsjur@ncsu.edu