Clare Lanaghan1,Srinivas Yadavalli1,Jack Palmer2,Mengyao Zhang1,Moses Kodur2,Orlando Trejo1,Sean Dunfield2,David Fenning2,Neil Dasgupta1
University of Michigan–Ann Arbor1,University of California San Diego2
Clare Lanaghan1,Srinivas Yadavalli1,Jack Palmer2,Mengyao Zhang1,Moses Kodur2,Orlando Trejo1,Sean Dunfield2,David Fenning2,Neil Dasgupta1
University of Michigan–Ann Arbor1,University of California San Diego2
Perovskite solar cells (PSCs) have achieved similar power conversion efficiency to commercially available options, but still lack operational stability due to unstable interfaces with transport layers and atmospheric induced degradation. Laminated PSCs (L-PSCs) using two half-cell stacks to complete a full device, offer a processing route to relax restrictions on transport layer selection and improve device stability through self-encapsulation. While functional L-PSCs have been previously demonstrated, there is a lack in understanding of how temperature, pressure, time, cell architecture, and lamination interface affect bonding, which will be critical to enable optimization of L-PSCs.<br/>In this study, we explore the optimal bonding of L-PSCs at various interfaces using a range of conditions. Bond quality is quantified by measuring the interfacial toughness of the system using a double cantilever beam method, as well as calculating the area bonded over the substrate area, and comparing successful bonding conditions with device performance. Design of experiments and predictive statistical analysis are used to identify promising bonding conditions from survey datasets varying the lamination temperature, pressure, and time. A key finding is that the cell architecture has a significant effect on bond quality. Understanding the interplay between lamination conditions and interfacial toughness, area bonded, and device performance is necessary to find regions of optimal bonding. Moreover, deconvolution of how lamination parameters impact mechanical bonding will inform optimization of L-PSCs, strategic development of tandem L-PSCs, and allow design of optimal bonding within the processing constraints of scalable manufacturing.