2020 MRS Spring Meeting

Call for Papers

In March of this year, MRS leadership made the difficult decision to cancel the 2020 MRS Spring Meeting in Phoenix for the safety and well-being our members, attendees, staff and the materials community, and to reschedule as much of the program as possible into a special 2020 Joint MRS Spring and Fall Meeting.

This one-time-only joint event will take place in Boston, from Saturday, November 28 through Friday, December 4—expanding by one day to provide programming capacity. The program flow for each symposium is under development and will be announced in early July.

Symposium NM08—2D Atomic and Molecular Sheets—Electronic and Photonic Properties and Device Applications

The research in two-dimensional (2D) materials is a highly multidisciplinary field with rapidly emerging scientific breakthroughs and technological innovations that can impact many existing and emerging technological fields in the years to come. This symposium aims to cover existing and emerging topics in 2D materials electronics and photonics research, with an emphasis on their device application in neuromorphic electronics and quantum information processing. The sessions will discuss scalable synthesis of electronic-grade layers, and novel synthesis routes for 2D materials, as well as on the discovery and characterization of electronic and optical properties in emerging 2D materials. The symposium will also emphasize on the electronic and photonic device applications, particularly in the areas of neuromorphic computing and quantum information processing, as well as in the next-generation sensor and energy technologies. We will cover topics on scalable 2D material electronic and photonic device fabrication; 2D material sensor and energy devices; 2D material memory and artificial synaptic devices for advanced computation architectures; and novel 2D materials based device concepts for quantum computation and communication. Multidisciplinary research areas associated with materials science, physics, chemistry and device engineering will be linked by invited talks to facilitate the discussion about understanding new material properties and the benchmarking and development of these materials towards applications.

Topics will include:

  • 2D material memory and artificial synaptic devices for advanced computation architectures
  • 2D material devices for quantum information and quantum computing
  • 2D materials devices for optoelectronics, sensors and energy applications
  • Scalable device fabrication and applications
  • Ferromagnetic and ferroelectric 2D material Devices
  • 2D optical materials: from far-IR to visible
  • Scalable synthesis of electronic-grade 2D material sheets
  • Theory and multi-scale modeling of material growth, electronic structure and devices

Invited Speakers:

  • Jong-Hyun Ahn (Yonsei University, Republic of Korea)
  • Pulickel Ajayan (Rice University, USA)
  • Joerg Appenzeller (Purdue University, USA)
  • Alexander Balandin (University of California, Riverside, USA)
  • Paddy K.L. Chan (The University of Hong Kong, Hong Kong)
  • Wei Chen (Northwestern University, USA)
  • Manish Chhowalla (University of Cambridge, United Kingdom)
  • Zaiyao Fei (University of Washington, USA)
  • Aaron D. Franklin (Duke University, USA)
  • Mark Hersam (Northwestern University, USA)
  • Wenping Hu (Tianjing University, China)
  • Deep Jariwala (University of Pennsylvania, USA)
  • Berend Thomas Jonker (U.S. Naval Research Laboratory, USA)
  • Philip Kim (Harvard University, USA)
  • Lain-Jong Li (Taiwan Semiconductor Manufacturing Company Limited, Taiwan)
  • Mo Li (University of Washington, USA)
  • Zheng Liu (Nanyang Technological University, Singapore)
  • Tony Low (University of Minnesota, USA)
  • Kosuke Nagashio (The University of Tokyo, Japan)
  • Jayakanth Ravichandran (University of Southern California, USA)
  • Ping-Heng Tan (Institute of Semiconductors, CAS, China)
  • Angela Hight Walker (National Institute of Standards and Technology, USA)
  • Peide Ye (Purdue University, USA)
  • Xu Zhang (Carnegie Mellon University, USA)
  • Wenjuan Zhu (University of Illinois at Urbana-Champaign, USA)

Symposium Organizers

Han Wang
University of Southern California
Electrical Engineering/Chemical Engineering and Material Science
2138214293, han.wang.4@usc.edu

Albert Davydov
National Institute of Standards and Technology
Materials Research Division
+1-3019754916, davydov@nist.gov

Jing Kong
Massachusetts Institute of Technology
Electrical Engineering and Computer Science
+1-6173244068, jingkong@mit.edu

Xinran Wang
Nanjing University
Electrical Engineering
+86-25-89681302, xrwang@nju.edu.cn