2021 MRS Spring Meeting

Meeting content will be available through May 31
at https://mrs2021.cd.pathable.com/.


All times listed are Eastern Daylight Time.

Symposium EL08 : Next-Generation Interconnects—Materials, Processes and Integration

2021-04-23   Show All Abstracts

Symposium Organizers

Silvia Armini, IMEC
Vincent Jousseaume, CEA-LETI
Eiichi Kondoh, University of Yamanashi
Andrew Simon, IBM T.J. Watson Research Center

Symposium Support

Bronze
MilliporeSigma
EL08.01: Metallization and Reliability I
Session Chairs
Silvia Armini
Andrew Simon
Friday PM, April 23, 2021
EL08

2:15 PM - EL08.01
Introductory Comments


Show Abstract

2:20 PM - *EL08.01.01
The Search for the Most Conductive Interconnect Metal <10 nm

Daniel Gall1

Rensselaer Polytechnic Institute1

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2:45 PM - EL08.01.02
Direct Printing of Metallic Interconnects at Micro/Mesoscale Using Localized Electrodeposition

Md Emran Hossain Bhuiyan1,Majid Minary1

The University of Texas at Dallas1

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3:00 PM - EL08.01.03
Advances in Lateral Copper Electroplated Metallic Tracks—Production and Applications by Using Hydrogen Evolution Assisted Electroplating

Sabrina Rosa1,Arash Takshi1

University of South Florida1

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3:15 PM - EL08.01.04
Two-Step Approach for Conformal Chemical Vapor-Phase Deposition of Ultra-Thin Conductive Silver Films

Sabrina Wack1,Petru Lunca Popa1,Noureddine Adjeroud1,Christèle Vergne1,Renaud Leturcq1

Luxembourg Institute of Science & Technology1

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3:30 PM - *EL08.01.05
New Frontiers in Metrology for Advanced Interconnect Technologies

Kavita Shah1

Nova Measuring Instruments1

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3:55 PM - EL08.01.06
High Mobility Monolithic InAs Integration on Amorphous Substrates at Low Temperature

Jun Tao1,Debarghya Sarkar1,Ragib Ahsan1,Rehan Kapadia1

University of Southern California1

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4:10 PM - EL08.01
Discussion Time


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EL08.02: Manufacturing/Dielectric
Session Chairs
Vincent Jousseaume
Andrew Simon
Friday PM, April 23, 2021
EL08

5:15 PM - *EL08.02.01
Low Temperature Direct Bonding Mechanisms

Vincent Larrey1

Univ. Grenoble Alpes, CEA, LETI1

Show Abstract

5:40 PM - EL08.02.02
Atomic Precision Advanced Manufacturing (APAM) of Ultra-Doped Nanostructures for Advanced CMOS Devices and Interconnects

David Scrymgeour1,Esther Frederick1,Connor Halsey1,DeAnna Campbell1,Evan Anderson1,Scott Schmucker1,Andrew Leenheer1,Xujiao Gao1,Jeffrey Ivie1,Tzu-Ming Lu1,Lisa Tracy1,Shashank Misra1

Sandia National Laboratories1

Show Abstract

5:55 PM - *EL08.02.03
Cryogenic Etching Applied to Next Generation Interconnects

Remi Dussart1,Thomas Tillocher1,Philippe Lefaucheux1

Université d'Orleans - CNRS1

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6:20 PM - EL08.02.04
Late News: Effect of Non-Corrosive Gas Mixture on Etching of Nanometer-Scale Patterned Cu Thin Film Using Pulsed Modulated RF Source Plasma

Ji Soo Lee1,Eun Taek Lim1,Sungyong Park1,Yun Seong Park1,Sung Hoo Cho1,Chee Won Chung1

Inha university1

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6:25 PM - EL08.02.05
Late News: Inductively Coupled Plasma Reactive Ion Etching of Nanometer-Scale Patterned Copper Thin Films Using Organic Materials

Sungyong Park1,Eun Taek Lim1,Ji Soo Lee1,Yun Seong Park1,Chee Won Chung1

Inha University1

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6:30 PM - EL08.02.06
Low Dielectric Constant SiCOH Films by Plasma Enhanced Chemical Vapor Deposition of tetrakis(trimethylsilyloxy)silane and cyclohexane Precursors

William Wirth1,Jacob Comeaux1,Seonhee Jang1

University of Louisiana at Lafayette1

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6:45 PM - EL08.02.07
Design of Mechanically Reliable and Fracture Resistant Low-K Dielectric Hybrid Glasses for Next Generation Interconnects

Karsu Kilic1,Reinhold Dauskardt1

Stanford University1

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7:00 PM - EL08.02
Discussion Time


Show Abstract

EL08.03: Metallization and Reliability II
Session Chairs
Eiichi Kondoh
Andrew Simon
Saturday AM, April 24, 2021
EL08

8:15 PM - *EL08.03.01
Low Temperature Deposition of Extremely Thin Barrier for Metallization Technology

Mayumi Takeyama1

Kitami Institute of Technology1

Show Abstract

8:40 PM - EL08.03
Break


8:55 PM - EL08.03.03
Late News: Electrical Breakdown and Morphology Dependent Charge Transport Properties in Single TiO2 Nanotubes

Sourav Kajli1,Debdutta Ray1,Somnath Roy1

Indian Institute of Technology Madras1

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9:10 PM - *EL08.03.04
Amorphous Si-Rich W Silicide as a New Barrier and Contact Material for Advanced CMOS

Naoya Okada1,Noriyuki Uchida1,Shinichi Ogawa1,Toshihiko Kanayama1

National Institute of Advanced Industrial Science and Technology1

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9:35 PM - EL08.03.05
Late News: Reliability Failure in Microelectronic Interconnects by Electric Current Induced Chemical Reaction

Sumit Kumar1,Randhir Kumar1,Praveen Kumar1,Rudra Pratap1

Indian Institute of Science Bangalore1

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9:40 PM - EL08.03
Discussion Time


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9:50 PM - *EL08.03.02
Electroless Ni Plating—A Viable Approach for Fine-Pitch, Large Aspect-Ratio Vertical Interconnection Fabrication for 3D-LSI Integration and Packaging

Mariappan Murugesan1,Takafumi Fukushima1,Mitsumasa Koyanagi1

Tohoku University1

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