2019 MRS Spring Meeting & Exhibit

Symposium EP03-Materials Strategies and Device Fabrication for Biofriendly Electronics

Biofriendly materials with unique properties (biocompatible, biodegradable, biomimetic, etc) enable novel electronic systems that could address critical issues when integrating with biology and the environment. For example, in an attempt to address long-lasting challenge of biointegration, biodegradable electronics represents an emerging class of technology with physical or chemical disappearance in active elements as a key characteristic, via a number of possible mechanisms including dissolution, de‐polymerization, metabolic action, or disintegration. On the other hand, bioinspiration has long been a motivation for scientists and engineers to develop novel design concepts and seek new paradigms for challenging problems. Combination of various biofriendly materials offers new pathway towards next-generation electronics that could offer a set of vital tools that are beneficial to human healthcare and the environment, potential opportunities including bioresorbable temporary medical implants, environmentally benign consumable electronics, etc.

Materials of interest for biofriendly electronics span a broad range, including biodegradable inorganics (semiconductors, metals), biopolymers, bio-inspired and biomimetic materials, stimuli-responsive materials, hybrid, etc. Representative examples of bio-friendly systems range from sensors, drug delivery vehicles, power harvesters, to various diagnostic and diagnostic/therapeutic electronic platforms. A variety of novel approaches are also proposed to integrate various bio-friendly materials, such as printing techniques, MEMS fabrication, and foundry compatible processing for advanced electronic system.

This symposium will cover a wide range of biodegradable and environmental friendly materials for electronic systems. The focus includes fundamental materials science, materials strategies, device architectures, fabrication schemes, and potential biomedical/environmental applications to integrate multifunctional biomaterials. Interdisciplinary topics related to physics, chemistry, materials science, and electrical engineering will further advance biofriendly electronic systems.


Topics will include:

  • Biodegradable materials and devices
  • Bioinspired and biomimetic materials and electronics
  • Synthesis and evaluation of biopolymers
  • Bio-materials for energy harvesting and storage
  • Novel fabrication schemes
  • Biomaterials/electronics interface
  • Environmentally friendly materials and “green” electronics

Invited Speakers:

  • Bozhi Tian (University of Chicago, USA)
  • Joseph Wang (University of California, San Diego, USA)
  • Roisin Owens (University of Cambridge, United Kingdom)
  • Mark Allen (University of Pennsylvania, USA)
  • Luis Fernando Bautista (University King Juan Carlos, Spain)
  • Christopher Bettinger (Carnegie Mellon University, USA)
  • Xinyan Cui (University of Pittsburgh, USA)
  • Gianluca Farinola (University of Bari, Italy)
  • Eric Glowacki (Linköping University, Sweden)
  • Jose Maria Gomez (Facultad de Ciencias, Universidad de Granada, Spain)
  • Francesco Greco (Graz University of Technology, Austria)
  • Xian Huang (Tianjin University, China)
  • Tatsuo Kaneko (Japan Advanced Institute of Science and Technology, Japan)
  • Seung-Kyun Kang (Korea Advanced Institute of Science and Technology, Republic of Korea)
  • Eric Masanet (Northwestern University, USA)
  • Clara Santato (Polytechnic of Montreal, Canada)
  • Bong-Sup Shim (Inha University, Republic of Korea)
  • Andrew Steckl (University of Cincinnati, USA)
  • Yufeng Zheng (Peking University, China)

Symposium Organizers

Hui Fang
Northeastern University
Electrical and Computer Engineering
USA

Gerardo Hernandez-Sosa
Karlsruhe Institute of Technology
Light Technology Institute
Germany

Mihai Irimia-Vladu
JOANNEUM RESEARCH Forschungsgesellschaft mbh
Institute for Surface Technologies and Photonics
Austria

Lan Yin
Tsinghua University
School of Materials Science and Engineering
China

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