2020 MRS Spring Meeting

Call for Papers

Symposium S.EL13-Processing, Microstructure and Multifunctioning of Organic Semiconductors

Organic semiconductors have gained enormous attention as an alternative or replacement for conventional inorganic semiconductors. Some key attributes of these carbon-based materials include endless choice of modifications at the molecular level, solution processability and compatibility with current printing technologies, abundance, and light weight. These features have led to the widespread adoption of organic semiconductors in new forms of electronic devices. This symposium aims to bring active researchers to discuss the main challenges in this field.

Solution processing has been a promising and primary technology for thin film formation in organic electronics, presumably because it can potentially deliver low cost, fast roll-to-roll printing processing. As an alternative, melt processing involves a reversible liquefaction-solidification process. It is broadly used in industry to produce plastic thin films, but little progress has been achieved in organic semiconductor thin films. In this symposium, the researchers will address the challenges in both solution and melt processing of organic semiconductors for organic electronics, regarding 1) molecular design and synthesis of molecular and polymeric semiconductors, 2) solution and melt processing of organic semiconductor thin films, 3) molecular packing and microstructural analysis of solution/melt-processed thin films, 4) patterning and manipulation technologies of organic semiconductor thin films, 5) charge transport and electrical properties of the resulting thin film devices, and 6) structure-processing-property relationships.

Topics will include:

  • Molecular design and synthesis of molecular and polymeric semiconductors
  • Organic semiconductor blends
  • Polycrystalline thin films vs single crystal thin films
  • Fluid dynamics and crystallization kinetics
  • Processing-property relationship
  • Microstructures of semiconducting thin films at different length scales
  • Mechanical properties of organic semiconductor thin films
  • Printing and patterning techniques of organic devices
  • Extreme temperature organic electronics
  • Integrated organic electronics

Invited Speakers:

  • Takeya Jun (The Universit of Tokyo, Japan)
  • Kilwon Cho (Pohang University of Science and Technology, Republic of Korea)
  • Alberto Salleo (Stanford University, USA)
  • Henning Sirringhaus (University of Cambridge, United Kingdom)
  • Deqing Zhang (Chinese Academy of Sciences, China)
  • Michael Chabinyc (University of California, Santa Barbara, USA)
  • Wen-chang Chen (National Taiwan University, Taiwan)
  • Ying Diao (University of Illinois at Urbana-Champion, USA)
  • Wenping Hu (Tianjing University, China)
  • Darren Lipomi (University of California, San Diego, USA)
  • Lynn Loo (Princeton University, USA)
  • Jonathan Rivnay (Northwestern University, USA)
  • Sahika Inal (King Abdullah University of Science and Technology, Saudi Arabia)
  • Eric Glowacki (Linköping University, Sweden)
  • Tae-Woo Lee (Seoul National University, Republic of Korea)
  • Aram Amassian (KAUST Solar Center, Saudi Arabia)
  • Hongzhen Chen (Zhejiang University, China)
  • Brian Collins (Washington State University, USA)
  • Bumjoon Kim (Korea Advanced Institute of Science and Technology, Republic of Korea)
  • Ting Lei (Peking Univeristy, China)
  • Jian Pei (Peking University, China)
  • Thomas Russell (University of Massachusetts Amherst, USA)
  • Ben Tee (National University of Singapore, Singapore)
  • Sihong Wang (The University of Chicago, USA)
  • Myung-Han Yoon (Gwangju Institute of Science and Technology, Republic of Korea)

Symposium Organizers

Jianguo Mei
Purdue University
Department of Chemistry
USA

Hanying Li
Zhejiang University
Department of Polymer Science and Engineering
China

Joon Hak Oh
Pohang University of Science and Technology
Department of Chemical Engineering
Republic of Korea

Erin Ratcliff
The University of Arizona
Department of Materials Science & Engineering
USA

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