2020 MRS Spring Meeting

Call for Papers

Symposium EQ02-Heterostructures of Various Dimensional Materials

Mixed dimensional heterostructures formed by stacking 0D, 1D, 2D, and 3D materials together can offer exciting multifunctionalities that cannot be otherwise obtained by pure 1D or 2D or 3D materials. Heterogenous integration can substantially alter the electrical, magnetic, optical, and thermal properties and result in tremendous intriguing functionalities. A great deal of efforts has been made to form unprecedented device architectures via heterostructuring various dimensional materials. To obtain heterostructured systems with high quality interfaces, significant progress has been made on in-situ growth or ex-situ transfer techniques. These are critical to obtain extensive and flexible designs of heterostructures. In this symposium, we provide the opportunity for speakers and audience to share the progress in research of various dimensional material heterostructures which include the methods for synthesis, growth, transfer, lift-off, and even scale-up. The goal of the symposium is to allow the community to come together to advance the heterostructuring concept from the existing 2D heterostructures to various dimensional heterostructures for electronic, photonic, and electrochemical applications.

The symposium will cover a complete range of topics related to heterogeneous integration of various dimensional materials from fundamentals to applications. Interdisciplinary topics related to physics, materials science and engineering will be connected by invited talks in order to accelerate the development of manufacturing of various dimensional heterostructures and their applications. The session will also be dedicated to motivate discussions toward emerging technology to develop new types of heterogeneously integrated structures using 0D, 1D, 2D, and 3D materials.

Topics will include:

  • Remote epitaxy and van der Waals epitaxy of semiconductors, complex oxides, and 2D materials
  • Lift-off technology (mechanical, optical, chemical)
  • Freestanding membrane technology
  • Large-scale synthesis of various dimensional materials (0D, 1D, 2D, 3D) and their hetero-structures
  • Heterogeneous integration and their applications
  • Heterogeneous integration of mixed dimensional materials
  • Optical, electrical and magnetic interaction at the hetero-interface
  • A tutorial complementing this symposium is tentatively planned.

Invited Speakers:

  • Jong-Hyun Ahn (Yonsei University, Republic of Korea)
  • Sang-hoon Bae (Washington University in St. Louis, USA)
  • Alexander Balandin (University of California, Riverside, USA)
  • Yi Cui (Stanford University, USA)
  • Xiangfeng Duan (University of California, Los Angeles, USA)
  • Peng Gao (Peking University, China)
  • Wanlin Guo (Nanjing University of Aeronautics and Astronautics, China)
  • Yue Hao (Xidian University, China)
  • Young Joon Hong (Sejong University, Republic of Korea)
  • Berangere Hoyt (Commissariat à l’énergie atomique et aux énergies alternatives, France)
  • Harold Hwang (Stanford University, USA)
  • Jason Kawasaki (University of Wisconsin–Madison, USA)
  • Wei Kong (Westlake University, China)
  • Hyunseong Kum (Yonsei University, Republic of Korea)
  • Ludovic Largeau (Université Paris-Saclay, France)
  • Chun Ning (Jeanie) Lau (The Ohio State University, USA)
  • Jinmin Li (Institute of Semiconductors, Chinese Academy of Sciences, USA)
  • Abdallah Ougazzaden (Georgia Institute of Technology, USA)
  • Jiwoong Park (The University of Chicago, USA)
  • Lianmao Peng (Peking University, USA)
  • Joshua Robinson (The Pennsylvania State University, USA)
  • Frances Ross (Massachusetts Institute of Technology, USA)
  • Jian Shi (Rensselaer Polytechnic Institute, USA)
  • Stephanie Tomasulo (U.S. Naval Research Laboratory, USA)
  • Rachael L. Myers Ward (U.S. Naval Research Laboratory, USA)
  • Mona Zebarjadi (University of Virginia, USA)
  • Yuanbo Zhang (Fudan University, China)

Symposium Organizers

Jeehwan Kim
Massachusetts Institute of Technology
Department of Mechanical Engineering

Kyusang Lee
University of Virginia

Xiuling Li
University of Illinois at Urbana-Champaign
Electrical and Computer Engineering

Feng Miao
Nanjing University
School of Physics

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