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Symposium EP12 : Materials Frontiers in Semiconductor Advanced Packaging

2016-03-29   Show All Abstracts

Symposium Organizers

Jianwei Dong, Dow Electronic Materials
Karlheinz Bock, TU Dresden
Johan Liu, Chalmers University of Technology
Daniel Lu, Henkel China
Nancy Stoffel, GE Global Research

Symposium Support

Dow Electronic Materials
EP12.1: Future of Semiconductor Advanced Packaging
Session Chairs
Jianwei Dong
Nancy Stoffel
Tuesday PM, March 29, 2016
PCC North, 200 Level, Room 226 A

1:30 PM - *EP12.1.01
The Future of Advanced Packaging

Rozalia Beica 1

1 Yole Developement Villeurbanne France,

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2:00 PM - *EP12.1.02
System Scaling as New Electronic Systems Frontier with Frontier Material

Rao Tummala 1,Markondeya Raj Pulugurtha 1,Venkatesh Sundaram 1,Vanessa Smet 1

1 Georgia Inst of Technology Atlanta United States,

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2:30 PM - *EP12.1.03
Material Challenges and Opportunities for Wafer-Form Advanced Packaging Technology

Douglas Yu 1,Kuo-Chung Yee 1,C. H. Tung 1

1 Taiwan Semiconductor Manufacturing Company Hsinchu Taiwan,

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3:00 PM -
BREAK

3:30 PM - *EP12.1.04
Sustainable Materials: From Nanoelectronics to the Cloud

Carol Handwerker 1

1 Purdue Univ West Lafayette United States,

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4:00 PM - *EP12.1.05
Material Technologies for Advanced Semiconductor Packaging

Itsuo Watanabe 1

1 Hitachi Chemical Co. America, Ltd. Cupertino United States,

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2016-03-30   Show All Abstracts

Symposium Organizers

Jianwei Dong, Dow Electronic Materials
Karlheinz Bock, TU Dresden
Johan Liu, Chalmers University of Technology
Daniel Lu, Henkel China
Nancy Stoffel, GE Global Research

Symposium Support

Dow Electronic Materials
EP12.2: Power Electronics and Thermal Management
Session Chairs
Johan Liu
Katsuaki Suganuma
Wednesday AM, March 30, 2016
PCC North, 200 Level, Room 226 A

9:00 AM - *EP12.2.01
Chip Embedding - The Key for Efficient Power Electronics Solutions

Rolf Aschenbrenner 1

1 Dept. SIIT Frauhofer IZM Berlin Germany,

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9:30 AM - *EP12.2.02
Silver Sinter Joining for WBG Die-Attach

Katsuaki Suganuma 1,Shoji Nagao 1,Toru Sugahara 1,Emi Yokoi 1,Hao Zhang 1,Jinting Jiu 1,Shih Lin 2

1 Osaka Univ Osaka Japan,2 National Cheng Kung University Tainan Taiwan

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10:00 AM - EP12.2.03
Frequency and Temperature Dependence of the Complex Permittivity of Engineered Dielectric Fluids

Ya Guo 1,Rujun Bai 1,Thomas Stegeman 1,Michael Hamilton 1

1 Auburn University Auburn United States,

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10:15 AM -
BREAK

10:45 AM - *EP12.2.04
Thermal Properties of 1D and 2D Nanomaterials for Electronics: Carbon Nanotubes, Graphene, BN, MoS2

Eric Pop 1,Zuanyi Li 1,Feifei Lian 1,Feng Xiong 1,Aditya Sood 2,Runjie Xu 1,Rachel Luo 1,Yi Cui 3,Kenneth Goodson 2

1 Electrical Engineering Stanford University Stanford United States,2 Mechanical Engineering Stanford University Stanford United States3 Materials Science amp; Engineering Stanford University Stanford United States

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11:15 AM - EP12.2.05
Designing 2D Heterostructures of Graphene and h-BN to Facilitate Thermal Dissipation

Alexander Pak 1,Gyeong Hwang 1

1 Univ of Texas-Austin Austin United States,

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11:30 AM - EP12.2.06
Stability and Properties of PET Films in Electronics Applications under Hygrothermal Environments

Laura Frisk 1,Sanna Lahokallio 1,Janne Kiilunen 1,Kirsi Saarinen-Pulli 1

1 Tampere University of Technology Tampere Finland,

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EP12.3: Advanced Interconnects and Reliability
Session Chairs
King-Ning Tu
Ching Ping Wong
Wednesday PM, March 30, 2016
PCC North, 200 Level, Room 226 A

1:30 PM - *EP12.3.01
Electromigration and Joule Heating in Mobile Technology

King-Ning Tu 1,Yingxia Liu 1,Menglu Li 1

1 Univ of California-Los Angeles Los Angeles United States,

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2:00 PM - EP12.3.02
High-Performance Multi-Functional Hybrid Layer for Copper Adhesion and Stress-Migration for Advanced Packaging

Qiran Xiao 1,Reinhold Dauskardt 1

1 Stanford University Stanford United States,

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2:15 PM - EP12.3.03
Electromigration Phenomena in Ag and Cu Lines Printed Using Self-Reducing Reactive Inks

Christopher Lefky 1,Zhao Zhao 1,Avinash Mamidanna 1,Anoosha Murella 1,Terry Alford 1,Owen Hildreth 1

1 Arizona State Univ Tempe United States,

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2:30 PM - EP12.3.04
Scaling of Sn/Cu Solder Joints Down to 1 μm in Diameter

Yingxia Liu 1,King-Ning Tu 1

1 UCLA Los Angeles United States,

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2:45 PM - EP12.3.05
Chemical Effect on Diffusion in Intermetallic Compounds

Yi-Ting Chen 1,King-Ning Tu 1

1 UCLA Los Angeles United States,

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3:00 PM -
BREAK

3:30 PM - *EP12.3.06
Recent Advances on Metal-Assisted Chemical Etching (MaCE) for High Performance through Silicon Vias (TSV) Applications

Liyi Li 1,Owen Hildreth 2,Ching-Ping Wong 1

1 School of Materials Science and Engineering Georgia Institute of Technology Atlanta United States,2 Arizona State University Tempe United States

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4:00 PM - EP12.3.07
Epoxy Molding Compound for FOWLP

Hironori Kurauchi 1,Ken Ukawa 2

1 Sumitomo Plastics America Inc. Santa Clara United States,2 Electrical Device Materials Lab Taiwan Sumitomo Bakelite (Taiwan) Co., Ltd Kaohsiung Taiwan

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4:15 PM - EP12.3.08
Performance of Anisotropically Conductive Adhesive Attached Sensor Packages on Adhesiveless Polyimide Substrate during High Temperature Storage Tests

Sanna Lahokallio 1,Laura Frisk 1

1 Tampere University of Technology Tampere Finland,

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4:30 PM - EP12.3.09
Effect of Kirkendall Void and Porous Cu3Sn Formation on Mechanical Properties of IMC-Based Micro-Joints

Yaodong Wang 1,King-Ning Tu 1

1 University of California at Los Angeles Los Angeles United States,

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4:45 PM - EP12.3.10
Anisotropic Conductive Adhesive Flip Chip Attached Humidity Sensors under Harsh Humid Conditions

Laura Frisk 1,Sanna Lahokallio 1,Milad Mostofizadeh 1,Anniina Parviainen 1,Janne Kiilunen 1

1 Tampere University of Technology Tampere Finland,

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EP12.4: Poster Session: Material Frontiers in Semiconductor Advanced Packaging
Session Chairs
Jianwei Dong
Nancy Stoffel
Wednesday PM, March 30, 2016
Sheraton, Third Level, Phoenix Ballroom

8:00 PM - EP12.4.01
Impact of Processing Parameters on Resistivity and Morphology of Printed Low-Temperature Copper Inks

Anoosha Murella 1,Yiwen Huang 1,Avinash Mamidanna 1,Owen Hildreth 1

1 Arizona State Univ Tempe United States,

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8:00 PM - EP12.4.02
Low Dielectric Constant and Loss Siloxane-Based Polymer Matrix for High Frequency Copper Clad Laminates

Yong Ho Kim 1,Young Woo Lim 1,Byeong-Soo Bae 1

1 KAIST Daejeon Korea (the Republic of),

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8:00 PM - EP12.4.04
Improvement in Solubility and Molecular Assembly of PCDT-BT via Side Chain Engineering

Jungho Lee 2,Kyu Cheol Lee 2,Sang Myeon Lee 2,Changduk Yang 2

2 Ulsan National Institute of Science and Technology (UNIST) Ulsan Korea (the Republic of),

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8:00 PM - EP12.4.05
New Precursor Design for Low-Cost CVD Graphene Growth

Fan Yang 1,Eui Sang Song 1,Nikhil Jain 1,Bin Yu 1

1 SUNY Polytechnic Institute CNSE Albany United States,

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2016-03-31   Show All Abstracts

Symposium Organizers

Jianwei Dong, Dow Electronic Materials
Karlheinz Bock, TU Dresden
Johan Liu, Chalmers University of Technology
Daniel Lu, Henkel China
Nancy Stoffel, GE Global Research

Symposium Support

Dow Electronic Materials
EP12.5: Organic, Flexible and Wearable Electronics
Session Chairs
Rozalia Beica
Nancy Stoffel
Thursday AM, March 31, 2016
PCC North, 200 Level, Room 226 A

8:45 AM - *EP12.5.01
Progress in Polymer Semiconductor Materials and Processes for Printed Transistors

Beng Ong 1,Yanlian Lei 2,Fu Rong Zhu 2

1 Chemistry Hong Kong Baptist University Kowloon Hong Kong,2 Physics Hong Kong Baptist University Kowloon Tong Hong Kong

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9:15 AM - *EP12.5.02
Reliable Interfaces and Encapsulations for Ultrathin Organic Devices

Takao Someya 1,Sunghoon Lee 1,Tomoyuki Yokota 1

1 Univ of Tokyo Tokyo Japan,

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9:45 AM - EP12.5.03
Novel Silver-Polymer Blend with High Conductivity and Stretchability for Flexible Interconnects

Jignesh Vanjaria 1,Todd Houghton 1,Hongbin Yu 1

1 Arizona State University Tempe United States,

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10:00 AM -
BREAK

10:30 AM - *EP12.5.04
Introduction to NextFlex: America's Flexible Hybrid Electronics Manufacturing Institute

Benjamin Leever 1,Eric Forsythe 2

1 Air Force Research Laboratory Wright-Patterson United States,2 Army Research Laboratory Adelphi United States

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11:00 AM - *EP12.5.05
Silica Sheets in Novel Format for Flexible Electronics

Dan Hawtof 1

1 Corning, Inc. Painted Post United States,

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11:30 AM - EP12.5.06
Drop-on-Demand Printing of SiO2 Dielectrics from Sol-gel Chemistries

Yiwen Huang 1,Owen Hildreth 1

1 Arizona State Univ Tempe United States,

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11:45 AM - EP12.5.07
Inkjet Printed Serpentine Stretchable Electronics Using Reactive Ink Chemistries

Avinash Mamidanna 1,Zeming Song 1,Cheng Lv 1,Christopher Lefky 1,Hanqing Jiang 1,Owen Hildreth 1

1 Arizona State University Tempe United States,

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