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Symposium MD10 : Micro-Assembly Technologies

2016-03-30   Show All Abstracts

Symposium Organizers

Seok Kim, University of Illinois at Urbana-Champaign
Takafumi Fukushima, Tohoku University
Gregory Whiting, Palo Alto Research Center
Quan Zhou, Aalto University
MD10.1: Micro-Assembly, Transfer Printing, Interconnections and Devices I
Session Chairs
Seok Kim
Gregory Whiting
Wednesday AM, March 30, 2016
PCC West, 100 Level, Room 105 C

8:30 AM - *MD10.1.01
Elastomeric Transfer Printing vs. Mobile Microrobotic Assembly

Metin Sitti 1

1 Max Planck Institute for Intelligent Systems Stuttgart Germany,

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9:00 AM - *MD10.1.02
Dexterous and Non-Contact Micromanipulation: Two Ways for Micro-Nano-Assembly

Michael Gauthier 1

1 FEMTO-ST Institute Besancon France,

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9:30 AM - MD10.1.03
Lego-Like Microassembly of Micro Scale Heterogeneous Materials

Hohyun Keum 1,Seok Kim 1

1 Mechanical Engineering University of Illinois Urbana-Champaign Urbana United States,

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9:45 AM - MD10.1.04
Heterogeneous Integration of Semiconductor Devices by Micro-Transfer-Printing – Recent Advances

Kanchan Ghosal 1,David Gomez 1,Matthew Meitl 1,Salvatore Bonafede 1,Carl Prevatte 1,Tanya Moore 1,Brook Raymond 1,David Kneeburg 1,Alin Fecioru 2,Antonio Trinidade 2,Christopher Bower 1

1 X-celeprint Inc. RTP United States,2 X-Celeprint Ltd. Cork Ireland

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10:00 AM -
BREAK

10:30 AM - *MD10.1.05
Assembly on a MEMS Scale Using Magnetic Field

Isao Shimoyoama 1

1 University of Tokyo Tokyo Japan,

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11:00 AM - MD10.1.06
Fan-Out Packaging of Microdevices Assembled Using Micro-Transfer-Printing

Matthew Lueck 1,Alan Huffman 1,Paul Hines 1,John Lannon 1,Salvatore Bonafede 2,Christopher Bower 2

1 RTI International Research Triangle Park United States,2 X-Celeprint Research Triangle Park United States

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11:15 AM - MD10.1.07
Gallium-Gold Liquid-Solid Biphasic Thin Film Interconnects for Robust Stretchable Circuits

Arthur Hirsch 1,Hadrien Michaud 1,Aaron Gerratt 1,Severine De Mulatier 1,Stephanie Lacour 1

1 EPFL Lausanne Switzerland,

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11:30 AM - MD10.1.08
High-Resolution Printing of Copper Interconnects on Flexible Substrates

Feihuang Fang 1,Chaoyi Peng 1,Manish Tiwari 1

1 Nanoengineered Systems Laboratory, UCL Mechanical Engineering University College London London United Kingdom,

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11:45 AM - MD10.1.09
Pressure-Activated Electrical Interconnections Formed During Elastomer Stamp Micro-Transfer-Printing

Kanchan Ghosal 1,Carl Prevatte 1,Matthew Meitl 1,David Gomez 1,Salvatore Bonafede 1,Brook Raymond 1,Tanya Moore 1,Paul Hines 2,Christopher Bower 1

1 X-celeprint Inc. RTP United States,2 RTI International RTP United States

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MD10.2: Micro-Assembly, Transfer Printing, Interconnections and Devices II
Session Chairs
Seok Kim
Gregory Whiting
Wednesday PM, March 30, 2016
PCC West, 100 Level, Room 105 C

1:30 PM - *MD10.2.01
Active Composite Membranes

Placid Ferreira 1,Nishana Ishmail 1,Numair Ahmed 1

1 University of Illinois at Urbana-Champaign Urbana United States,

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2:00 PM - *MD10.2.02
High Performance Flexible Silicon Photovoltaics Enabled with Micro-Transfer Printing

Jongseung Yoon 1

1 Univ of Southern California Los Angeles United States,

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2:30 PM - MD10.2.03
Microassembly on Conductive Elastomers and Its Application to a Tip-Tilt-Piston Micromirror

Zining Yang 1,Seok Kim 1

1 Mechanical Science and Engineering University of Illinois at Urbana-Champaign Urbana United States,

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2:45 PM - MD10.2.04
Single Build Processed 3D Printed Device with Low-Melting Metal Composites

Kimball Andersen 1,Woo Soo Kim 1

1 Simon Fraser Univ Surrey Canada,

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3:00 PM -
BREAK

3:30 PM - *MD10.2.05
Electrophotography and Micro Assembly - Printing as a Massive Parallel, Digital Manufacturing Process

J. Lu 1,Julie Bert 1,Gregory Burton 1,Ion Matei 1,Patrick Maeda 1,Saigopal Nelaturi 1,Lara Crawford 1,Gregory Whiting 1,David Biegelsen 1,Sourobh Raychaudhuri 1,Rene Lujan 1,Qian Wang 1,Yu Wang 1,Janos Veres 1,Armin Volkel 1,Eugene Chow 1

1 PARC, a Xerox Company Palo Alto United States,

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4:00 PM - MD10.2.06
Process Capability and Elastomer Stamp Lifetime in Micro Transfer Printing

Kanchan Ghosal 1,David Gomez 1,Matthew Meitl 1,Salvatore Bonafede 1,Carl Prevatte 1,Tanya Moore 1,Brook Raymond 1,David Kneeburg 1,Alin Fecioru 2,Antonio Trinidade 2,Christopher Bower 1

1 X-celeprint Inc. RTP United States,2 X-Celeprint Ltd. Cork Ireland

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4:15 PM - MD10.2.07
High Resolution Electrohydrodynamic Printing of Silver and Glass Reactive Inks

Christopher Lefky 1,Galen Arnold 1,Owen Hildreth 1

1 Arizona State Univ Tempe United States,

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4:30 PM - MD10.2.08
#xD; Friction-Controlled Positioning of Silicon Nanowires for Large-Scale Device Fabrication

Daniel Rosskopf 1,Steffen Strehle 1

1 Ulm University Ulm Germany,

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MD10.3: Poster Session: Micro-Assembly Technologies
Session Chairs
Seok Kim
Wednesday PM, March 30, 2016
Sheraton, Third Level, Phoenix Ballroom

8:00 PM - MD10.3.01
Polymer/Clay Nanocomposite Self–Assembly Approach for Gas Barrier Film Applications

Maedeh Dabbaghianamiri 1,Caleb Martin 1,Gary Beall 1

1 Texas State University San Marcos United States,

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8:00 PM - MD10.3.02
Fast Self-Assembly of Pristine Large-Area Graphene Film on Liquid-Air Interface

Taeyeong Yun 1,Taewoo Jeon 1,Gil Yong Lee 1,Seung Keun Cha 1,Sang Ouk Kim 1

1 Materials Science amp; Engineering KAIST Daejeon Korea (the Republic of),

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8:00 PM - MD10.3.03
Cold-Drawing of Multimaterial Fibers and Films to Produce Micro- and Nanoparticles

Joshua Kaufman 1,Soroush Shabahang 1,Guangming Tao 1,Yangyang Qiao 1,Lei Wei 2,Thomas Bouchenot 1,Ali Gordon 1,Yoel Fink 2,Yuanli Bai 1,Robert Hoy 3,Ayman Abouraddy 1

1 Univ of Central Florida Orlando United States,2 Massachusetts Institute of Technology Cambridge United States3 University of South Florida Tampa United States

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8:00 PM - MD10.3.04
Amphiphilic 4-Hydroxy-1,3-thiazoles – Building Blocks for Hierarchically Structured Active Layers in Organic Solar Cells and OLED‘s

Martin Kaufmann 2,Stefan Fischer 2,Dieter Weiss 1,Rainer Beckert 1,Benjamin Dietzek 3,Martin Presselt 2,Helmar Gorls 4

1 Institute for Organic Chemistry and Makromolecular Chemistry Jena Germany,2 Institute of Physical Chemistry Jena Germany,2 Institute of Physical Chemistry Jena Germany1 Institute for Organic Chemistry and Makromolecular Chemistry Jena Germany2 Institute of Physical Chemistry Jena Germany,3 Leibniz Institute of Photonic Technology Jena Germany4 Institute of Inorganic and Analytical Chemistry Jena Germany

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8:00 PM - MD10.3.05
Soft Micropatterning of 2D Materials Using a Flexible Polymer Stamp

Deepak Ganta 1,Sanjiv Sinha 2,Chris Marry 2

1 Texas Aamp; M International University Laredo United States,2 University of Illinois Urbana Champaign Champaign United States

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8:00 PM - MD10.3.06
Instant Wet-spinning of Graphene Microfibers by Interfacial Assembly with Branched Cationic Polymers

Kyueui Lee 1,Haeshin Lee 1

1 Department of Chemistry Korea Advance Institute of Science and Technology (KAIST) Daejeon Korea (the Republic of),

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8:00 PM - MD10.3.07
Roll-to-Roll Printing of Chemically Reduced Graphene Oxide Using Shear-Induced Transfer

Hyun-woo Jang 1,Woo Soo Kim 1

1 Simon Fraser Univ Surrey Canada,

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2016-03-31   Show All Abstracts

Symposium Organizers

Seok Kim, University of Illinois at Urbana-Champaign
Takafumi Fukushima, Tohoku University
Gregory Whiting, Palo Alto Research Center
Quan Zhou, Aalto University
MD10.4: Fluidic, Self-Assembly, Novel Materials and Applications I
Session Chairs
Takafumi Fukushima
Quan Zhou
Thursday AM, March 31, 2016
PCC West, 100 Level, Room 105 C

9:30 AM - *MD10.4.02
Capillary Self-Assembly for 3D Heterogeneous System Integration and Packaging

Yuka Ito 1,Takafumi Fukushima 2,Kang-Wook Lee 2,Tetsu Tanaka 2,Mitsumasa Koyanagi 2

1 Sumitomo Bakelite Co., LTD. Shinagawa-ku Japan,2 Tohoku University Sendai Japan

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10:00 AM - MD10.4.03
Blown Bubble Assembly of Nanomaterials and Graphene-Hybridized Structures for Advanced Electronic Nanodevices

Shiting Wu 1,Anyuan Cao 1

1 Peking University Beijing China,

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10:15 AM - MD10.4.04
Surface Mediated Synthesis of Reconfigurable Shape-Shifting Nanoscale to Microscale Fullerene Self-Assemblies for Energy Applications

Selene Sandoval 1,Tony Gnanaprakasa 1,Deepak Sridhar 1,Pierre Deymier 1,Srini Raghavan 1,Krishna Muralidharan 1

1 University of Arizona Tucson United States,

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10:30 AM -
BREAK

11:00 AM - MD10.4.05
Surface-Tension Driven Self-Transport and Self-Alignment of Microchips on Patterned Superhydrophobic Surfaces

Bo Chang 2,Quan Zhou 1,Ali Shah 1,Robin Ras 1,Klas Hjort 2

1 Aalto University Espoo Finland,2 Uppsala University Uppsala Sweden,1 Aalto University Espoo Finland2 Uppsala University Uppsala Sweden

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11:15 AM - MD10.4.06
Non-Contact Location System for Precision Placement Of Nanostructures in EHD Printing

Galen Arnold 1,Christopher Lefky 1,Owen Hildreth 1

1 Arizona State University Tempe United States,

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11:30 AM - MD10.4.07
Highly Ordered Honeycomb Patterns Fabricated via an Improved Phase Separation Method

Van Tien Bui 1,Ho Suk Choi 1

1 Chungnam National University Daejeon Korea (the Republic of),

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MD10.5: Fluidic, Self-Assembly, Novel Materials and Applications II
Session Chairs
Takafumi Fukushima
Quan Zhou
Thursday PM, March 31, 2016
PCC West, 100 Level, Room 105 C

1:30 PM - *MD10.5.01
The Market Trend of Device Miniaturization and the Microelectronics Packaging Development

Hideki Kitsukawa 1,Atsushi Kawakami 1,Kenzo Kawai 1,Mitsuyoshi Hikono 1,Hideki Fujiwara 1,Tatsuto Kumagai 1

1 IM Operations YAMAHA MOTOR CO.,LTD. Hamamatsu Japan,

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2:00 PM - MD10.5.02
Acoustophoretic Printing

Daniele Foresti 1,Jennifer Lewis 1

1 Harvard Cambridge United States,

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2:15 PM - MD10.5.03
Multifurcation Assembly of Charged Aerosols

Yongjun Bae 2,Hyesung Cho 2,Mansoo Choi 2

1 Seoul National Univ Seoul Korea (the Republic of),2 Global Frontier Center for Multiscale Energy System Seoul Korea (the Republic of),

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2:30 PM - MD10.5.04
Magneto–Acoustic Hybrid Nanomotor: Dynamic Actuation and Assembly of Nanomaterials under Complex External Stimuli

Jinxing Li 1,Wenjuan Liu 1,Joseph Wang 1

1 NanoEngineering Univ of California-San Diego La Jolla United States,

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2:45 PM - MD10.5.05
Colloidal Additive Manufacturing Using Projection-Based Light Directed Electrophoretic Deposition

Andrew Pascall 1,Jeronimo Mora 1,Brian Giera 1,Joshua Kuntz 1

1 Lawrence Livermore National Lab Livermore United States,

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3:00 PM -
BREAK

3:30 PM - *MD10.5.06
Photonic Chip-to-Chip Precision Alignment Using Integrated MEMS

Marcel Tichem 1

1 Department Precision and Microsystems Engineering Delft University of Technology Delft Netherlands,

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4:00 PM - MD10.5.07
Controlled Three-Dimensional Clustering of Janus Cylinders by Convex Curvature and Hydrophobic Interactions

MyungSeok Oh 1,Jongmin Kim 2,Chang-Hyung Choi 3,Sung-Min Kang 2,Moo Jin Kwak 1,Jae Bem You 1,Sung Gap Im 1,Chang-Soo Lee 2

1 KAIST Daejeon Korea (the Republic of),2 Chungnam National University Daejeon Korea (the Republic of)3 Harvard University Boston United States

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4:15 PM - MD10.5.08
Wafer-Scaled Alignment for Unpurified Solution-Processed Single Walled Carbon Nanotubes and Its Purification for Ultra-High Purity of CNT Wafers

Geun Woo Baek 1,Yoon Gy Hong 1,In Jae Yim 1,Sung Hun Jin 1

1 Incheon National University Incheon Korea (the Republic of),

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4:30 PM - MD10.5.09
Three-Dimensional Graphene-Based Composite for Elastic Strain Sensor Applications

Jinhui Li 1,Guoping Zhang 1,Rong Sun 1,Ching Ping Wong 3

1 Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences Shenzhen China,2 School of Materials Science and Engineering, Georgia Institute of Technology Atlanta United States,3 Department of Electronic Engineering, Faculty of Engineering The Chinese University of Hong Kong Hong Kong China

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