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2008 MRS Spring Meeting & Exhibit

March 24-28, 2008 | San Francisco
Meeting Chairs: Jeffrey C. Gelpey, Robert J. Hamers, Paul Muralt, Christine A. Orme

Symposium N : Materials and Processes for Advanced Interconnects for Microelectronics

2008-03-25   Show All Abstracts

Symposium Organizers

Jeff Gambino IBM Microelectronics
Sinichi Ogawa Semiconductor Leading Edge Technologies, Inc.
Chee Lip Gan Nanyang Technological University
Zsolt Tokei IMEC vzw
N1: Low-k Dielectrics I
Session Chairs
Jeff Gambino
Chee Lip Gan
Tuesday PM, March 25, 2008
Room 2024 (Moscone West)

9:15 AM - **N1.1
Molecular-level Manipulation Technology for Low-k Dielectrics Controlling the Physical and Chemical Structures toward 32nm-node BEOLs.

Yoshihiro Hayashi 1
1 Device Platforms Research Laboratories, NEC, Sagamihara, Kanagawa, Japan

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9:45 AM - N1.2
Molecular Network Reinforcement of Sol-gel Glasses.

Geraud Dubois 1 , Willi Volksen 1 , Teddie Magbitang 1 , Robert Miller 1 , David Gage 2 , Reinhold Dauskardt 2
1 Department of Advanced Organic Materials, IBM, San Jose, California, United States, 2 Department of Materials Science and Engineering, Stanford University, Stanford, California, United States

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10:00 AM - N1.3
Zeolite-like Films for Low-k Applications.

Salvador Eslava 1 3 , Mikhail Baklanov 1 , Francesca Iacopi 1 , Jone Urrutia 1 , Abheesh Busawon 1 , Christine Kirschhock 2 , Karen Maex 1 3 , Johan Martens 2
1 , IMEC, Leuven Belgium, 3 ESAT-INSYS, K. U. Leuven, Leuven Belgium, 2 Centrum voor Oppervlaktechemie en Katalyse, K. U. Leuven, Leuven Belgium

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10:15 AM - N1.4
Atomic Layer Deposition of Hybrid or Microporous Low-k Materials.

Ying-Bing Jiang 1 , Zhu Chen 2 , David Kissel 1 2 , Shisheng Xiong 2 , Juewen Liu 2 , Carlee Ashley 1 2 , Eric Carnes 1 2 , Darren Dunphy 1 2 , Robin Swell 1 , Joseph.L. Cecchi 2 , C.Jeffrey. Brinker 1
1 Dept. 1815, Sandia National Labs, Albuquerque, New Mexico, United States, 2 Center of Microengineered Materials and Dept. ChNE, Univ. of New Mexico, Albuquerque, New Mexico, United States

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10:30 AM - **N1.5
Porosity Characteristics of Ultralow Dielectric Insulator Films Directly Patterned by Nanoimprint Lithography.

Hyun Wook Ro 1 , Hae-Jeong Lee 1 , Ken-Ichi Nihara 2 , Hiroshi Jinnai 2 , David Gidley 3 , Do Yoon 4 , Christopher Soles 1
1 Polymers Division, NIST, Gaithersburg, Maryland, United States, 2 Polymer Science and Engineering, Kyoto Institute of Technology, Kyoto Japan, 3 Physics, University of Michigan, Ann Arbor, Michigan, United States, 4 Chemistry, Seoul National University, Seoul Korea (the Republic of)

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11:00 AM - N1:Low-k1
Break

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11:15 AM - **N1.6
Advanced Bilayer Low-k Dielectric Cap for Reliable High Performance Cu-Low k Interconnects in ULSI Devices.

Son Nguyen 1 2 , Shobha Hosadugra 1 , Alfred Grill 2 , Joshua Herman 1 , Griselda Bonilla 2 , Stephan Cohen 2 , Eva Simonyi 2 , Thomas Shaw 2 , Steven Molis 3 , Chao-Kun Hu 2 , Nancy Klymko 3 , Tien Cheng 3 , Sang Lee 4 , Maggie Le 4 , Li-Qun Xia 4 , Ritwik Bhatia 4 , Steven Reiter 4
1 IBM at Albany Nano Tech, IBM Research, Albany, New York, United States, 2 Silicon Technology, IBM T.J. Watson Research Center, Yorktown Heights, New York, United States, 3 SRDC, IBM System Technology Group, Hopewell Junction, New York, United States, 4 Blanket CVD, Applied Materials, Santa Clara, California, United States

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11:45 AM - N1.7
Study on the Thermal Stability of Pore Structure in a Porous Low-k in a Copper/Low-k Interconnect Pattern - Correlation with Thermal Stress.

Woong Ho Bang 1 , Choong-Un Kim 1 , Kyu Hwan Oh 2 , Hee Suk Chung 2 , Eun Kyu Her 2
1 Materials Science and Engineering, University of Texas at Arlington, Arlington, Texas, United States, 2 Materials Science and Engineering, Seoul National University, Seoul Korea (the Republic of)

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12:00 PM - N1.8
Copper Treatment to Improve Adhesion to Dielectric Barrier.

Raymond Vrtis 1 , Laura Matz 1 , Mark O'Neill 1
1 Electronics, Air Products and Chemicals Inc., Allentown, Pennsylvania, United States

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12:15 PM - N1.9
The Effects of Porosity on the Stiffness and Fracture Toughness of Brittle Organosilicates.

Han Li 1 , Youbo Lin 2 , Joost Vlassak 1
1 School of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts, United States, 2 Department of Chemistry and Chemical Biology, Harvard University, Cambridge, Massachusetts, United States

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12:30 PM - N1.10
The Mechanical Properties of Organosilicates: Effects of Methyl and Methylene via Theory & Simulations.

Brian Peterson 1 , Mary Haas 1 , Mark O'Neill 1
1 , Air Products & Chemicals, Inc., Allentown, Pennsylvania, United States

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2008-03-27   Show All Abstracts

Symposium Organizers

Jeff Gambino IBM Microelectronics
Sinichi Ogawa Semiconductor Leading Edge Technologies, Inc.
Chee Lip Gan Nanyang Technological University
Zsolt Tokei IMEC vzw
N9: Poster Session: Reliability and Packaging II
Session Chairs
Thursday PM, March 27, 2008
Salon Level (Marriott)

9:00 PM - N9.1
Using a Flash Process to Reduce RC Delay and Improve Electromigration in Al-Cu/Ti/W Interconnect for High Power Analog and Mixed Signal Applications.

Tom Lee 1 , William Murphy 2 , Daniel Delibac 3 , David Thomas 3 , Daniel Vanslette 4 , Zhong-Xiang He 5 , Stephen Mongeon 6 , Jonathan Chapple-Sokol 7 , Timothy Sullivan 8 , Stephen Luce 9
1 N65V, IBM, Essex Junction, Vermont, United States, 2 AZQV, IBM, Essex Junction, Vermont, United States, 3 A9UV, IBM, Essex Junction, Vermont, United States, 4 BEVV, IBM, Essex Junction, Vermont, United States, 5 E1AA, IBM, Essex Junction, Vermont, United States, 6 UFYV, IBM, Essex Junction, Vermont, United States, 7 AZZV, IBM, Essex Junction, Vermont, United States, 8 CLVV, IBM, Essex Junction, Vermont, United States, 9 FHFV, IBM, Essex Junction, Vermont, United States

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9:00 PM - N9.10
Study of Migration in W/TiN/Ti Metal Lines Induced by Extremely High Electrical Current.

Deokkee Kim 1 , Soo-Jung Hwang 1 , Jung-Hun Sung 1 , Sung-Yup Jung 2 , Ha-Young You 2 , Young-Chang Joo 2 , Hyuksoon Choi 1 , Ihun Song 1 , Chan-Hee Lee 1 , Yoondong Park 1
1 , SAIT, Yongin Korea (the Republic of), 2 Materials Science & Engineering, Seoul National University, Seoul Korea (the Republic of)

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9:00 PM - N9.11
Pore Deformation in Porous low-k Dielectrics Induced by Thermal Stress.

Suk Hoon Kang 1 , Seul-Cham Kim 1 , Kyu Hwan Oh 1 , Liangshan Chen 2 , Woong Ho Bang 2 , Choong-Un Kim 2
1 , School of Materials Science and Engineering, Seoul National University, 56-1 Shillim-Dong, Gwanak-Gu , Seoul Korea (the Republic of), 2 , Materials Science Engineering,The University of Texas at Arlington, Arlington, Texas, United States

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9:00 PM - N9.12
Evaluation of Properties for Tantalum and Niobium Solid-electrolyte Capacitors.

Jae Sik Yoon 1 , Yang Soo Kim 1 , Hyung Park 2 , Byung Il Kim 1
1 , Korea Basic Science Institute, Sunchon, Jeonnam, Korea (the Republic of), 2 , Core Technology Research Center for Fuel Cell, Jeonbuk Korea (the Republic of)

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9:00 PM - N9.2
Electromigration of Cu Interconnect Lines Prepared by a Plasma-based Etch Process.

Guojun Liu 1 , Yue Kuo 1
1 Thin Film Nano & Microelectronics Research Laboratory, Texas A&M University, College Station , Texas, United States

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9:00 PM - N9.3
Semiconductor Film Bonding Technology and Application in Two-axis Hall Sensor Fabrication.

Keishin Koh 1 , Takashi Matushida 1 , Koji Hohkawa 1
1 , Kanagawa Institute of Technology, Atsugi Japan

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9:00 PM - N9.4
Formation and Electrical Characterization of Cu Through-Vias for Chip Stack Packages with Variations of Electrodeposition Parameters.

Kwang-Yong Lee 1 , Teck-Su Oh 1 , Tae-Sung Oh 1
1 Materials Science and Engineering, Hongik University, Seoul Korea (the Republic of)

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9:00 PM - N9.5
Modelling and Characterization of Ultrasonic Consolidation Process of Aluminium Alloys.

Elaheh Ghassemieh 1 , Amir Siddiq 1
1 Mechanical Engineering, University of Sheffield, Sheffiled United Kingdom

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9:00 PM - N9.6
Estimating Thermal Resistance of Solder Joints in Light Emitting Diode (LED) Packages.

Jin-Woo Park 2 , Young-Bok Yoon 1
2 Materials Science and Engineering, Yonsei University, Seoul Korea (the Republic of), 1 Fundamental Technology Center, Samsung Electro-Mechanics, Suwon Korea (the Republic of)

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9:00 PM - N9.7
Effect of Cu Doping on Thermal Stability Improvement of Silver Metallization.

Gwan Ho Jung 1 , Jun Ho Son 1 , Jong-Lam Lee 1
1 Materials Science and Engineering, POSTECH, Pohang, Gyungbuk, Korea (the Republic of)

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9:00 PM - N9.8
Interfacial Behavior between Au Deposits and Electronic Substrates by Utilizing Au Nanoparticle Suspension.

Tzu Hsuan Kao 1 4 , Jenn Ming Song 2 , In Gann Chen 1 4 , Teng Yuan Dong 3 , Weng Sing Hwang 1 4
1 Materials Science and Engineering, National Cheng Kung University, Tainan Taiwan, 4 Frontier Material and Micro/Nano Science and Technology Center and Center for Micro/Nano Science and Technology, National Cheng Kung University, Tainan Taiwan, 2 Department of Materials Science and Engineering, National Dong Hwa University, Hualien Taiwan, 3 Department of Chemistry, National Sun Yat-Sen University, Kaohsiung Taiwan

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9:00 PM - N9.9
Numerical Analysis of Packaging-Induced Failures in Cu/Low-k Interconnects

Aditya Karmarkar 1 , Xiaopeng Xu 2 , Xiao Lin 2 , Greg Rollins 2 , Victor Moroz 2 , Xi-Wei Lin 2
1 TCAD DFM Solutions, Synopsys (India) Private Limited, Hyderabad, Andhra Pradesh, India, 2 TCAD DFM Solutions, Synopsys, Inc., Mountain View, California, United States

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