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Call for Papers

Symposium CM3—Mechanics and Tribology at the NanoscaleIn Situ and In Silico Investigations

Mechanical and tribological behavior at the nanoscale are often studied in isolation. Yet, insights into tribology require an understanding of elastic and inelastic deformation of the sub-surface material, while deformation experiments can rarely be carried out without consideration of interfacial phenomena occurring at contacts between components. In this symposium, we bring together experimentalists and theoreticians working on aspects of plasticity, hardness, fracture toughness, and fatigue, as well as contact, friction, adhesion, and wear, to encourage and nucleate interaction between these two fields.

Mechanical properties (such as yield strength and fracture toughness) as well as tribological properties (such as friction coefficient and wear rate) emerge from the complex interplay of nano- or Angstrom-scale mechanisms. Modern high-performance structural materials, as well as advanced device and manufacturing applications, make use of the specific behavior of materials confined to nanoscale geometries and nanoscale surface contacts. Starvation of defects, small-scale rearrangements and chemical reactions (between contacting surfaces or with the environment) govern the behavior of these components. Micro- and nano-mechanical tension/compression experiments, as well as scanning probe techniques, represent methods for the experimental study of these small-scale mechanisms. At the same time, simulation methodologies such as molecular dynamics or discrete dislocation dynamics usually work at a length scale that is directly comparable to that of nanomechanics, revealing microscopic processes with atomic resolution. Experimental and simulation studies into nanoscale deformation, contact, and sliding, enable unprecedented insights into the fundamental processes governing material behavior.

Submission of contributions from any of these and closely related fields are encouraged. Materials of interest can include but are not limited to metals, metallic or oxide glasses, ceramics, and polymers. Experimental techniques include nano-/micro-tension or compression testing, in isolation or in combination with electron microscopy, as well as scanning probe-based investigations. Modeling approaches include molecular dynamics and statics, discrete dislocation dynamics as well as advanced analysis and simulation techniques, such as for example dislocation extraction algorithms and time acceleration techniques.

Topics will include:

  • Computational investigation on deformation mechanisms
  • The interaction of deformation mechanisms and free surfaces in nanoscale geometries
  • Modern techniques for analyzing and quantifying output of complex molecular dynamics and dislocation dynamics simulations
  • Measuring and predicting the size and geometry of contact as a function of load
  • Predicting the location and onset of inelastic deformation in contacts between nanoscale devices
  • The fundamental origins of friction in wearing and wear-free contacts
  • The fundamental origins of wear and its relation to plasticity and chemical reactions at surfaces
  • Bridging the gap between nanoscale contacts and the macroscopic multi-asperity contact
  • Small scale mechanical testing (e.g. compression, tension, bending, fatigue)
  • In situ observations of dislocation activities, deformation twinning, phase transformation and shear-band formation
  • Environmental effect (e.g. gaseous, temperature, strain rate) on mechanical properties of materials at small scale

Invited Speakers:

  • Robert Carpick (University of Pennsylvania, USA)
  • Hiroyuki Fujita (Toyko University, Japan)
  • Dan Gianola (University of Pennsylvania, USA)
  • Julia Greer (California Institute of Technology, USA)
  • Peter Gumbsch (Fraunhofer IWM, Germany)
  • Erica Lilleodden (Helmholtz-Zentrum Geeshacht, Germany)
  • Scott Mao (University of Pittsburgh, USA)
  • Ashlie Martini (University of California, Merced, USA)
  • Andy Minor (University of California, Berkeley, USA)
  • Amit Misra (University of Michigan, USA)
  • Mark Robbins (Johns Hopkins University, USA)
  • Alexander Stukowski (TU Darmstadt, Germany)
  • Izabela Szlufarska (University of Wisconsin-Madison, USA)

Symposium Organizers

Lars Pastewka
Karlsruhe Institute of Technology
Institute for Applied Materials
49-721-608-45871, lars.pastewka@kit.edu

Tevis Jacobs
University of Pittsburgh
Mechanical Engineering and Materials Science
415-624-9736, tjacobs@pitt.edu

Ju Li
Massachusetts Institute of Technology
Department of Nuclear Science and Engineering and Department of Materials Science and Engineering
617-253-0166, liju@mit.edu

Qian Yu
University of Michigan
Materials Science and Engineering
734-647-7000, yuqian@umich.edu