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Call for Papers

Symposium EP12—Materials Frontiers in Semiconductor Advanced Packaging

Moore’s Law has been governing Si-based semiconductor device industry for the last 50 years with great success on continuing to achieve cheaper and better devices. However, as 14/16 nm FinFET technology being developed and adopted into mass production, the industry realized that cost for each transistor goes up instead of down for the first time in nearly half a century. Moreover, device performance is increasingly being dominated by interconnect RC delay instead of gate delay. As a comparison, semiconductor advanced packaging technology has been growing very rapidly in the last 10 years to help realize new functions and better device/system performance with a relatively good cost-to-benefit ratio. New packaging technologies like SiP, FO-WLP, 2.5D Interposer, and 3D TSV have seen dramatic development efforts. There is an industry-wide consensus that advanced packaging technology has become a major driver and differentiator for the industry to continue the quest to getting faster, cheaper, and smaller devices. Put in different words, advanced packaging technology enables the so-called “More-than-Moore” era.

Materials play a critical role in semiconductor advanced packaging technology and have been a central focus for research and development efforts for both the industry and academia. Areas like mobile devices, high-performance computing, MEMS, LED, and auto have all seen major activities. Looking five to ten years out, however, the industry does not have a clear roadmap on advanced packaging materials. This presents a good opportunity to explore frontiers of advanced packaging material research. For example, on the metallization side, low-temperature solder and novel interconnect materials, reliability of various interconnect integration schemes; on the polymer side, thermally conductive underfills, highly efficient thermal interface materials, and TCE matched build-up films. For this symposium, the central theme is to discuss industry challenges and explore material frontiers to satisfy the mid to long term needs of the industry. It is planned to have a good combination of industrial and academic abstracts to try to cover different horizons and timelines, and to promote interactions and collaborations between the two groups.

Topics will include:

  • Material Reliability in Advanced Packaging
  • Thermal Materials in Semiconductor Packaging
  • Enabling Materials for High Frequency Substrates
  • Materials Challenges in FC CSP/BGA, QFN, WLP, 2.5D interposers, and 3D-TSV
  • Flexible, Large area, and Organic Electronics Packaging Materials
  • Emerging Materials for Semiconductor Packaging – Biomaterials, Chiral Materials, Optical Materials, 3D Printing,1D and 2D materials etc
  • Novel Materials for Automobile Electronics, LED and MEMS Advanced Packaging

Invited Speakers:

  • Rolf Aschenbrenner (Fraunhofer IZM, Germany)
  • Rozalia Beica (Yole Développement, France)
  • Steve Bezuk (Qualcomm Technologies, USA)
  • Carol Handwerker (Purdue University, USA)
  • Beng Ong (Hong Kong Baptist University, Hong Kong)
  • Eric Pop (Stanford University, USA)
  • Tadao Someya (University of Tokyo, Japan)
  • K. Suganuma (Osaka University, Japan)
  • Dan Tracy (SEMI, USA)
  • King-Ning Tu (University of California, Los Angeles, USA)
  • Rao R. Tummala (Georgia Institute of Technology, USA)
  • Itsuo Watanabe (Hitachi Chemical, Japan)
  • C.P. Wong (Georgia Institute of Technology, USA)
  • Douglas Yu (Taiwan Semiconductor Manufacturing Company Limited (TSMC), Taiwan)
  • Afshin Ziaei (Thales Research and Technology, France)

Symposium Organizers

Jianwei Dong
Dow Electronic Materials
USA
508-229-7117, jianweidong@dow.com

Karlheinz Bock
TU Dresden
Germany
49-351-46336345, bock@avt.et.tu-dresden.de

Johan Liu
Chalmers University of Technology
Sweden
46-31-772 3067, jliu@chalmers.se

Daniel Lu
Henkel China
China
86-21-28918576, daniel.lu@henkel.com

Nancy Stoffel
GE Global Research
USA
518-387-4529, stoffel@ge.com