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Call for Papers

Symposium MD10—Micro-Assembly Technologies

The integration of high-performance microscale materials and devices onto non-native substrates enables new kinds of heterogeneous material systems with desirable architectures and functionalities that are inaccessible by conventional means. Micro assembly technologies are the practical ways to make such microscale heterogeneous combinations possible. The aim of this symposium is to address the state-of-the-art and challenges of micro assembly technologies available in diverse research fields including but not limited to robotics, 3D super-chips, system-in-package (SiP), 3D MEMS, and flexible/wearable electronics. Microassembly enables 3D microsystem assembly/packaging and heterogeneous material integration with a variety of strategies depending on different size scales from millimeters to micrometers or even smaller. Challenges in the current micro assembly technologies encompass the scalable assembly with high precision and high throughput, the efficient interconnection of assembled devices, and the enhanced interfacial properties between heterogeneous materials to ensure not only strong mechanical bonding but also desired electrical, thermal or optical contact. This symposium brings the researchers from different research fields such as robotics/automation, LSI, MEMS, and flexible/wearable electronics to bridge the gap between different sectors and to share the current trends, challenges, and future directions in micro assembly technologies.

Topics will include:

  • Fluidic micro assembly
  • Laser-assisted transfer processes
  • Robotic micro assembly
  • Self-assembly and self-folding
  • Transfer printing using elastomers or other polymers
  • Novel interconnections of micro assembled devices
  • Application and devices enabled by micro assembly
  • Electric or magnetic field-assisted transfer or assembly processes
  • Novel materials and materials combinations created by micro assembly

Invited Speakers:

  • Boudewijn van Blokland (NXP Semiconductor, Netherlands)
  • Karl F. Bohringer (University of Washington, USA)
  • Placid M. Ferreira (University of Illinois at Urbana-Champaign, USA)
  • Michael Gauthier (Femto-St, France)
  • Yuka Ito (Sumitomo Bakelite Co., Ltd., Japan)
  • Tatsuto Kumagai (Yamaha Motor Co., Ltd., Japan)
  • Pierre Lambert (Université libre de Bruxelles, Belgium)
  • Jeng Ping Lu (Palo Alto Research Center, USA)
  • Isao Shimoyama (University of Tokyo, Japan)
  • Metin Sitti (Max Planck Institute, Germany)
  • Marcel Tichem (Delft University of Technology, Netherlands)
  • Jongseung Yoon (University of Southern California, USA)

Symposium Organizers

Seok Kim
University of Illinois at Urbana-Champaign
Department of Mechanical Science and Engineering
1-217-265-5656, skm@illinois.edu

Takafumi Fukushima
Tohoku University
Department of Bioengineering and Robotics

Gregory Whiting
Palo Alto Research Center
1-650-812-4182, gregory.whiting@parc.com

Quan Zhou
Aalto University
Department of Electrical Engineering and Automation
358-40-855-0311, quan.zhou@aalto.fi