The integration of high-performance microscale materials and devices onto non-native substrates enables new kinds of heterogeneous material systems with desirable architectures and functionalities that are inaccessible by conventional means. Micro assembly technologies are the practical ways to make such microscale heterogeneous combinations possible. The aim of this symposium is to address the state-of-the-art and challenges of micro assembly technologies available in diverse research fields including but not limited to robotics, 3D super-chips, system-in-package (SiP), 3D MEMS, and flexible/wearable electronics. Microassembly enables 3D microsystem assembly/packaging and heterogeneous material integration with a variety of strategies depending on different size scales from millimeters to micrometers or even smaller. Challenges in the current micro assembly technologies encompass the scalable assembly with high precision and high throughput, the efficient interconnection of assembled devices, and the enhanced interfacial properties between heterogeneous materials to ensure not only strong mechanical bonding but also desired electrical, thermal or optical contact. This symposium brings the researchers from different research fields such as robotics/automation, LSI, MEMS, and flexible/wearable electronics to bridge the gap between different sectors and to share the current trends, challenges, and future directions in micro assembly technologies.