2020 MRS Spring Meeting

Call for Papers

Submit an Abstract
Deadline October 31, 2019, 11:59 pm

Symposium CT07—Micro-Assembly Technologies and Heterogeneous Integration—Fundamentals to Applications

The integration of high-performance microscale/nanoscale materials and devices onto non-native substrates enables new kinds of heterogeneously integrated systems with desirable architectures and functionalities that are inaccessible by conventional means. There is strong interest in manipulating mesoscaled components (ranging from millimeters to micrometers) containing assemblies of some of the down to nanoscale devices, to position them precisely onto host substrates with sub-micrometer accuracy for applications such as widely distributed sensors and other networked devices. Throughput in robotic pick-and-place operations has increased dramatically in recent years and the component dimensions capable of being handled by industrial robots is approaching the micrometer-scale size of cells and microorganisms. Micro-assembly technologies are the practical ways to enable heterogeneous integration and combinations possible. The aim of this symposium is to address the state-of-the-art and challenges of micro assembly technologies available in diverse research fields including but not limited to robotics, 3D printing, system-in-package (SiP), 3D MEMS, and flexible/wearable electronics. This symposium also deals with microstructures created by bottom-up technologies such as directed/undirected self-assembly and phase separation with synthetic polymers or natural biopolymers like DNA. Microassembly enables 3D microsystem assembly/packaging and heterogeneous material integration with a variety of strategies depending on different size scales down to micrometers or even smaller. Challenges in the current micro assembly technologies encompass scalable assembly with high precision and high throughput, efficient interconnection and functionalization of assembled devices, and enhanced interfacial properties between heterogeneous materials to ensure not only strong mechanical bonding but also desired electrical, thermal or optical contact. This symposium brings the researchers from both academia and industry across different research fields such as robotics/automation, LSI, MEMS, Si photonics/LED, bioengineering/biomedical devices, and flexible/wearable electronics to bridge the gap between different sectors and to share the current trends, challenges, and future directions in micro assembly technologies including materials, processes, devices, and their characterization.

Topics will include:

  • Transfer printing using elastomers or other polymers
  • Fluidic micro assembly
  • Laser-assisted transfer processes
  • Electric or magnetic field-assisted transfer or assembly processes
  • Robotic micro assembly
  • Self-alignment, self-organizing, self-assembly and self-folding
  • Microstructures by DSA, undirected self-assembly, and phase separation
  • Surface/interface properties and functionalization that facilitate assembling process
  • Novel interconnections of micro assembled devices
  • Novel materials and materials combinations created by micro assembly
  • Application and devices enabled by micro assembly

Invited Speakers:

  • Lucile Arnaud (Université Grenoble Alpes, France)
  • Clint Ballinger (Self Array, Inc., USA)
  • Bill Botttoms (Third Millenium Test Solutions, USA)
  • Chris Bower (X-Celeprint, USA)
  • Bill Chen (ASE Technology Holding Co., Ltd., USA)
  • Eugene Chow (PARC, a Xerox Company, USA)
  • Ayano Honda (Toray Engineering Co., Ltd, Japan)
  • Allen Hsu (SRI International, USA)
  • Xiuling Li (University of Illinois at Urbana-Champaign, USA)
  • Yan Liu (Arizona State University, USA)
  • Ravi Mahajan (Intel, USA)
  • Massimo Mastrangeli (Delft University of Technology, Netherlands)
  • Marc Miskin (University of Pennsylvania, USA)
  • Falk Naumann (Institute for Mircrostructure of Materials and Systems - IMWS, Germany)
  • Gunter Roelkens (imec, Belgium)
  • Paul Schuele (eLux, Inc., USA)
  • Quan Zhou (Aalto University, Finland)

Symposium Organizers

Hongbin Yu
Arizona State University
USA
480-965-4455, yuhb@asu.edu

Brian Corbett
Tyndall National Institute
Ireland
+353 21 490 4380, brian.corbett@tyndall.ie

Takafumi Fukushima
Tohoku University
Dept. of Mechanical Systems Engineering
Japan

Seok Kim
University of Illinois at Urbana-Champaign
Mechanical Science and Engineering
USA
1-217-265-5656, skm@illinois.edu