2020 MRS Spring Meeting

Call for Papers

Symposium SM04—Fundamental Materials, Devices and Fabrication Innovations for Biointegrated and Bioinspired Electronics

Rapidly evolving biointegrated and bioinspired electronics can find wide applications in biomedical research, clinical healthcare, human-machine interface, robotics, internet of things, and many other fields. The continuous development requires innovations in material synthesis, device designs, and integration strategies to address the profound mismatch between biology and electronics, and to expand the biomimetic functionalities such as bioresorption, self-healing, multifunctional responsiveness, breathability, and recyclability.

Various flexible and stretchable materials are proposed for bioelectronics, ranging from conventional inorganic electronic materials, soft organic electronic materials, hydrogels, liquid metals, polymer composites, biomaterials, to emerging nanomaterials and structures. A broad range of devices is developed, including sensors, actuators, energy harvesters, power supplies, and antennas. Different approaches, including transfer printing, nanoscale deterministic assembly, micro/nanoscale fabrication, mechanically guided 3D assembly, additive manufacturing, are developed to integrate materials and devices for advanced bioelectronic systems. Representative examples include skin-like electronics, implantable electronics, mesh electronics, cellular bioelectronic interface, 3D electronic scaffolds, and many others.

This symposium aims to provide a forum to researchers from academia, industry and national labs to present, discuss, and exchange the latest development in theoretical, computational, and experimental studies in bioelectronics. It will focus on fundamental materials science, novel device designs and functions, new fabrication techniques, and potential biomedical applications. Interdisciplinary topics related to physics, chemistry, biology, materials science, and engineering are expected to shed new lights on research and create new frontiers.

Topics will include:

  • Nanomaterials and composites for bioelectronics
  • Bio-inspired and biomimetic materials for bioelectronics
  • Multifunctional (e.g., self-healing, breathable, responsive, biodegradable) materials for bioelectronics
  • Hydrogel, paper and textile-based bioelectronics
  • Synthesis and characterization of bioinspired and biointegrated materials
  • Advanced manufacturing and novel device fabrication processes
  • Novel mechanical and structural design for bioelectronics
  • New device applications (e.g., skin-like devices, implantable devices, neuroprosthetic devices, brain-machine interface, and biomechanical energy harvesting)
  • Fundamental materials and structural innovations for biosensing

Invited Speakers:

  • Tzahi Cohen-Karni (Carnegie Mellon University, USA)
  • Bianxiao Cui (Stanford University, USA)
  • Xiangfeng Duan (University of California, Los Angeles, USA)
  • Hui Fang (Northeastern University, USA)
  • Guosong Hong (Stanford University, USA)
  • Yonggang Huang (Northwestern University, USA)
  • Ali Javey (University of California, Berkeley, USA)
  • Dae-Hyeong Kim (Seoul National University, Republic of Korea)
  • Keon Jae Lee (Korea Advanced Institute of Science and Technology, Republic of Korea)
  • Charles Lieber (Harvard University, USA)
  • Jia Liu (Harvard University, USA)
  • Nanshu Lu (University of Texas at Austin, USA)
  • Carmel Majidi (Carnegie Mellon University, USA)
  • Michael McAlpine (University of Minnesota, USA)
  • Nicholas Melosh (Stanford University, USA)
  • John Rogers (Northwestern University, USA)
  • Takao Someya (University of Tokyo, Japan)
  • Bozhi Tian (University of Chicago, USA)
  • Xudong Wang (University of Wisconsin, Madison, USA)
  • Jianliang Xiao (University of Colorado Boulder, USA)
  • Cunjiang Yu (University of Houston, USA)
  • Xuanhe Zhao (Massachusetts Institute of Technology, USA)

Symposium Organizers

Zheng Yan
University of Missouri-Columbia
Department of Biomedical, Biological and Chemical Engineering, Department of Mechanical & Aerospace Engineering
USA
+1 (573) 884-0562, yanzheng@missouri.edu

Huanyu Cheng
The Pennsylvania State University
Department of Engineering Science and Mechanics
USA
+1 (814) 863-5945, Huanyu.Cheng@psu.edu

Lina Sarro
Delft University of Technology
Department of Microelectronics
Netherlands
+31 (15) 278-7708, p.m.sarro@tudelft.nl

Jun Yao
University of Massachusetts Amherst
Department of Electrical and Computer Engineering, Institute for Applied Life Sciences
USA
+1 (413) 545-3324, juny@umass.edu