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Symposium ED9 : Advanced Interconnects for Logic and Memory Applications—Materials, Processes and Integration

2017-04-18   Show All Abstracts

Symposium Organizers

Jeffery Bielefeld, Intel Corporation
Mikhail Baklanov, North China University of Technology (NCUT)
Vincent Jousseaume, CEA-LETI
Eiichi Kondoh, University of Yamanashi

Symposium Support

Air Liquide
Applied Materials
CEA-LETI
ED9.1: Low-K Materials I
Session Chairs
Mikhail Baklanov
Jeffery Bielefeld
Tuesday AM, April 18, 2017
PCC North, 100 Level, Room 128 B

10:30 AM - *ED9.1.01
Boron-Based Solids for Advanced Interconnect Applications

Michelle Paquette 1
1 , University of Missouri–Kansas City, Kansas City, Missouri, United States

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11:00 AM - *ED9.1.02
Material Innovations for Future BEOL Interconnects

E. Ryan 1 , Nicholas Licausi 1 , Benjamin Briggs 2 , Xunyuan Zhang 1 , Xuan Lin 1 , James Kelly 2 , Lars Liebmann 1 , Son Nguyen 2
1 , GLOBALFOUNDRIES, Albany, New York, United States, 2 , IBM, Clifton Park, New York, United States

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11:30 AM - ED9.1.03
Metal-Organic Frameworks as Gap Filling Low-K Dielectric Material in Advanced Interconnects

Mikhail Krishtab 1 2 , Ivo Stassen 3 , Rob Ameloot 3 , Geoffrey Pourtois 1 , Silvia Armini 1 , Stefan de Gendt 1 2
1 , imec, Leuven Belgium, 2 Department of Chemistry, KU Leuven, Leuven Belgium, 3 Centre for Surface Chemistry and Catalysis, KU Leuven, Leuven Belgium

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11:45 AM - ED9.1.04
Silica Aerogel Low-K Films towards Inter Layer Dielectric (ILD)

Ashok Mahajan 1
1 Department of Electronics, North Maharashtra University, Jalgaon India

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ED9.2: Memory Applications
Session Chairs
Vincent Jousseaume
John Zhang
Tuesday PM, April 18, 2017
PCC North, 100 Level, Room 128 B

1:30 PM - *ED9.2.01
The N3XT 1,000× of Computing Energy Efficiency

H.-S. Philip Wong 1
1 Department of Electrical Engineering and Stanford SystemX Alliance, Stanford University, Stanford, California, United States

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2:00 PM - ED9.2.02
Mechanism for Bipolar Resistive Switching in Annealed GO Thin Films

Pooja Saini 1 , Manjari Singh 2 , S. Singh 2 , Ajit Mahapatro 1
1 , University of Delhi, Delhi India, 2 , National Physical Laboratory, Delhi India

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2:15 PM - ED9.2.03
Reduction of Interface Trap in Poly-Si Channel for 3D NAND Device through Dielectric Recovery Process

Dong Uk Lee 1 , Sangwoo Pak 3 , Daemyoung Lee 1 , Yihun Kim 1 , Haechang Yang 1 , Sanghoo Hong 1 , Seungjun Lee 2 , Eun Kyu Kim 3
1 NAND Product Engineering Group, SKhynix Inc., Icheon Korea (the Republic of), 3 Department of Physics, Hanyang University, Seoul Korea (the Republic of), 2 Process and Technology Group, SKhynix Inc., Seoul Korea (the Republic of)

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2:30 PM -
BREAK

ED9.3: Advanced Integration
Session Chairs
Eiichi Kondoh
Chen Wu
Tuesday PM, April 18, 2017
PCC North, 100 Level, Room 128 B

3:00 PM - *ED9.3.01
Selective Surface Modification for ALD and SAM Deposition

Yves Chabal 1 , David Michalak 2 , Rami Hourani 2 , Joseph Klesko 1
1 , University of Texas at Dallas, Richardson, Texas, United States, 2 , Intel Corporation, Hillsboro, Oregon, United States

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3:30 PM - *ED9.3.02
New Material and Integration Innovations to Enable Advanced Interconnect Scaling

Larry Zhao 1 , Artur Kolics 1 , Kristof Croes 2 , Zsolt Tokei 2
1 , Lam Research, Tualatin, Oregon, United States, 2 , imec, Leuven Belgium

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4:00 PM - ED9.3.03
Low Damage ULK Etching by Means of High Boiling Point Organic Condensation

Romain Chanson 1 , Nicolas Holtzer 2 , Philippe Lefaucheux 2 , Remi Dussart 2 , Peng Shen 3 , Keiichiro Urabe 3 , Kaoru Maekawa 6 , Koichi Yatsuda 4 , Shigeru Tahara 5 , Jean-Francois de Marneffe 1
1 , imec, Leuven Belgium, 2 , GREMI/University of Orleans, Orleans France, 3 , Air Liquide Laboratories, Tsukuba Japan, 6 , TEL Technology Center America, Albany, New York, United States, 4 , Tokyo Electron Limited, Minato-ku Japan, 5 , Tokyo Electron Miyagi Limited, Miyagi Japan

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4:15 PM - ED9.3.04
Integration of Ultralow-K Dielectrics Using a Template Replacement Approach

Liping Zhang 1 2 , Jean-Francois de Marneffe 1 , Gayle Murdoch 1 , Victor Vega Gonzalez 1 , Alicja Lesniewska 1 , Patrick Verdonck 1 , Nancy Heylen 1 , Lichen Zha 1 , Chen Wu 1 , Scott Leffert 3 , Zsolt Tokei 1 , Juergen Boemmels 1 , Stefan de Gendt 1 2
1 , imec, Heverlee Belgium, 2 Department of Chemistry, KU Leuven, Leuven Belgium, 3 , SBA Materials, San Jose, California, United States

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4:30 PM - ED9.3.05
Periodic Mesoporous Organosilica Films for Low-K Application—Promises and Challenges

Murad Redzheb 1 2 , Oguzhan Orkut Okudur 3 2 , Pascal Van Der Voort 1 , Silvia Armini 2
1 Department of Inorganic and Physical Chemistry, Gent University, Gent Belgium, 2 , imec, Leuven Belgium, 3 Department of Materials Engineering, KU Leuven, Leuven Belgium

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4:45 PM - ED9.3.06
Thermal Stability of Low-K Dielectrics for 3D Sequential Integration

Sylvain Beaurepaire 1 2 3 , Chloe Guerin 1 2 , Fabien Deprat 1 2 , Patrice Gonon 1 3 , Ahmad Bsiesy 1 3 , Christophe Licitra 1 2 , Guillaume Freychet 1 2 4 , Mireille Maret 1 4 , Claire Fenouillet-Beranger 1 2 , Vincent Jousseaume 1 2
1 , Université Grenoble Alpes, Grenoble France, 2 , CEA LETI MINATEC Campus, Grenoble France, 3 , LTM UGA/CNRS/CEA, Grenoble France, 4 , CNRS SIMAP, Grenoble France

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ED9.4: Poster Session
Session Chairs
Tuesday PM, April 18, 2017
Sheraton, Third Level, Phoenix Ballroom

8:00 PM - ED9.4.01
Atomic Layer Deposition of Boron Carbide for Interconnect Applications

Lauren Dorsett 1 , Suhaib Malik 1 , Thuong Nguyen 1 , Anthony Caruso 1 , Sean King 2 , Jeffery Bielefeld 2 , Michelle Paquette 1
1 , University of Missouri–Kansas City, Kansas City, Missouri, United States, 2 , Intel Corporation, Hillsboro, Oregon, United States

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8:00 PM - ED9.4.02
Plasma Enhanced Chemical Vapor Deposition of Al2O3 Films Using Dimethylaluminum Isopropoxide without Additional Oxygen Sources

Wonjin Ban 1 , Sungyool Kwon 1 , Seonhee Jang 1 , Jaeyoung Yang 2 , Donggeun Jung 1
1 , Sungkyunkwan University, SUWON-SI, SE, Korea (the Republic of), 2 , TES Co., Ltd, Yongin Korea (the Republic of)

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8:00 PM - ED9.4.03
Electrical Properties of Low-K SiCOH Films Deposited with the Phenyltrimethoxysilane Single Precursor

Sungyool Kwon 1 , Wonjin Ban 1 , Donggeun Jung 1
1 , Sungkyunkwan University, Suwon Korea (the Republic of)

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8:00 PM - ED9.4.04
Evaluation of New Spin-On Deposited Ultra Low-K Films Developed for Gap Filling Application

Yingjie Wang 1 , Chunhui Liu 1 , R. N. Nenashev 2 , N. M. Kotova 2 , K. Vorotilov 2 , Jing Zhang 1 , Mikhail Baklanov 1
1 , North China University of Technology, Beijing China, 2 , Moscow Technological University (MIREA), Moscow Russian Federation

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8:00 PM - ED9.4.05
Effect of Carbon Bridge Content on Spin-On Copolymer PMO Films

K. Vorotilov 1 , A. Sigov 1 , R. N. Nenashev 1 , N. M. Kotova 1 , Konstantin Mogilnikov 2 , Yingjie Wang 3 , Jing Zhang 3
1 , Moscow Technological University, Moscow Russian Federation, 2 , Institute of Semiconductor Physics, Novosibirsk Russian Federation, 3 , North China University of Technology, Beijing China

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2017-04-19   Show All Abstracts

Symposium Organizers

Jeffery Bielefeld, Intel Corporation
Mikhail Baklanov, North China University of Technology (NCUT)
Vincent Jousseaume, CEA-LETI
Eiichi Kondoh, University of Yamanashi

Symposium Support

Air Liquide
Applied Materials
CEA-LETI
ED9.5: Integration and Metallization
Session Chairs
Jeffery Bielefeld
Larry Zhao
Wednesday AM, April 19, 2017
PCC North, 100 Level, Room 128 B

8:00 AM - *ED9.5.01
CMP Challenges for Advanced Technology Nodes

John Zhang 1 , Haigou Huang 2 , Andrew Greene 3 , Ruilong Xie 1 , Soon-Cheon Seo 3 , Pietro Montanini 3 , Wei-Tsu Tseng 2 , Stan Tsai 1 , Matthew Malley 3 , Qiang Fang 2 , Raghuveer Patlolla 3 , Dinesh Koli 2 , Dechao Guo 3 , Donald Canaperi 3 , Charan Surisetty 3 , Jean Wynne 3 , Walter Kleemeier 1 , Cathy Labelle 1
1 Technology Development, GLOBALFOUNDRIES, Albany, New York, United States, 2 , Globalfoundries, Malta, New York, United States, 3 , IBM Research, Albany, New York, United States

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8:30 AM - ED9.5.02
Controlling the Microstructure of Electroless Cobalt for Semiconductor Interconnect Applications

Kevin Musick 1 2 , Kathleen Dunn 1
1 , SUNY Polytechnic Institute, Albany, New York, United States, 2 , University at Albany, State University of New York, Albany, New York, United States

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8:45 AM - ED9.5.03
Insight into the Molecular Structure of Amino-Copper (II) Formates in Forming High Conductivity Copper Films for Printable Electronics

Chantal Paquet 2 , Ryan MacDonell 1 , Michael Schuurman 2 , Thomas Lacelle 1 , Xiangyang Liu 2 , Bhavana Deore 2 , Arnold Kell 2 , Patrick Malenfant 2
2 , National Research Council of Canada, Ottawa, Ontario, Canada, 1 Department of Chemistry, University of Ottawa, Ottawa, Ontario, Canada

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9:00 AM - ED9.5.04
Etching of Transition Metals (Co, Ni, Fe, Pt) Using Supercritical Fluids

Eiichi Kondoh 1
1 , University of Yamanashi, Kofu Japan

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9:15 AM - ED9.5.05
Pore Surface Grafting of Porous Low-K Dielectrics by Selective Polymers

Askar Rezvanov 1 2 3 , Liping Zhang 1 4 , Mitsuhiro Watanabe 1 5 , Mikhail Krishtab 1 4 , Lin Zhang 6 , Alexey Zotovich 8 7 , Sergey Zyryanov 8 7 , Dmitriy Lopaev 7 , Nigel Hacker 6 , Patrick Verdonck 1 , Silvia Armini 1 , Evgeny Gornev 2 3 , Jean-Francois de Marneffe 1
1 , imec, Leuven Belgium, 2 , Moscow Institute of Physics and Technology, Dolgoprudny Russian Federation, 3 , Molecular Electronics Research Institute, Moscow Russian Federation, 4 , KU Leuven, Leuven Belgium, 5 , Interdisciplinary Graduate School of Medicine and Engineering, Kofu Japan, 6 , SBA Materials Inc, San Jose, California, United States, 8 , Faculty of Physics, Lomonosov Moscow State University, Moscow Russian Federation, 7 , Skobeltsyn Institute of Nuclear Physics, Lomonosov Moscow State University, Moscow Russian Federation

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9:30 AM -
BREAK

ED9.6: Novel Processing Methods
Session Chairs
Yves Chabal
Eiichi Kondoh
Wednesday AM, April 19, 2017
PCC North, 100 Level, Room 128 B

10:00 AM - *ED9.6.01
3D Sequential Integration—Opportunities and Challenges in Low Temperature Process Modules

Claire Fenouillet-Beranger 1
1 , CEA/LETI, Grenoble France

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10:30 AM - ED9.6.02
Self-Aligned Growth of 3D Nano-Bridge-Based Interconnects by Gas Phase Electrodeposition

Leslie Schlag 1 , Jun Fang 2 , Johannes Reiprich 1 , Heiko Jacobs 1
1 , TU Ilmenau FG Nanotechnologie, Ilmenau Germany, 2 Electrical Engineering, University of Minnesota, Minneapolis, Minnesota, United States

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10:45 AM - ED9.6.03
The Effects of Organic Acids on Electrodeposited Cu Films in Sub-Micron Trenches

Tyler Pounds 2 , Karl Sieradzki 1 , Jonah Erlebacher 2
2 , Johns Hopkins University, Baltimore, Maryland, United States, 1 , Arizona State University, Tempe, Arizona, United States

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11:00 AM - ED9.6.04
The Impact of Solute Segregation on Grain Boundaries in Dilute Cu Alloys

Takanori Tsurumaru 1 2 , Luke Prestowitz 1 , Brendan O'Brien 1 , Kathleen Dunn 1
1 Nanosciences, State University of New York Polytechnic Institute, Albany, New York, United States, 2 Crystal Engineering, SUMCO Corporation, Kishima-gun, Kohoku-machi, Saga, Japan

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11:15 AM - ED9.6.05
Growth and Characterization of Ultrathin Conformal Nickel Films by Plasma-Enhanced Atomic Layer Deposition

Pouyan Motamedi 1 2 , Ken Bosnick 1 , Kenneth Cadien 2
1 , National Institute for Nanotechnology, Edmonton, Alberta, Canada, 2 , University of Alberta, Edmonton, Alberta, Canada

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11:30 AM - ED9.6.06
A Comprehensive Comparison of Scanning Laser Annealing and Microwave Annealing for Ion Implanted Si

Zhao Zhao 1 , Joe Hillman 2 , Manny Oropeza 2 , Terry Alford 1
1 , Arizona State University, Tempe, Arizona, United States, 2 , Universal Laser Systems, Scottsdale, Arizona, United States

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11:45 AM - ED9.6.07
Interface-Controlled Carrier Transport in Metal-Lutetium Oxide-Metal Structures Deposited by Electron-Beam Evaporation Technique

Khalid Mahmood 1
1 , Government College University Faisalabad, Faisalabad Pakistan

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ED9.7: Low-K Materials II
Session Chairs
Vincent Jousseaume
E. Ryan
Wednesday PM, April 19, 2017
PCC North, 100 Level, Room 128 B

1:45 PM - *ED9.7.01
Establishing the Relationship between Low-K Dielectric Properties and Intrinsic Conduction and Degradation Mechanisms

Chen Wu 1 , Yunlong Li 1 , Kristof Croes 1
1 , imec, Leuven Belgium

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2:15 PM - ED9.7.03
Experimental Study of Plasma-Induced Damage in Cryogenic Etching of Porous Low-K Dielectrics in CF3Br and CF4

Askar Rezvanov 1 2 , Andrey Miakonkikh 3 , Konstantin Rudenko 3 , Alexey Vishnevskiy 4 , Evgeny Gornev 1 2 , Mikhail Baklanov 5
1 , Moscow Institute of Physics and Technology, Dolgoprudny Russian Federation, 2 , Molecular Electronics Research Institute, Moscow Russian Federation, 3 , Institute of Physics and Technology of Russian Academy of Sciences, Moscow Russian Federation, 4 , Moscow Technological University, Moscow Russian Federation, 5 , North China University of Technology, Beijing China

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