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Speakers

Plenary Speakers

Tony Renau, Varian Semiconductor Equipment (retired)
Development of Ion Implantation Technology: 1987-2022

Fred Roozeboom, University of Twente
Technical Developments of Thermal Annealing in the Past Sixty Years, and Future Perspectives

Hitoshi Wakabayashi, Tokyo Institute of Technology
Novel Processes and Devices including 2D Materials

Invited Speakers

Temel Buyuklimanli, EAG Laboratories
Overview of Implantation Metrology

 

Oleg Gluschenkov, IBM Research
Laser Annealing Applications for Advanced FinFETs and Beyond

Lubek Jastrzebski
, Semilab
DPLI (Defect Photoluminescence Imaging) to Monitor Defect Formation During Ion Implantation and Annealing


Jacob Jensen
, Intel Corporation
Flash Annealing

Sébastien Kerdiles, CEA-LETI
More Than Moore Applications of Nanosecond Laser Annealing


Tsunenobu Kimoto, Kyoto University
SiC Implant and Anneal


Didier Landru, Soitec
Smart Cut, FD-SOI and Integration Challenges

 

Alexander Scheit, IHP Solutions GmbH
Flash Annealing for the Worldwide Fastest SiGe HBT


Kyoichi Suguro
, SUGSOL Corporation
Where is the annealing technology going for better device performance?


Toshiyuki Tabata
, Laser Systems & Solutions of Europe
Activation of Dopants in Si/SiGe using Laser Annealing


Hao Yu
, imec
Advanced Contacts for CMOS

IIT_Entegris_Silver

Plansee

AIBT Logo

Applied Materials

Axcelis

iON Technology Solutions

Nissin Ion Equipment

SMIT Logo

 


International Conference on Ion Implantation Technology 2022

September 25-29, 2022
San Diego, California


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