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2007 MRS Fall Meeting & Exhibit

November 26 - 30, 2007  | Boston
Meeting Chairs:
 Duane Dimos, Mary Galvin, David Mooney, Konrad Samwer

Symposium DD : Microelectromechanical Systems--Materials and Devices

2007-11-26   Show All Abstracts

Symposium Organizers

David La Van Yale University
Mark Spearing University of Southampton
Srikar Vengallatore McGill University
Mark da Silva Exponent Inc.
DD1: Micromechanics I
Session Chairs
Mark Spearing
Monday PM, November 26, 2007
Room 313 (Hynes)

9:30 AM - **DD1.1
A Review of Tension Test Methods for Thin Films.

William Sharpe 1
1 Mechanical Engineering, Johns Hopkins University, Baltimore, Maryland, United States

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10:00 AM - DD1.2
Reliability of MEMS Materials: Mechanical Characterization of Thin-Films using the Wafer Scale Bulge Test and Improved Microtensile Techniques.

Joao Gaspar 1 , Marek Schmidt 1 , Jochen Held 1 , Oliver Paul 1
1 Department of Microsystems Engineering (IMTEK), University of Freiburg, Freiburg, BW, Germany

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10:15 AM - DD1.3
Multipurpose on-chip Nanomechanical Laboratory for Testing Thin Films.

Thomas Pardoen 1 2 , Raskin Jean-Pierre 1 3 , Coulombier Michael 1 2 , Sebastien Gravier 2 , Nicolas Andre 1 3 , Asmahan Safi 2 , Thomas Gets 2 , Vincent Delongueville 3 , Stanislas Sobieski 3 , Samer Houri 3
1 Research Center in Micro and Nanoscopic Materials and Electronic, Université catholique de Louvain, Louvain-la-Neuve Belgium, 2 Department of Materials Science and Processes, Université catholique de Louvain, Louvain-la-Neuve Belgium, 3 Department of Electricity, Université catholique de Louvain, Louvain-la-Neuve Belgium

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10:30 AM - DD1.4
Fatigue of Nanostructured Ni MEMS Thin Films.

Yong Yang 1 , Guojiang Fan 2 , Benjamin Imasogie 3 , Brad Boyce 4 , Peter Liaw 2 , Winston Soboyejo 1
1 Princeton Institute for the Science and Technology of Materials (PRISM) and The Department of Mechanical and Aerospace Engineering, Princeton University, Princeton, New Jersey, United States, 2 Department of Materials Science and Engineering, The University of Tennessee, Knoxville, Tennessee, United States, 3 Department of Materials Science and Engineering, Obafemi Awolowo University, Ile-Ife Nigeria, 4 Materials Science and Engineering Center, Sandia National Laboratories, Albuquerque, New Mexico, United States

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10:45 AM - DD1.5
Fatigue of Al Thin Films at ultra-high Frequencies: Discrete Dislocations and Damage Behavior.

Diana Courty 1 , Chris Eberl 1 2 , Werner Ruile 3 , Oliver Kraft 1 2
1 izbs, University of Karlsruhe, Karlsruhe Germany, 2 Institute for Materials Research II, Forschungszentrum Karlsruhe, Karlsruhe Germany, 3 , EPCOS AG, München Germany

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11:00 AM - *
Break

11:30 AM - **DD1.6
Strategies for Testing of Material and Geometrical Properties of MEMS.

Joerg Bagdahn 1 , Matthias Ebert 1 , Ronny Gerbach 1 , Falk Naumann 1 , Ralf Schaefer 1 , Jan Schischka 1
1 Microsystems, Fraunhofer Inst for Mechanics of Materials, Halle/Saale Germany

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12:00 PM - **DD1.7
Adhesion of Microstructures in Dry and Humid Ambients.

Maarten deBoer 1 , Frank DelRio 2 , Martin Dunn 3
1 MEMS Core Technologies, Sandia National Labs, Albuquerque, New Mexico, United States, 2 Chemical Engineering, UC Berkeley, Berkeley, California, United States, 3 Mechanical Engineering, Univ. of Colorado at Boulder, Boulder, Colorado, United States

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12:30 PM - DD1.8
Vapor Phase Lubrication of Silicon MEMS.

Michael Dugger 1 , David Asay 2 , James Ohlhausen 1 , Seong Kim 2
1 , Sandia National Laboratories, Albuquerque, New Mexico, United States, 2 , Pennsylvania State University, University Park, Pennsylvania, United States

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12:45 PM - DD1.9
MEMS Lubrication: An Atomistic Perspective of a Bound + Mobile Lubricant.

Douglas Irving 1 , Donald Brenner 1
1 Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina, United States

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DD2: Micromechanics II
Session Chairs
David LaVan
Monday PM, November 26, 2007
Room 313 (Hynes)

2:30 PM - **DD2.1
Fracture of Brittle Polycrystalline and Amorphous Materials for MEMS.

Ioannis Chasiotis 1 , Krishna Jonnalagadda 1
1 Aerospace Engineering, University of Illinois at Urbana-Champaign, Urbana, Illinois, United States

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3:00 PM - **DD2.2
On-chip Microscale Mechanical Properties Measurements.

H Kahn 1 , R. Ballarini 2 , A. Heuer 1 , S. Eppell 3
1 Materials Science and Engineering, Case Western Reserve University, Cleveland, Ohio, United States, 2 Civil Engineering, University of Minnesota, Minneapolis, Minnesota, United States, 3 Biomedical Engineering, Case Western Reserve University, Cleveland, Ohio, United States

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3:30 PM - DD2.3
Effect of Surface Oxide Layer on Mechanical Properties of Single Crystalline Silicon.

Kenji Miyamoto 1 , Koji Sugano 1 , Toshiyuki Tsuchiya 1 , Osamu Tabata 1
1 Microengineering, Kyoto University, Kyoto-shi, Kyoto, Japan

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3:45 PM - DD2.4
A Comparison of the Strength of Poly- and Single-Crystalline Silicon Subject to Galvanic Corrosion in Hydrofluoric Acid.

David Miller 1 , Collin Becker 1 , Brad Boyce 2 , Conrad Stoldt 1
1 Mechanical Engineering, University of Colorado, Boulder, Colorado, United States, 2 Microsystem Materials, Sandia National Laboratories, Albuquerque, New Mexico, United States

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4:00 PM - *
Break

4:30 PM - DD2.5
MEMS Stress Camera for High-Throughput Materials Characterization.

Noble Woo 1 , Jonathan Petrie 2 , R. van Dover 2
1 Chemistry and Chemical Biology, Cornell University, Ithaca, New York, United States, 2 Materials Science and Engineering, Cornell University, Ithaca, New York, United States

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4:45 PM - DD2.6
Indentation Characterization of Fracture Toughness and Interfacial Strength of PECVD Nitrides after Rapid Thermal Annealing.

Hong-Yi Yan 1 , Kuang-Shun Ou 1 , Kuo-Shen Chen 1
1 Mechanical Engineering, National Cheng-Kung University, Tainan Taiwan

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5:00 PM - DD2.7
Incomplete Martensitic Transformations of NiTi Shape Memory Alloy Thin Films.

Xu Huang 1 , Hoo-Jeong Lee 2 , Ainissa Ramirez 1 3
1 Mechanical Engineering, Yale University, New Haven, Connecticut, United States, 2 School of Advanced Materials Science and Engineering, Sungkyunkwan University, Kyongki-Do Korea (the Republic of), 3 Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, United States

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5:15 PM - DD2.8
A Novel Micro Tensile Testing Instrument with Replaceable Testing Specimen by Parylene Passivation Technique.

Yung-Dong Lau 1 , Tso-Chi Chang 1 , Hong Hocheng 1 , Rongshun Chen 1 2 , Weileun Fang 1 2
1 Power Mechanical Engineering, National Tsing Hua University, Hsinchu Taiwan, 2 Institute of NanoEngineering and MicroSystems, National Tsing Hua University, Hsinchu Taiwan

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5:30 PM - DD2.9
Atomistic+Continuum Multi-scale Modeling of Single Asperity Gold-Gold Contact in an RF MEMS Device.

Wes Crill 1 , D. Irving 1 , C. Padgett 3 , O. Rezvanian 2 , M. Zikry 2 , D. Brenner 1
1 Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina, United States, 3 Department of Chemistry and Physics, Armstrong-Atlantic State University, Savannah, Georgia, United States, 2 Mechanical and Aerospace Engineering , North Carolina State University, Raleigh, North Carolina, United States

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5:45 PM - DD2.10
Microscopic Motion and Deflection Quantifying Chip for Lab-on-chip Application.

Xiaoyu Zheng 1 , Xin Zhang 1
1 , Boston University, Brookline, Massachusetts, United States

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DD3: Poster Session I
Session Chairs
Srikar Vengallatore
Tuesday AM, November 27, 2007
Exhibition Hall D (Hynes)

9:00 PM - DD3.1
Mechanical Stress Sensors for Copper Damascene Interconnects.

Romain Delamare 1 , Christian Rivero 2 , Sylvain Blayac 1 , Moustafa Kasbari 1 , Karim Inal 1
1 PS2, Centre de Microelectronique de Provence, Gardanne France, 2 , STMicroelectronics, Rousset France

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9:00 PM - DD3.10
Modification of Conductivity and Stiffness of Electroactive Polymer (EAP) Thin Films by Metal Ion Implantation.

Muhamed Niklaus 1 , Samuel Rosset 1 , Philippe Dubois 1 , Massoud Dadras 2 , Herbert Shea 1
1 LMTS - Microsystems for Space Technologies Laboratory, EPFL - Ecole Polytechnic Federal de Lausanne, Neuchatel Switzerland, 2 Institute of Microtechnology, University of Neuchâtel, Neuchatel Switzerland

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9:00 PM - DD3.11
C-Axis Oriented ZnO Film by RF Sputtering and its Integration with MEMS Processing.

Sudhir Chandra 1 , Ravindra Singh 1
1 Centre for Applied Research in Electronics, Indian Institute of Technology Delhi, New Delhi, Delhi, India

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9:00 PM - DD3.12
Optimization of the Geometry of the MEMS Electrothermal Actuator to Maximize In-Plane Tip Deflection.

Edward Kolesar 2 , Jeffrey Tippey 2 , Brandon Least 2 , Thiri Htun 2
2 Department of Engineering, Texas Christian University, Fort Worth, Texas, United States

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9:00 PM - DD3.13
Polymer Gel-gate Field Effect Transistor for Quantitative Detection of Sugar Molecules.

Akira Matsumoto 1 , Naoko Sato 1 , Toshiya Sakata 1 , Chiho Kataoka 2 , Kazunori Kataoka 1 , Yuji Miyahara 1 2
1 Center for NanoBio Integration, The University of Tokyo, Tokyo Japan, 2 Biomaterials Center, National Institute for Materials Science , Tsukuba Japan

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9:00 PM - DD3.14
Electroosmotic Micro-pump for Local Control of Droplets.

Amit Gupta 1 , Heather Denver 2 , Amir Hirsa 2 1 , Julie Stenken 3 , Diana-Andra Borca-Tasciuc 2
1 Chemical Engineering Department, Rensselaer Polytechnic Institute, Troy, New York, United States, 2 Mechanical, Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, New York, United States, 3 Chemistry and Chemical Biology Department, Rensselaer Polytechnic Institute, Troy, New York, United States

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9:00 PM - DD3.15
Aligned Low Temperature Wafer Bonding for MEMS Manufacturing: Challenges and Promises.

Viorel Dragoi 1 , Thorsten Matthias 1 , Gerald Mittendorfer 1 , Paul Lindner 1
1 Technology Development, EV Group, Sankt Florian Austria

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9:00 PM - DD3.16
A Microfluidic Device for Interrogating Pathogenic Immune Response in Single Host Cells.

Matthew Moorman 1 , Bryan Carson 1 , Conrad James 1 , Ronald Manginell 1 , Anthony Martino 1 , Jamie McClain 1 , Jens Poschet 1 , Michael Sinclair 1 , Anup Singh 2
1 , Sandia National Labs, Albuquerque, New Mexico, United States, 2 , Sandia National Labs, Livermore, California, United States

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9:00 PM - DD3.18
Micromolding by Polymerization in Capillaries.

Chris Hughes 1 , Brian Augustine 2 , Jacob Forstater 1
1 Physics, James Madison University, Harrisonburg, Virginia, United States, 2 Chemistry, James Madison University, Harrisonburg, Virginia, United States

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9:00 PM - DD3.19
Piezoelectric Microtransducer for Aural Assistance.

Aurelio Horacio Heredia Jimenez 1 , Berenice Suarez R 2 , Manuel Gonzalez Perez 3 , Laura Castro y Fernandez 4
1 Mechatronic, UPAEP, Puebla, Puebla, Mexico, 2 Chemical, UPAEP, Puebla, Puebla, Mexico, 3 Ing. Biomedical, UPAEP, Puebla, Puebla, Mexico, 4 Laboratory, UPAEP, Puebla, Puebla, Mexico

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9:00 PM - DD3.2
Elastic and Viscoelastic Characterization of Polydimethylsiloxane (PDMS) for Cell-Mechanics Applications.

I-Kuan Lin 1 , Yen-Ming Liao 2 , Kuo-Shen Chen 2 , Xin Zhang 1
1 Manufacturing Engineering, Boston University, Brookline, Massachusetts, United States, 2 Mechanical Engineering, National Cheng Kung University, Tainan Taiwan

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9:00 PM - DD3.20
Synthesis and Applications of Silicone Elastomer and Nanoporous Gold Composite.

Erkin Seker 1 , Matthew Begley 1 2 3 , Hilary Bart-Smith 2 , Robert Kelly 3 , Giovanni Zangari 3 , Michael Reed 1
1 Electrical and Computer Engineering, University of Virginia, Charlottesville, Virginia, United States, 2 Mechanical and Aerospace Engineering, University of Virginia, Charlottesville, Virginia, United States, 3 Materials Science and Engineering, University of Virginia, Charlottesville, Virginia, United States

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9:00 PM - DD3.21
Variation in Dislocation Pattern Observed in SCS Films Fractured by Tensile Test: Effects of Film Thickness and Testing Temperature.

Shigeki Nakao 1 , Taeko Ando 1 , Shigeo Arai 2 , Noriyuki Saito 2 , Kazuo Sato 1
1 Department of Micro-Nano Systems Engineering, Nagoya University, Nagoya Japan, 2 High Voltage Electron Microscope Laboratory, Nagoya University, Nagoya Japan

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9:00 PM - DD3.22
Stability of Diamond-Like Carbon Coating on Nanoimprint Templates.

L. Tao 1 , S. Ramachandran 1 , L. Overzet 1 , M. Goeckner 1 , M. Kim 1 , G. Lee 1 , W. Hu 1
1 Department of Electrical Engineering, University of Texas at Dallas, Richardson, Texas, United States

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9:00 PM - DD3.23
A Comparison of Material Characteristics of a Bulk-micromachined Single-crystal Silicon-on-insulator Process and a Surface-micromachined Polycrystalline Silicon Process.

Brad Boyce 1 , David Miller 2 1
1 , Sandia National Laboratories, Albuquerque, New Mexico, United States, 2 Mechanical Engineering, University of Colorado at Boulder, Boulder, Colorado, United States

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9:00 PM - DD3.24
The Plastic Biochip for Biomedical Diagnostics.

Zhengshan Zhao 1 , Gerardo Diaz-Quijada 2 , Regis Peytavi 1 , Ann Huletsky 1 , Eric LeBlanc 1 , Johanne Frenette 1 , Guy Boivin 1 , Jim Zoval 3 , Marc Madou 3 , Michel Dumoulin 2 , Teodor Veres 2 , Michel Bergeron 1
1 Centre de recherche en infectiologie, Université Laval, Sainte Foy, Quebec, Canada, 2 Industrial Materials Institute, National Research Council, Boucherville, Quebec, Canada, 3 Department of Mechanical and Aerospace Engineering, University of California, Irvine, California, United States

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9:00 PM - DD3.26
Electrical Measurement of Mechanical Properties of Gold Films.

Nicholas Barbosa 1 , Robert Keller 1
1 Materials Reliability Division, NIST, Boulder, Colorado, United States

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9:00 PM - DD3.27
Three-dimensional Micro-Topography Enhances Directional Myogenic Differentiation of Skeletal Precursor Cells.

Yi Zhao 1
1 Department of Biomedical Engineering, The Ohio State University, Columbus, Ohio, United States

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9:00 PM - DD3.28
Modeling of RF MEMS Behavior: Surface Roughness and Asperity Contact.

Omid Rezvanian 1 , Mohammed Zikry 1 , J. Crill 2 , D. Irving 2 , D. Brenner 2
1 Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, North Carolina, United States, 2 Materials Science and Engineering, North Carolina State University, Raleigh, North Carolina, United States

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9:00 PM - DD3.29
Comparison of Hermetic Packaging Techniques using Wafer Level Bonding for MEMS Devices.

Sumant Sood 1 , Sharon Farrens 1
1 Wafer Bonder Applications, Suss Microtec, Waterbury Ctr, Vermont, United States

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9:00 PM - DD3.3
Curvature Control of Microcantilever Based Infrared Detectors Using Thermal Loading Method.

I-Kuan Lin 1 , Katherine Yanhang Zhang 2 , Xin Zhang 1
1 Manufacturing Engineering, Boston University, Brookline, Massachusetts, United States, 2 Aerospace and Mechanical Engineering, Boston University, Brookline, Massachusetts, United States

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9:00 PM - DD3.32
The Effect of Hydrophobic Patterning on Micromolding of Aqueous-Derived Silk Structures.

Konstantinos Tsioris 1 , R. White 1 , D. Kaplan 2 , Peter Wong 1
1 Mechanical Engineering, Tufts University, Medford, Massachusetts, United States, 2 Biomedical Engineering, Tufts University, Medford, Massachusetts, United States

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9:00 PM - DD3.5
Fatigue Crack Growth of Vibrating LIGA Micro-beams.

Andrea Cambruzzi 1 , Jurg Dual 1
1 Zfm -IMES, ETH Zurich, Zurich Switzerland

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9:00 PM - DD3.6
A Direct Method of Determining Complex Depth Profiles of Residual Stresses in Thin Films on a Nanoscale.

Stefan Massl 1 , Jozef Keckes 2 , Reinhard Pippan 1
1 Erich Schmid Institute of Materials Science, Austrian Academy of Sciences, Leoben Austria, 2 Department Materials Physics, University of Leoben, Leoben Austria

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9:00 PM - DD3.7
Normalized Rolling Resistance of an Elastic Cylinder in Adhesive Contact for Micro-manipulation.

Shigeki Saito 1 , Fumikazu Yoshizawa 1 , Toshihiro Ochiai 1
1 Department of Mechanical and Aerospace Engineering, Tokyo Institute of Technology, Tokyo, Tokyo, Japan

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9:00 PM - DD3.8
Optimized Voltage Sequence for Repeatable Manipulation of a Conductive Micro-particle by a Single Probe.

Masaki Sonoda 1 , Kenji Kurihara 1 , Shigeki Saito 1
1 , Tokyo Institute of Technology, Tokyo Japan

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9:00 PM - DD3.9
Scanning Multiprobe Microscopy for Electrical Measurements of Nanodevices.

Hesham Taha 1 , Andrey Ignatov 1 , Abraham Israel 1 , Oleg Zinovev 1 , Anatoly Komisar 1 , Alexander Krol 1 , David Lewis 1
1 , Nanonics Imaging Ltd., Jerusalem Israel

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2007-11-27   Show All Abstracts

Symposium Organizers

David La Van Yale University
Mark Spearing University of Southampton
Srikar Vengallatore McGill University
Mark da Silva Exponent Inc.
DD4: MEMS Devices I
Session Chairs
Srikar Vengallatore
Tuesday AM, November 27, 2007
Room 313 (Hynes)

9:30 AM - *DD4.1
The Evolution of Implantable MEMS Reservoir Array Technologies from Academia to Commercialization.

John Santini 1
1 , MicroCHIPS, Inc., Bedford, Massachusetts, United States

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10:15 AM - *DD4.2
Polychromix: Taking MEMS from Academia to Successful Commercialization.

Erik Deutsch 1
1 , Polychromix, Inc., Wilmington, Massachusetts, United States

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11:00 AM - *
Break

11:30 AM - DD4.3
Piezoelectric and Smiconducting Coupled Power Generating Process of a Single ZnO Belt/wire – A Technology for Harvesting Electricity from the Environment.

Jinhui Song 1 , Jun Zhou 1 , Lin Wang 1
1 Material Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia, United States

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