Meetings & Events

2012 MRS Spring Meeting Logo

2012 MRS Spring Meeting & Exhibit

April 9-13, 2012 | San Francisco
Meeting Chairs: Lara A. Estroff, Jun Liu, Kornelius Nielsch, Kazumi Wada

Symposium C : Interconnect Challenges for CMOS Technology-Materials, Processes, and Reliability for Downscaling, Packaging, and 3D Stacking

2012-04-10   Show All Abstracts

Symposium Organizers

Geraud Dubois, IBM Almaden Research Center
Francesca Iacopi, Griffith University
Atsuko Sekiguchi, National Institute of Advanced Industrial Science and Technology
Sean W. King, Intel Corporation
Christian Dussarat, Air Liquide Delaware Research and Technology Center

Symposium Support

Air Liquide
Air Products
Applied Materials, Inc.
IBM Almaden Research Center
Intel Corporation
TEL Technology Center, America, LLC

C2: Low-k II
Session Chairs
Willi Volksen
Tuesday PM, April 10, 2012
Moscone West, Level 2, Room 2003

2:30 AM - *C2.1
Plasmas Processes Challenges for Porous SiCOH Integration in Advanced Interconnects

Thierry Chevolleau 1 Maxime Darnon 1 Nicolas Posseme 2 Thibaut David 2 Regis Bouyssou 3 Fanny Bailly 3 Julien Ducote 3 Christophe Licitra 2 Christophe Verove 3 Olivier Joubert 1

1LTM - CNRS Grenoble France2CEA-Leti Minatec Grenoble France3STMicroelectronics Crolles France

Show Abstract

3:00 AM - C2.2
Damage Imaging of Low-k Materials in Cu Interconnect by Helium Ion Microscopy

Shinichi Ogawa 1 Tomohiko Iijima 1

1AIST Tsukuba-city, Ibarki-ken Japan

Show Abstract

3:15 AM - C2.3
Development of Effective Repair Chemistries for Restoration of Damaged Low-k Films

Curtis Anderson 1 Francois Doniat 1 James McAndrew 1 Christian Dussarrat 1

1Air Liquide Newark USA

Show Abstract

3:30 AM - C2.4
Application of Downstream Hydrogen Plasma for Photoresist Strip with Minimal Damage to and Losses of Materials Involved in Advanced-Device Fabrication

Bayu Atmaja Thedjoisworo 1 Davoud Zamani 2 David Cheung 1

1Novellus Systems San Jose USA2University of Arizona Tuscon Tuscon USA

Show Abstract

3:45 AM - C2.5
Etch Challenges of a Spin-on Trilayer Resist System for Narrow Pitch Dual Damascene Patterning

Frederic Lazzarino 1 Christopher Wilson 1 Vincent Truffert 1 Bart Vereecke 1 Steven Demuynck 1 Jean-Francois de Marneffe 1 Mikhail R Baklanov 1

1imec vzw Leuven Belgium

Show Abstract

4:00 AM -
BREAK

4:30 AM - C2.6
A New Class of ULK for Advanced Interconnects

Yusuke Matsuda 1 Geraud Dubois 2 Jitendra Rathore 2 Leonard Interrante 3 Reinhold Dauskardt 1

1Stanford University Stanford USA2IBM San Jose USA3Rensselaer Polytechnic Institute Troy USA

Show Abstract

4:45 AM - C2.7
Evaluation of New Ultra Low-k Material with Exceptionally Good Chemical Stability

Mikhail B Krishtab 1 2 Toan Q Le 2 Kris Vanstreels 2 Liping Zhang 2 Mikhail R Baklanov 2 Mark Phillips 3

1Saint Petersburg Electrotechnical University St. Petersburg Russian Federation2imec Leuven Belgium3SBA Materials, Inc. Albuquerque USA

Show Abstract

5:00 AM - C2.8
Effect of Silane Alkylation on Mechanical Performance and Etch Resistance in Spin-on Ultralow-kappa; (1.8-2.4) SiOCH Films

Mark L.F. Phillips 1 Travis J Savage 1

1SBA Materials, Inc. Albuquerque USA

Show Abstract

5:15 AM - C2.9
Study of Ion and VUV Effects on Self-assembled Organic Low-k Material Exposed to Argon Plasma

Jean-Francois de Marneffe 1 Rami Ljazouli 2 Laurent Souriau 1 Liping Zhang 1 Hsiang-Yun Lee 3 Christopher C Wilson 1 Mikhail R Baklanov 1

1imec vzw Leuven Belgium2Polytech'Orleans Orleans France3Stanford University Stanford USA

Show Abstract

C1: Low-k I
Session Chairs
Geraud Dubois
Tuesday AM, April 10, 2012
Moscone West, Level 2, Room 2003

9:00 AM -
Organizers Introduction

9:15 AM - *C1.1
Post Porosity Plasma Protection: A New Platform to Minimize Process Damage of Highly Porous Dielectric Materials

Willi Volksen 1 Theo Frot 1 Teddie Magbitang 1 Sampath Purushothaman 2 Robert L Bruce 2 Geraud Dubois 1

1IBM Almaden Research Center San Jose USA2IBM T.J. Watson Research Center Yorktown Heights USA

Show Abstract

9:45 AM - C1.2
Pore Sealing to Enable Integration of Porous Low-k Inter Layer Dielectrics with ALD Metals

Rohan Akolkar 1 Jeff Bielefeld 1 James Clarke 1 Tejaswi Indukuri 1 Christopher Jezewski 1 John Plombon 1 Jeanette Roberts 1

1Intel Corporation Hillsboro USA

Show Abstract

10:00 AM - C1.3
Pore Sealing of High Porosity Mesoporous Silica Films by Self-assembled Carbon-bridged Organosilicas

Isabel Van Driessche 1 Frederik Goethals 1 Mikhail R Baklanov 2 Pascal Van Der Voort 1

1Ghent University Ghent Belgium2IMEC Leuven Belgium

Show Abstract

10:15 AM - C1.4
Pore Seal Property of Ultra-thin Layer for Porous Low-k Films Using Ellipsometric Porosimetry

Shoko Sugiyama Ono 1 Yasuhisa Kayaba 1 Tsuneji Suzuki 1 Hirofumi Tanaka 1 Kazuo Kohmura 1

1Mitsui Chemicals, Inc. Sodegaura, Chiba Japan

Show Abstract

10:30 AM - C1.5
Pore Sealing of SiOCH Ultra Low-k Dielectric with Polyimide Langmuir-Blodgett Film

Svetlana I Goloudina 1 Alexey S Ivanov 1 Mikhail B Krishtab 1 2 Victor V Luhinin 1 Vyacheslav M Pasyuta 1 Mikhail R Baklanov 2

1Saint Petersburg Electrotechnical University St. Petersburg Russian Federation2imec Leuven Belgium

Show Abstract

10:45 AM - C1.6
Post Porosity Plasma Protection II: An Alternative Integration Approach for Microporous Ultra Low k Materials

Teddie Magbitang 1 Theo Frot 1 Robert L Bruce 2 Sampath Purushothaman 2 Willi Volksen 1 Geraud Dubois 1

1IBM Almaden Research Center San Jose USA2IBM TJ Watson Research Center Yorktown Heights USA

Show Abstract

11:00 AM -
BREAK

11:30 AM - *C1.7
Extending PECVD Based Porous Ultra-Low-k Dielectrics for Sub-22nm Generation

Dimitri Kioussis 1 Todd Ryan 3 Steve M Gates 5 Alfred Grill 5 Anita Madan 2 Nancy Klymko 2 Christopher Parks 2 Steve Molis 2 Leo Tai 2 Elbert Huang 5 Larry Clevenger 2 Hideaki Masuda 7 Ben Kim 8 Byunghee Kim 9 Shao Beng Law 1 Darryl Restaino 2 Zhiguo Sun 1 Youbo Lin 1 Shobha Hosadurga 4 Steven A Cohen 5 Janine Protzman 2 Kumar Virwani 6

1GLOBALFOUNDRIES Hopewell Junction USA2IBM, Semiconductor Research and Development Center Hopewell Junction USA3GLOBALFOUNDRIES, at Albany Nanotech Albany USA4IBM, at Albany Nanotech Albany USA5IBM T.J. Watson Research Center Yorktown Heights USA6IBM Almaden Research Center San Jose USA7Toshiba Electronic Components America Hopewell Junction USA8STMicroelectronics Hopewell Junction USA9Samsung Electronics Corporation Hopewell Junction USA

Show Abstract

12:00 PM - C1.8
Nanoporous SiCOH/CxHy Dual Phase Films with Ultralow Dielectric Constant and High Youngrsquo;s Modulus

Jong-Min Park 1 Byung-Seon Kong 2 Hee-Tae Jung 1

1KAIST Daejeon Republic of Korea2KCC Central Research Institute Yongin Republic of Korea

Show Abstract

12:15 PM - C1.9
Novel Ultralow-k Interconnect Dielectric Fabricated with Single Precursor

Son Nguyen 2 Hosadurga Shobha 2 Stephan Cohen 1 Anita Madan 3 Eduard Adams 4 Kumar Virwani 5 Donald Canaperi 2 Todd Ryan 6 Alfred Grill 1

1IBM T.J.Watson Res.Ctr. Yorktown Heights USA2IBM at Albany Nanotech Albany USA3IBM STG Hopewell Junction USA4IBM STG Essex Junction USA5IBM Almaden Res.Ctr. San Jose USA6GLOBALFOUNDRIES Albany USA

Show Abstract

12:30 PM - C1.10
Understanding the Impact of Porosity and Pore Structure in Ultra Low Dielectric Constant Organosilicate Glasses

Jennifer E Al-Rashid 1 Raymond N Vrtis 1 Irene J Hsu 1 Anupama Mallikarjunan 1 Kathleen E Theodorou 1 John M Zielinski 2

1Air Products and Chemicals, Inc. Allentown USA2Intertek Analytical Sciences Americas Allentown USA

Show Abstract

12:45 PM - C1.11
Development of a Suite of Computational Models for the Design of Ultralow-k SiCOH-based Materials

Alexandra Cooper 1 Paulette Clancy 1

1Cornell University Ithaca USA

Show Abstract

2012-04-11   Show All Abstracts

Symposium Organizers

Geraud Dubois, IBM Almaden Research Center
Francesca Iacopi, Griffith University
Atsuko Sekiguchi, National Institute of Advanced Industrial Science and Technology
Sean W. King, Intel Corporation
Christian Dussarat, Air Liquide Delaware Research and Technology Center

Symposium Support

Air Liquide
Air Products
Applied Materials, Inc.
IBM Almaden Research Center
Intel Corporation
TEL Technology Center, America, LLC

C5: Metallization II (Copper Seed and Characterization)
Session Chairs
Christian Dussarat
Wednesday PM, April 11, 2012
Moscone West, Level 2, Room 2003

2:30 AM - *C5.1
Approaches to Copper Electrodeposition for the 2x nm Node and Beyond

George Andrew Antonelli 1 Huanfeng Zhu 1 Jon Reid 1

1Novellus Systems, Inc. Tualatin USA

Show Abstract

3:00 AM - C5.2
Evaluation of Wet Cu Seed Deposition to Enable Downscaling Damascene Metallization

Silvia Armini 1 Johan Swerts 1 Yong Kong Siew 1 Zaid El-Mekki 1 Leonardus Leunissen 1

1IMEC Leuven Belgium

Show Abstract

3:15 AM - C5.3
Plasma Etching of Copper Thin Film over a Dielectric Step and Electromigration Failure Mechanism

Yue Kuo 1 Chi-Chou Lin 1

1Texas Aamp;M University College Station USA

Show Abstract

3:30 AM - C5.4
Stress Effects in Cu Interconnects for RF Technology

Jeff Gambino 1 Edward Cooney 1 Felix Anderson 1 John He 1 Cyril Cabral 2

1IBM Microelectronics Essex Junction USA2IBM Research Yorktown Heights USA

Show Abstract

3:45 AM - C5.5
RF Characteristics of Copper Vias

Anshul Ashok Vyas 1 Francisco Madriz 1 Patrick Wilhite 1 Toshishige Yamada 1 Cary Y Yang 1

1Santa Clara University Santa Clara USA

Show Abstract

4:00 AM -
BREAK

C6: Metallization III (Copper Reliability and CMP)
Session Chairs
Sean King
Wednesday PM, April 11, 2012
Moscone West, Level 2, Room 2003

4:30 AM - *C6.1
Stress and Reliability in Cu Interconnects

Paul Besser 1 Conal Murray 2

1GLOBALFOUNDRIES Sunnyvale USA2IBM Yorktown Heights USA

Show Abstract

5:00 AM - C6.2
Simulating SEM Images of Crystalline Copper with Amorphous Top Layer: The Modeling and Verification

Satoshi Takada 1 2 Makoto Suzuki 2 Sergey Borisov 3 Eric Eisenbraun 1

1State University of New York Albany USA2Hitachi High-Technologies Corporation Hitachinaka Japan3Abeam Technologies Castro Valley USA

Show Abstract

5:15 AM - C6.3
Cu CMP and Its Challenge for 20nm Nodes and Beyond

John Zhang 1 Wei-Tsu Tseng 2 Economikos Laertis 2 Qiang Fang 3 Jianping Zheng 3 Lin Yang 2 Donald F Canaperi 4 Michael Lofaro 5 Ben Kim 1 Chao-Kun Hu 5 Eric Liniger 5 Richard Murphy 2 Tsong Lin L Tai 2 Naftali Lustig 2 Walter Kleemier 1 Cindy Goldberg 1 Jennifer Muncy 2 Griselda Bonilla 5 Xiaomeng Chen 2 Ron Sampson 1

1STMicroelectronics Hopewell Junction USA2IBM Semiconductor Research and Development Center (SRDC) Hopewell Junction USA3GLOBALFOUNDRIES Hopewell Junction USA4IBM at Albany Nanotech Albany USA5IBM Research Center Yorktown Heights USA

Show Abstract

5:30 AM - C6.4
Pad Roughness Effects by Diamond Conditioner on the Step Height Reduction in CMP Processes

Jae-Young Bae 1 Jihoon Seo 1 Kwangseob Yoon 2 Jinok Moon 1 3 Ungyu Paik 1 2

1Hanyang University Seoul Republic of Korea2Hanyang University Seoul Republic of Korea3Samsung Electronics Gyeonggi-Do Republic of Korea

Show Abstract

5:45 AM - C6.5
A Model of Chemical Mechanical Planarization to Predict Impact of Pad Conditioning on Process Performance

G. Bahar Basim 1 Serkan Kincal 2

1Ozyegin University Istanbul Turkey2Middle East Technical University Ankara Turkey

Show Abstract

C7: Poster Session
Session Chairs
Sean King
Wednesday PM, April 11, 2012
Marriott, Yerba Buena, Salons 8-9

9:00 AM - C7.1
A Novel Polymer Technology for Underfill

Toshiyuki Sato 1 Osamu Suzuki 1 Paul Czubarow 2 David Son 3

1NAMICS Corporation Niigata Japan2eM-TECH, Inc. Wellesley USA3Southern Methodist University Dallas USA

Show Abstract

9:00 AM - C7.10
Characterization of Nanotwinned Cu Films Prepared by Pulsed Electrodeposition at Low Temperature

Che-Yi Lin 1 Tsung-Cheng Chan 1 Chien-Neng Liao 1

1National Tsing Hua University Hsinchu Taiwan

Show Abstract

9:00 AM - C7.11
Surface Cleaning for Enhanced Adhesion to Packaging Surfaces: Plasma and Free Radical Chemistries

Sneha Sen Gaddam 1 Haseeb Kazi 2 Jeff Kelber 3

1University of North Texas Denton USA2University of North Texas Denton USA3University of North Texas Denton USA

Show Abstract

9:00 AM - C7.12
Plasma Cleaning of Ru for Cu Interconnect Adhesion

Xin Liu 1 Chiyu Zhu 1 Tianyin Sun 1 Sean W King 2 Robert J Nemanich 1

1Arizona State Unversity Tempe USA2Intel Corporation Hillsboro USA

Show Abstract

9:00 AM - C7.13
New Concentration Dependence of Pressure in Nanopores: Diffusion Mechanism of Impulse Transfer in Nanoscaled Systems

Valeriy Efimovich Arkhincheev 1 Mikhail R Baklanov 2 Bair Z Darmaev 1

1Institute of Physical Materials Science Ulan-Ude Russian Federation2IIMEC Leuven Belgium

Show Abstract

9:00 AM - C7.2
Hydrofluoric-acid-resistant Spin-on Dielectrics by Sol-gel Process

Takahisa Yamazaki 1 Masaaki Hirakawa 1 Hirohiko Murakami 1

1Ulvac, Inc. Tsukuba Japan

Show Abstract

9:00 AM - C7.3
Simulation of Electromigration Effects on Voids in Monocrystalline Ag Films

Andreas Latz 1 Dietrich E Wolf 1

1University Duisburg-Essen Duisburg Germany

Show Abstract

9:00 AM - C7.4
Etch Process Optimization and Electrical Improvement in TiN Hard Mask Ultra-low k Interconnection

Chih-Yang Chang 1 Sean Kang 1 Chia-ling Kao 1 Bhargav S Citla 1 Nikos Bekiaris 1 Yongmei Chen 1 Bryan Pu 1 Throsten Lill 1

1Applied Materials, Inc Sunnyvale USA

Show Abstract

9:00 AM - C7.5
Characteristics of Nickel Thin Film Deposited by Plasma Enhanced ALD Using Ni(EtCp)2

Jingyu Park 2 Taeyong Park 1 Jaesang Lee 2 Heeyoung Jeon 2 Hyeongtag Jeon 1

1Hanyang University Seoul Republic of Korea2Hanyang Universtiy Seoul Republic of Korea

Show Abstract

9:00 AM - C7.8
Advanced Slurry Formulations for New Generation Chemical Mechanical Planarization (CMP) Applications

G. Bahar Basim 1 Ayse Karagoz 1 Brij M. Moudgil 2

1Ozyegin University Istanbul Turkey2University of Florida Gainesville USA

Show Abstract

9:00 AM - C7.9
Electromigration in Ag Nanowires with a Single Grain Boundary Structured by Focused Ion Beam

Simon Sindermann 1 Guenter Dumpich 1 Frank-J. Meyer zu Heringdorf 1

1University Duisburg-Essen D-47057 Duisburg Germany

Show Abstract

C3: Reliability (Low-k)
Session Chairs
Geraud Dubois
Wednesday AM, April 11, 2012
Moscone West, Level 2, Room 2003

9:15 AM - *C3.1
Leakage and Dielectric Breakdown in Low K Dielectrics

T. M Shaw 1 E. G Liniger 1 C. J Penny 2 E. Huang 1 J. M Atkin 3 R. B Laibowitz 3 G. Bonilla 1

1IBM Yorktown Heights USA2Albany Nano Technology Research Center Albany USA3Columbia University New York USA

Show Abstract

9:45 AM - C3.2
Determination of the Low-k Dielectric/Cu Band Diagram for a Fundamental Understanding of Interconnect Leakage Mechanisms

Sean King 1 Marc French 1 Milt Jaehnig 1 Markus Kuhn 1 Benjamin French 1

1Intel Corporation Hillsboro USA

Show Abstract

10:00 AM - C3.3
Magnetic Resonance Studies of Back End of Line Dielectrics

Brad Bittel 1 Thomas Pomorski 1 Patrick Lenahan 1 Sean King 2

1Penn State University Park USA2Intel Corp. Hillsboro USA

Show Abstract

10:15 AM - C3.4
Nano-porosity Limitations for Dielectric Constant Scaling of Low-k a-SiC(N):H Diffusion Barriers and SiOC:H Inter Layer Dielectrics

Ebony Mays 1 Jeff Bielefeld 1 Danya Jacob 1 Brent Colvin 1 David Vanleuven 1 Sean King 1 Ming Liu 2 David Gidley 2

1Intel Corporation Hillsboro USA2University of Michigan Ann Arbor USA

Show Abstract