Symposium SF01-Additive Manufacturing—From Material Design to Emerging Applications

The recent advances and successes in additive manufacturing (AM) have propelled the field into a new era of design and manufacturing possibilities. AM offers a transformative approach that enables the creation of complex architectures with unprecedented precision and efficiency. This technology has revolutionized various industries, such as aerospace, automotive, healthcare, defense, and consumer products. In addition to the advancements in AM processes and material innovation, the integration of data-driven material design and process modeling with AM techniques paves the way for accelerated material development, improved process control, and enhanced material performance. This multidisciplinary approach fosters innovation, reduces development cycles, and promotes the adoption of AM across various industries.

Building upon the prior Fall 2021 symposium on this topic, this symposium provides a forum to present research progress based on experimental and/or computational approaches. We invite researchers, practitioners and industry professionals to submit their original and unpublished contributions.

Topics will include:

  • Novel materials development by/for AM

  • AM technology and process development (e.g., powder bed fusion, projection stereolithography, direct ink writing, drop-on-demand ink jetting, cold spray, directed energy deposition, binder jetting)

  • AM process control (e.g., defect mitigation)

  • Design and optimization: Design for AM, topology optimization, architected materials, design automation

  • Standards, metrology, and quality control: Standardization efforts, metrology techniques, real-time monitoring, inspection, material characterization, quality assurance

  • Multi-physics computational modeling, data analytics, and machine learning for AM

  • Applications and case studies: AM in aerospace, automotive, healthcare, tooling, and other industries. Case studies demonstrating the practical implementation and success stories are particularly encouraged

Invited Speakers (tentative):

  • Nesma Aboulkhair (University of Nottingham, United Kingdom)
  • Susmita Bose (Washington State University, USA)
  • Jian Cao (Northwestern University, USA)
  • Shih-Chi Chen (Chinese University of Hong Kong, Hong Kong)
  • Amy Clarke (Colorado School of Mines, USA)
  • Zachary Cordero (Massachusetts Institute of Technology, USA)
  • Tarasankar DebRoy (The Pennsylvania State University, USA)
  • David Dunand (Northwestern University, USA)
  • Randall Erb (Northeastern University, USA)
  • Wendy Gu (Stanford University, USA)
  • Christopher Hutchinson (Monash University, Australia)
  • Jitae Kim (The University of Hong Kong, Hong Kong)
  • Jae-Hwang Lee (University of Massachusetts Amherst, USA)
  • Christian Leinenbach (Swiss Federal Laboratories for Materials Science and Technology, Switzerland)
  • Jennifer Lewis (Harvard University, USA)
  • Manyalibo Matthews (Lawrence Livermore National Laboratory, USA)
  • Amy Peterson (University of Massachusetts Lowell, USA)
  • Minh-Son Pham (Imperial College London, United Kingdom)
  • Anthony Rollett (Carnegie Mellon University, USA)
  • Julie Schoenung (University of California, Irvine, USA)
  • Christopher Schuh (Massachusetts Institute of Technology, USA)
  • Matteo Seita (University of Cambridge, United Kingdom)
  • Christopher Spadaccini (Lawrence Livermore National Laboratory, USA)
  • Hayden Taylor (University of California, Berkeley, USA)
  • Iain Todd (Sheffield University, United Kingdom)
  • Lorenzo Valdevit (University of California, Irvine, USA)
  • Yinmin Wang (University of California, Los Angeles, USA)
  • Yanliang Zhang (University of Notre Dame, USA)
  • Xiaoyu Zheng (University of California, Berkeley, USA)
  • Ting Zhu (Georgia Institute of Technology, USA)

Symposium Organizers

Wen Chen
University of Massachusetts Amherst
Mechanical and Industrial Engineering
USA
No Phone for Symposium Organizer Provided , wenchen@umass.edu

Allison Beese
The Pennsylvania State University
USA
No Phone for Symposium Organizer Provided , beese@matse.psu.edu

John Hart
Massachusetts Institute of Technology
USA
No Phone for Symposium Organizer Provided , ajhart@mit.edu

Sarah Wolff
The Ohio State University
Mechanical and Aerospace Engineering
USA
No Phone for Symposium Organizer Provided , wolff.357@osu.edu

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MRS publishes with Springer Nature

 

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