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Symposium Sessions

Topical Clusters

  • Characterization (CH)
  • Materials Theory, Computation and Data (DS)
  • Energy and Sustainability (EN)
  • Electronics, Optics and Photonics (EQ)
  • Manufacturing (MF)
  • Nanomaterials (NM)
  • Quantum (QT)
  • Biomaterials and Soft Materials (SB)
  • Structural and Functional Materials (SF)

Symposium SF03—Paper-Based Packaging—21st Century Perspectives on an Ancient Material

Paper, paperboard, and corrugated board have been in use as packaging materials for centuries. However, during recent years the functionality of paper- based packaging has increased greatly due to the introduction of new raw materials and the integration of active and smart components. This symposium will highlight the latest progress in materials science and technology that is driving these developments. We will bring together researchers and application experts from a wide range of disciplines to discuss a multitude of aspects of modern paper-based packaging. A major focus will be on novel functional materials, coatings and other methods for material and surface modification, which provide added functionalities. These include better mechanical performance, robustness and reliability, barrier properties against gas and moisture penetration and improved safety against pathogens. Another central topic will be large- area and printed electronics on paper substrates to provide intelligence and prepare devices for sensing, data transmission and power generation. Also included in the scope of the program is research on new types of fibers from non-traditional sources which have been introduced to produce papers and cardboard with novel and unprecedented properties. The developments covered in this symposium will significantly widen the functionalities of paper-based packaging materials, enhance their performance and provide a multitude of novel applications and end user experiences. At the same time, the increasing compositional complexity introduced by these developments has created new challenges for the end-of-life fate of modern packaging materials based on corrugated board, paperboard and paper. Package performance issues and possible solutions, including recyclability, will be dealt with in dedicated sessions.

Topics will include:

  • Paper and corrugated board mechanics and dimensional stability
  • Packaging materials from non-traditional fibers
  • Novel characterization techniques for paper and corrugated board
  • Theoretical modeling of paper and corrugated board properties
  • Functional printing, coating and surface treatment methods for paper-based substrates
  • Paper-based materials for active packaging
  • Controlled release of active substances from papers
  • Gas and moisture barrier coatings on paper
  • Antimicrobial and antiviral paper coatings
  • Paper and corrugated board as smart packaging materials
  • Paper-based electronics and batteries
  • Recycling and bio-degradation of modern paper-based packaging materials

Invited Speakers:

  • Warren Batchelor (Monash University, Australia)
  • Julien Bras (Université Grenoble Alpes, France)
  • Seokheun Choi (Binghamton University, USA)
  • Magnus Lestelius (Karlstad University, Sweden)
  • Yonghao Ni (University of New Brunswick, Canada)
  • Mikael Nygards (BillerudKorsnäs AB, Sweden)
  • Lokendra Pal (North Carolina State University, USA)
  • Peter Rättö (RISE Research Institutes of Sweden, Sweden)
  • Feng Xu (Beijing Forestry University, China)
  • Xuejun Zou (FPInnovations, Canada)

Symposium Organizers

Robert Abbel
New Zealand Forest Research Institute (Scion)
Chemistry and Physics Research Group
New Zealand

Douglas W Coffin
Miami University
Department of Chemical, Paper and Biomedical Engineering

Hongbin Liu
Tianjin University of Science & Technology
Papermaking Science and Technology College

Beko Mesic
Karlstad University
Department of Engineering and Chemical Sciences

Publishing Alliance

MRS publishes with Springer Nature

Symposium Support