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2015 MRS Spring Meeting Logo2015 MRS Spring Meeting & Exhibit

April 6-10, 2015 | San Francisco
Meeting Chairs: Artur Braun, Hongyou Fan, Ken Haenen, Lia Stanciu, Jeremy A. Theil



Symposium BB : Innovative Interconnects/Electrodes for Advanced Devices, Flexible and Green-Energy Electronics

2015-04-07   Show All Abstracts

Symposium Organizers

Mikhail Baklanov, IMEC
Jeffery Bielefeld, Intel Corporation
Vincent Jousseaume, CEA-LETI
Eiichi Kondoh, Univ of Yamanashi

Symposium Support

Air Products
Aldrich Materials Science
Applied Materials, Inc.
CEA-LETI
Intel Corporation
Lam Research Corporation
Tokyo Electron America, Inc.
BB2: Low-K Materials II
Session Chairs
Jeffery Bielefeld
Alfred Grill
Tuesday PM, April 07, 2015
Moscone West, Level 2, Room 2014

2:30 AM - *BB2.01
Block Copolymer Packing Limits and Interfacial Reconfigurability in the Assembly of Periodic Mesoporous Organosilicas

Brett A. Helms 2 Andrew W. Wills 1 Peter Ercius 2 Ethan R. Rosenberg 2 Rory Runser 2

1Lawrence Berkeley National Lab Berkeley United States2The Molecular Foundry, LBNL Berkeley United States

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3:00 AM - BB2.02
Asymmetric Elastic Behavior in ULK Nanoporous Dielectric Glasses

Joseph Burg 1 Reinhold Dauskardt 1

1Stanford University Stanford United States

Show Abstract

3:15 AM - BB2.03
Adsorption Isobars of Fluorocarbon Compounds Selected for Cryogenic Plasma Etching of Low-K Dielectrics

Askar Rezvanov 2 3 Konstantin P Mogilnikov 1 Oleg P. Gutshin 2 Evgeny S. Gornev 2 3 Gennady Y. Krasnikov 2 3 Liping Zhang 4 Christian Dussarrat 5 Jean-Francois de Marneffe 4 Mikhail R. Baklanov 4

1Rzhanov Institute of Semiconductor Physics Novosibirsk Russian Federation2Molecular Electronics Research Institute Zelenograd, Moscow Russian Federation3Moscow Institute of Physics and Technology Dolgoprudny Russian Federation4IMEC Leuven Belgium5Air Liquide Tokyo Japan

Show Abstract

3:30 AM - BB2.04
Enhancing Mechanical and Fracture Properties of ULK Materials with Filled Pores

Scott G. Isaacson 1 Krystelle Lionti 2 Willi Volksen 2 Teddie Magbitang 2 Yusuke Matsuda 1 Reinhold H. Dauskardt 1 Geraud Dubois 2 1

1Stanford University Stanford United States2IBM Almaden Research Center San Jose United States

Show Abstract

3:45 AM - BB2
BREAK

BB3: Metallization and Emerging Technologies
Session Chairs
Vincent Jousseaume
Zsolt Tokei
Tuesday PM, April 07, 2015
Moscone West, Level 2, Room 2014

4:15 AM - *BB3.01
Nanomolecularly Tailored Heterointerfaces for Electronics Device Metallization and Packaging

Ganpati Ramanath 1

1Rensselaer Polytechnic Institute Troy United States

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4:45 AM - BB3.02
Contact Metallization for Carbon Nanotube Interconnect Vias

Yusuke Abe 1 Anshul Ashok Vyas 1 Changjian Zhou 2 Richard Senegor 1 Patrick Wilhite 1 Cary Y. Yang 1

1Santa Clara University Santa Clara United States2Hong Kong University of Science and Technology Hong Kong Hong Kong

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5:00 AM - BB3.03
All-Carbon Interconnects: Fabrication and Integration

Yihan Chen 1 Changjian Zhou 1 Anshul A. Vyas 2 Mansun Chan 1 Cary Y. Yang 2

1The Hong Kong University of Science and Technology Hong Kong Hong Kong2Santa Clara University Santa Clara United States

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5:15 AM - BB3.04
Time Resolved Observation of Rapid Microstructural Transformation in Narrow Copper Lines

Brendan B OBrien 1 Luke Prestowitz 1 Kathleen A Dunn 1

1State University of New York Polytechnic Institute Albany United States

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5:30 AM - BB3.05
Low Temperature Interdiffusion of Cu/Ni in Supercritical Fluid Carbon Dioxide Using a New Cu(I) Amidinate Precursor

Md Rasadujjaman 1 Mitsuhiro Watanabe 1 Hiroshi Sudoh 2 Hideaki Machida 2 Eiichi Kondoh 1

1University of Yamanashi Kofu-shi, Yamanashi-ken Japan2Gas-Phase Growth Ltd. Tokyo Japan

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5:45 AM - BB3.06
Tailoring Electrical Contact Resistivity Across Metal-Thermoelectric Interfaces Using a Nanomolecular Monolayer

Thomas John Cardinal 1 . Devender 1 Theo Tasciuc 2 Ganpati Ramanath 1

1Rensselaer Polytechnic Institute Troy United States2Rensselaer Polytechnic Institute Troy United States

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BB1: Low-K Materials I
Session Chairs
Eiichi Kondoh
Mikhail Baklanov
Tuesday AM, April 07, 2015
Moscone West, Level 2, Room 2014

9:30 AM - *BB1.01
Material Innovations Driving Interconnect Scaling

Zsolt Tokei 1

1IMEC Leuven Belgium

Show Abstract

10:00 AM - *BB1.02
Dielectric Material Strategies for Interconnect Layers

David Michalak 1 James Blackwell 1 Arkaprabha Sengupta 2 Jessica Torres 1 Jeffery D. Bielefeld 1 Alan M Myers 1 James S Clarke 1 Daniel Pantuso 2

1Intel Corporation Hillsboro United States2Intel Corporation Hillsboro United States

Show Abstract

10:30 AM - *BB1.03
MOFs as Low-K Candidates for Future Technology Nodes

Christof Woell 1

1Karlsruhe Institute of Technology Karlsruhe Germany

Show Abstract

11:00 AM - BB1
BREAK

11:30 AM - BB1.04
Nanoscale Measurements of Processing-Induced Changes in the Mechanical Properties of PorousLow-K Dielectric Thin Films and Patterns

Gheorghe Stan 1 2 Richard Gates 1 Jessica Torres 3 David Michalak 3 Canay Ege 3 Jeffery D. Bielefeld 3 Ebony Mays 3 Sean King 3

1National Institute of Standards and Technology Gaithersburg United States2University of Maryland College Park United States3Intel Corporation Hillsboro United States

Show Abstract

11:45 AM - BB1.05
Post-Porosity Plasma Protection: A Promising Strategy Against v-UV Damage in Porous, Low-K Materials

Krystelle Lionti 2 Willi Volksen 2 Teddie Magbitang 2 Maxime Darnon 1 Geraud Dubois 2

1CNRS Grenoble France2IBM Almaden Research Center San Jose United States

Show Abstract

12:00 PM - BB1.06
Atomic Scale Study of Trap States in Low-K Dielectric Films Studied by Dynamic Tunneling Force Microscopy

Ruiyao Wang 1 Sean King 2 Clayton Williams 1

1Department of Physics and Astronomy, University of Utah Salt Lake City United States2Intel Hillsboro United States

Show Abstract

12:15 PM - BB1.07
Atomic Scale Study of the Effect of Electrical Stress in a Low-K Dielectric Film

Ruiyao Wang 1 Sean King 2 Clayton Williams 1

1Department of Physics and Astronomy, University of Utah Salt Lake City United States2Intel Corporation Hillsboro United States

Show Abstract

12:30 PM - BB1.08
Porous SiOCH Thin Films Obtained by Foaming

Julien El Sabahy 1 Gael Castellan 1 Christophe Licitra 1 Florence Ricoul 1 Vincent Jousseaume 1

1CEA Leti Grenoble France

Show Abstract

12:45 PM - BB1.09
Can Boron Overturn Silicon in the Search for Low-k Dielectric Materials?

Michelle M Paquette 1 Bradley J Nordell 1 Thuong Dang Nguyen 1 Anthony N Caruso 1 Sudhaunshu Purohit 2 William A Lanford 3 Patrick Henry 4 Sean W King 4

1University of Missouri-Kansas City Kansas City United States2University of Missouri-Kansas City Kansas City United States3University at Albany Albany United States4Intel Corporation Hillsboro United States

Show Abstract

2015-04-08   Show All Abstracts

Symposium Organizers

Mikhail Baklanov, IMEC
Jeffery Bielefeld, Intel Corporation
Vincent Jousseaume, CEA-LETI
Eiichi Kondoh, Univ of Yamanashi

Symposium Support

Air Products
Aldrich Materials Science
Applied Materials, Inc.
CEA-LETI
Intel Corporation
Lam Research Corporation
Tokyo Electron America, Inc.
BB6: Barriers, Sealing and CMP
Session Chairs
Mikhail Baklanov
Alfred Grill
Wednesday PM, April 08, 2015
Moscone West, Level 2, Room 2014

2:30 AM - *BB6.01
Chemically Vapor Deposited (CVD) Polymers for Device Fabrication

Karen K. Gleason 1

1MIT Cambridge United States

Show Abstract

3:00 AM - BB6.02
Formation of Ultra-Thin Pore Seal Layer on Porous Low-K Films

Shoko Sugiyama Ono 1 Yasuhisa Kayaba 1 Hirofumi Tanaka 1 Hiroko Wachi 1 Koji Inoue 1

1Mitsui Chemicals, Inc. Chiba Japan

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3:15 AM - BB6.03
Transparent Barrier Films with Optimized Adhesion Through Nanoscale Interface Engineering

Can Cai 1 Reinhold H. Dauskardt 1

1Stanford University Stanford United States

Show Abstract

3:30 AM - BB6.04
Graphene-Based Diffusion Barrier and Its Defect-Dependent Properties

Sooyeoun Oh 1 Janghyuk Kim 1 Jihyun Kim 1

1Korea University Seoul Korea (the Republic of)

Show Abstract

3:45 AM - BB6
OPEN DISCUSSION

Show Abstract

4:00 AM - BB6
BREAK

BB7: Electrodes and Energy
Session Chairs
Eiichi Kondoh
Jeffery Bielefeld
Wednesday PM, April 08, 2015
Moscone West, Level 2, Room 2014

4:30 AM - *BB7.01
Innovation of BEOL Devices for Energy Efficient Computing

M. Tada 1

1Low-Power Electronics Association amp; Project (LEAP) Tsukuba Japan

Show Abstract

5:00 AM - BB7.02
Role of Indium-Tin-Oxide Interlayer on Ag Reflector in Flexible Top-Illuminated Polymer Solar Cells: Absorption Spectra Tuning by Microcavity Structure

Wan Jae Dong 1 Jong-Lam Lee 1

1POSTECH Pohang Korea (the Republic of)

Show Abstract

5:15 AM - BB7.03
Transfer Printing of Electrodes for Organic Solar Cells - Nanoscale Versus Macroscale Continuity

Timo Jakob 1 Andreas Polywka 1 Luca Stegers 1 Engin Akdeniz 1 Stephan Kropp 1 Michael Frorath 1 Sara Trost 1 Tobias Schneider 1 Thomas Riedl 1 Patrick Goerrn 1

1University of Wuppertal Wuppertal Germany

Show Abstract

5:30 AM - BB7.04
InN/InGaN Quantum Dot Photoelectrode: An Advanced Energy Material for Efficient Water Splitting and Hydrogen Generation at Zero Voltage

Naveed Ul Hassan Alvi 1 Pavel Aseev 1 Soto Rodriguez Paul 1 Gomez Hernandez Jesus Victor 1 Magnus Willander 2 Richard Notzel 3 Calleja Pardo Enrique 1

1Universidad Politeacute;cnica de Madrid Madrid Spain2Linkouml;ping University Sweden Norrkouml;ping Sweden3Universitaacute; di Milano-Bicocca, Milan Italy

Show Abstract

5:45 AM - BB7.05
Flexible Lithium Ion Rechargeable Battery with Large Scale Interdigitated Electrodes

Tae-Hyung Kang 1 2 Ki-Bum Kim 1 2 Avelino Da Costa 2 Kyu Hwan Oh 1 Woong-Ryeol Yu 1 Nam-In Kim 3 In-Suk Choi 4

1Seoul National University Seoul Korea (the Republic of)2Korea Institute of Science and Technology Seoul Korea (the Republic of)3Rocket Electronic Cooperation, LTD. Gwangjoo Korea (the Republic of)4KIST Seoul Korea (the Republic of)

Show Abstract

BB8: Poster Session
Session Chairs
Jeffery Bielefeld
Vincent Jousseaume
Wednesday PM, April 08, 2015
Marriott Marquis, Yerba Buena Level, Salon 7/8/9

9:00 AM - BB8.01
Low-Temperature Curable Conductive Pastes for Electronic Devices

Ho Sun Lim 1 Seong-Dae Park 1

1Korea Electronics Technology Institute Seongnamsi Korea (the Republic of)

Show Abstract

9:00 AM - BB8.02
Effects of Titanic Oxide Nanofibers on Electrical and Thermal Properties of Silver Nanowires

Ming-Chih Tsai 1 2 Shang-Jung Yang 2 3 Yu-Hsuan Ho 2 Kai-Yu Peng 2 Wei-Cheng Tian 1 Pei-Kuen Wei 2 3

1Graduate Institute of Biomedical Electronicsamp; Bioinformatics Taipei Taiwan2Research Center for Applied Sciences Taipei Taiwan3Insititue of Optoelectronic Sciences Keelung Taiwan

Show Abstract

9:00 AM - BB8.03
Crystal Growth of Co Film Fabricated by Electrodeposition with Supercritical Carbon Dioxide Emulsion

Xun Luo 1 Tso-Fu Mark Chang 1 Hideki Hosoda 1 Tatsuo Sato 1 Masato Sone 1

1Tokyo Institute of Technology Yokohama Japan

Show Abstract

9:00 AM - BB8.04
Metallization on Textile by Pd Catalyzation and Ni Electroless Deposition Using Supercritical Carbon Dioxide

Mitsuo Sano 1 Tso-Fu Mark Chang 1 Tatsuo Sato 1 Masato Sone 1 Yuma Tahara 2 Tomoko Hashimoto 2 Hiromichi Kurosu 2

1Tokyo Institute of Technology Yokohama Japan2Nara Women's University Nara Japan

Show Abstract

9:00 AM - BB8.05
Fabrication of Silver Nanowire Based Transparent and Conducting Films through Optimization of Synthesis Protocol

Hyunjin Moon 1 Jinhwan Lee 1

1Seoul National University Seoul Korea (the Republic of)

Show Abstract

9:00 AM - BB8.06
Development of Electro-Deposited Fe-Ni Alloy Sheets for PCB Applications

Jin-Wan Jeon 1 Moon-Sick Hwang 1 Sunyong Kim 1 Dong Jin Lee 1 Yoo Jin Lee 1 Jae Hak Lee 1

1Tgo Tech. Corporation Hwaseong-si Korea (the Republic of)

Show Abstract

9:00 AM - BB8.07
Electronic Properties of Various B-doped Diamond(111)// Dye Molecule Interfaces

Karin Larsson 1

1Chemistry-Angstrom Laboratory Uppsala Sweden

Show Abstract

9:00 AM - BB8.08
Nitrogen Doped Graphene/Au Nanoparticle Composite Counter Electrode for Dye Sensitized Solar Cells

Sung Ryong Kim 1 Ye-Suel Song 1 Won-Kook Choi 2

1Korea National University of Transportation Chungju Korea (the Republic of)2Korea Institute of Science and Technology Seoul Korea (the Republic of)

Show Abstract

9:00 AM - BB8.09
Highly Transparent and Stretchable Electrodes using Solvolysis and Anneal Free Silver Nanowires Percolation Network

Jin Hwan Lee 1 Sukjoon Hong 1 Seung Yong Han 1 Jinhyeong Kwon 1 Hyunjin Moon 1 Seung Hwan Ko 1

1Seoul National University Seoul Korea (the Republic of)

Show Abstract

9:00 AM - BB8.10
Solution Printed, Aligned Silver Nanowire Arrays for High Performance Transparent Electrodes

Saewon Kang 1 Seungse Cho 1 Hyunhyub Ko 1

1UNIST Ulsan Korea (the Republic of)

Show Abstract

9:00 AM - BB8.11
Stretchable and Transparent Electrodes Based on Carbon Nanotube Rhombic Networks

Ayoung Choe 2 Sehee Ahn 2 Jonghwa Park 2 Heesuk Kim 1 Jeong Gon Son 1 Sang-Soo Lee 1 Min Park 1 Hyunhyub Ko 2

1Korea Institute of Science and Technology Seoul Korea (the Republic of)2UNIST Ulsan Korea (the Republic of)

Show Abstract

9:00 AM - BB8.12
Room Temperature Processed Electrochromic Smart Windows with Flexible Film

Haekyoung Kim 1 So Hee Lee 1 Jong Deok Park 1

1Yeungnam University Gyeungsan Korea (the Republic of)

Show Abstract

9:00 AM - BB8.13
Breaking Off the Low-K Death Curve Using a-BxC:Hy and Topological Constraint Theory

Bradley J Nordell 1 Christopher L Keck 1 Thuong Dang Nguyen 1 William A Landford 2 Sudhaunshu Purohit 3 Patrick Henry 4 Sean W King 4 Anthony N Caruso 1 Michelle M Paquette 1

1University of Missouri-Kansas City Kansas City United States2University of Albany Albany United States3University of Missouri-Kansas City Kansas City United States4Intel Corporation Hillsboro United States

Show Abstract

9:00 AM - BB8.14
High Performance Organic Transistors Using a Metallic Network as Transparent Gate Electrodes

Ke Pei 1 Paddy K. L. Chan 1

1The University of Hong Kong Hong Kong Hong Kong

Show Abstract

9:00 AM - BB8.15
A Novel Concept for Double-Sided Printing of Silver Electrodes for Advanced Printed Electronic Applications

Janghoon Park 1 Sungsik Park 1 Jongsu Lee 1 Dongil Nam 1 Yoonki Min 1 Youngwook Noh 1 Hakyung Jeong 1 Kee-Hyun Shin 1 Dongjin Lee 1

1Konkuk University Seoul Korea (the Republic of)

Show Abstract

9:00 AM - BB8.16
Performance Enhancement of Metal Nanowire Transparent Conducting Electrodes by Mesoscale Metal Wires

Po-Chun Hsu 1 Shuang Wang 2 Hui Wu 1 Vijay Narasimhan 1 Desheng Kong 1 Hye Ryoung Lee 2 Yi Cui 1 3

1Stanford University Stanford United States2Stanford University Stanford United States3SLAC National Accelerator Laboratory Menlo Park United States

Show Abstract

9:00 AM - BB8.17
Passivation Coating on Electrospun Copper Nanofibers for Stable Transparent Electrodes

Po-Chun Hsu 2 Hui Wu 2 Thomas Carney 2 Matthew T McDowell 2 Yuan Yang 2 Erik C. Garnett 2 Michael Li 2 Liangbing Hu 2 Yi Cui 2 1

1SLAC National Accelerator Laboratory Menlo Park United States2Stanford University Stanford United States

Show Abstract

9:00 AM - BB8.18
Flexure-Based Roll-to-Roll Platform: A Practical Solution for Realizing Large-Area Nanometer-Resolution Microcontact Printing

Xi Zhou 1 Huihua Xu 1 Jiyi Cheng 1 Ni Zhao 1 Shih-Chi Chen 1

1The Chinese University of Hong Kong Shatin Hong Kong

Show Abstract

9:00 AM - BB8.19
High Performance Magnetic Sensorics for Printable and Flexible Electronics

Daniil Karnaushenko 1 Denys Makarov 1 Max Stoeber 1 Dmitriy Karnaushenko 1 Stefan Baunack 1 Oliver G. Schmidt 1

1IFW-Dresden Dresden Germany

Show Abstract

9:00 AM - BB8.20
Organic Thin Film Deposition Inside Hollow Space Substrates via Thermal Vapor Deposition

Sebastian Montzka 1 Christine Nowak 2 Soenke Fuendling 2 Sebastian Franke 2 Stephanie Cheylan 2 Lisa Wolf 2 Johannes Reinker 1 Hans-Hermann Johannes 1 Hans Schmidt 2 Wolfgang Kowalsky 1

1TU Braunschweig, Institut fuuml;r Hochfrequenztechnik Braunschweig Germany2EMDEOLED GmbH Frankfurt / Main Germany

Show Abstract

9:00 AM - BB8.21
Effects of Chemical Intermixing on Electrical and Thermal Contact Conductances at Metallized Pnictogen Telluride Interfaces

. Devender 1 Rutvik Mehta 1 Kelly Lofgreen 4 Ravi Mahajan 4 Masashi Yamaguchi 3 Theo Tasciuc 2 Ganpati Ramanath 1 Thomas Cardinal 1

1Rensselaer Polytechnic Institute Troy United States2Rensselaer Polytechnic Institute Troy United States3Rensselaer Polytechnic Institute Troy United States4Intel Corporation Chandler United States

Show Abstract

9:00 AM - BB8.22
The Influence of Reactive Gases in the Growth of Carborane-Based Amorphous Hydrogenated Boron Carbide with Plasma-Enhanced Chemical Vapor Deposition

Thuong D. Nguyen 1 Bradley J. Nordell 1 Sudhaunshu S. Purohit 2 Abrar S. Alnafisah 2 Nathan A. Oyler 2 William A. Landford 3 Sean W. King 4 Anthony N. Caruso 1 Michelle M. Paquette 1

1University of Missouri-Kansas City Kansas City United States2University of Missouri-Kansas City Kansas City United States3University at Albany Albany United States4Intel Corporation Hillsboro United States

Show Abstract

9:00 AM - BB8.23
Work Function Tuning at the Au-HfO2 Interface Using an Organophosphonate Nanolayer

Matthew Palmer Kwan 1 Hubert Mutin 2 Ganpati Ramanath 1

1Rensselaer Polytechnic Institute Troy United States2Institut Charles Gerhardt Montpellier Montpellier France

Show Abstract

9:00 AM - BB8.24
Real-Time Characterization of the Sintering Behaviour of Conductive Inks for Printed Metallic Interconnects

Rob Hendriks 1 Edsger Smits 2 Gari Arutinov 2 Henk Steijvers 3 Robert Abbel 2 Jeroen van den Brand 2

1Novacentrix Austin United States2Holst Centre - TNO Eindhoven Netherlands3TNO Eindhoven Netherlands

Show Abstract

9:00 AM - BB8.25
Highly Efficient Polymer Light-Emitting Diodes Based on Flexible Silver Nanowire Bottom Electrode Realized by Pre-Bias Conditioning Treatment

Yonghee Lee 1 Minwon Suh 1 Duk Young Jeon 1

1KAIST Daejeon Korea (the Republic of)

Show Abstract

9:00 AM - BB8.26
Atomic Layer Deposited Hybrid Organic-Inorganic Aluminates as Potential Low-K Dielectric Materials

Karina B Klepper 2 Ola Nilsen 2 Helmer Fjellvag 2 David W Gidley 1 William A. Lanford 3 Liza Ross 4 Li Han 4 Sean King 4

1Univ of Michigan Ann Arbor United States2University of Oslo Oslo Norway3University of Albany Albany United States4Intel Corporation Hillsboro United States

Show Abstract

9:00 AM - BB8.27
Haze-Free, Flexible and Highly Transparent Polyimide Film with Sub-Wavelength Nanostructured Surface

Jae Yong Park 1 Illhwan Lee 1 Chul Jong Yoo 1 Jong-Lam Lee 1

1POSTECH Pohang Korea (the Republic of)

Show Abstract

BB4: Integration
Session Chairs
Vincent Jousseaume
Mikhail Baklanov
Wednesday AM, April 08, 2015
Moscone West, Level 2, Room 2014

9:30 AM - *BB4.01
Highly Reliable pSiCOH k=2.4 Interconnect Dielectric for Sub-10 nm Nodes Fabricated with Single Precursor

Son Nguyen 1 Deepika Priyadarshini 1 Hosadurga Shobha 1 Eric Liniger 3 Stephan Cohen 3 Anita Madan 2 Chao-Kun Hu 3 Edward Adams 5 Jay Burnham 5 James Chen 1 Huai Huang 1 Thomas Haigh 1 Matthew Shoudy 1 Steven Molis 2 Donald Canaperi 1 Thomas Shaw 3 E.Todd Ryan 4 Alfred Grill 3

1IBM at Albany Nanotech Albany United States2IBM Systems amp;Technology Group Hopewell Junction United States3IBM T.J.Watson.Res.Ctr. Yorktown Heights United States4Globalfoundries Albany United States5IBM Systems amp;Technology Group Essex Junction United States

Show Abstract

10:00 AM - BB4.02
Integration of Low-K Dielectrics Using Pore Stuffing

Jeffery D Bielefeld 1 Manish Chandhok 1 James S Clarke 1 Christopher J Jezewski 1 David Michalak 1 Alan M Myers 1 John J Plombon 1 Miriam R Reshotko 1 Kanwal Jit Singh 1 Jessica Torres 1 Robert Turkot 1 Hui Jae Yoo 1

1Intel Corporation Hillsboro United States

Show Abstract

10:15 AM - BB4.03
High-Temperature Behavior of Ag and Cu with Ta and TaN Metal Stacks

Shabnam Mardani 1 Hans Norstroem 1 Daniel Primetzhoferb 2 Joergen Olsson 1 Shili Zhang 1

1Uppsala University, The Angstrom Laboratory Uppsala Sweden2Uppsala University Uppsala Sweden

Show Abstract

10:30 AM - BB4
OPEN DISCUSSION

Show Abstract

10:45 AM - BB4.05
Low-Cost, Single-Step Hybrid Bond/Barrier Films for Cu Bondlines in Advanced Packaging

Qiran Xiao 1 Brian Watson 1 Reinhold H. Dauskardt 1

1Stanford University Stanford United States

Show Abstract

11:00 AM - BB4
BREAK

BB5: Packaging
Session Chairs
Jeffery Bielefeld
David Michalak
Wednesday AM, April 08, 2015
Moscone West, Level 2, Room 2014

11:30 AM - *BB5.01
Challenges in High Aspect Ratio TSV Metallization for 3D Integration - Materials, Processes and Characterization

Thierry Mourier 1

1LETI, MINATEC Campus Grenoble France

Show Abstract

12:00 PM - BB5.02
Alloy Solute Interactions at Grain Boundaries and Nanoscale Interfaces in Copper

Luke Clyde Oak Prestowitz 1 Brendan B OBrien 1 Bobby Brown 1 Kathleen A Dunn 1

1SUNY Poly Albany United States

Show Abstract

12:15 PM - BB5.03
Processing of Hybrid Films for High-Performance Bonding

Marta Giachino 1 Reinhold H. Dauskardt 1

1Stanford University Stanford United States

Show Abstract

12:30 PM - BB5.04
Reduction of TSV Sidewall Roughness and Stress Using Flexible Layer-by-Layer Materials

Daekyun Jeong 1 Rahim Abdur 3 Jaegab Lee 2

1Kookmin University Seoul Korea (the Republic of)2Kookmin Univ Seoul Korea (the Republic of)3Kookmin Univ Seoul Korea (the Republic of)

Show Abstract

2015-04-09   Show All Abstracts

Symposium Organizers

Mikhail Baklanov, IMEC
Jeffery Bielefeld, Intel Corporation
Vincent Jousseaume, CEA-LETI
Eiichi Kondoh, Univ of Yamanashi

Symposium Support

Air Products
Aldrich Materials Science
Applied Materials, Inc.
CEA-LETI
Intel Corporation
Lam Research Corporation
Tokyo Electron America, Inc.
BB10: Transparent Electrodes
Session Chairs
Eiichi Kondoh
Mikhail Baklanov
Thursday PM, April 09, 2015
Moscone West, Level 2, Room 2014

2:30 AM - BB10.01
Inline Laser Sintering of 3D Printed Silver Electrodes

Mark A. Scott 1 Suman Gunasekaran 1 Kundan Chaudhary 1 Bok Yeop Ahn 1 Jennifer A. Lewis 1

1Harvard University Cambridge United States

Show Abstract

2:45 AM - BB10.02
Electrolessly Deposited Metal Electrospun Nanowire Transparent Electrodes

Po-Chun Hsu 2 Desheng Kong 2 Shuang Wang 1 Haotian Wang 3 Alex Welch 2 Hui Wu 2 Yi Cui 2 4

1Stanford University Stanford United States2Stanford University Stanford United States3Stanford University Stanford United States4SLAC National Accelerator Laboratory Menlo Park United States

Show Abstract

3:00 AM - BB10.03
Transparent Ag Mesh Pattern Electrode with High Electrical Conductivity via Flash Light Sintering

Chang-Jin Moon 1 Taik-Min Lee 2 Inyoung Kim 2 Seung-Hyun Lee 2 Wan-Ho Chung 1 Hak-Sung Kim 1 3

1Hanyang University Seoul City Korea (the Republic of)2Korea Institute of Machinery and Materials Daejeon Korea (the Republic of)3Institute of Nano Science and Technology, Hanyang University Seoul Korea (the Republic of)

Show Abstract

3:15 AM - BB10.04
Uniform and Ordered Copper Nanomeshes by Microsphere Lithography for Transparent Electrodes

Tongchuan Gao 1 Baomin Wang 1 Bo Ding 1 Jung-kun Lee 1 Paul W Leu 1

1University of Pittsburgh Pittsburgh United States

Show Abstract

3:30 AM - BB10.05
Concurrent Deposition and Spontaneous Self-Welding of Silver Nanowire Networks

Baekhoon Seong 1 Ilkyeong Chae 1 Hyungdong Lee 1 Vu Dat Ngyuen 2 Doyoung Byun 1

1Sungkyunkwan University Suwon Korea (the Republic of)2Enjet Suwon Korea (the Republic of)

Show Abstract

3:45 AM - BB10.06
Scale-Up of oCVD: Large-Area Conductive Polymer Thin Films for Next-Generation Electronics

Peter Kovacik 1 Gabriella del Hierro 1 Karen Gleason 1

1MIT Cambridge United States

Show Abstract

4:00 AM - BB10
BREAK

4:30 AM - BB10.07
Flexible Transparent Strain Sensors from Downsizing Traditional Metallic Wires to the Nanoscale

Kaihao Zhang 1 Shengtai Shi 1 Kewen Han 1 Gaurav Bahl 1 Sameh Tawfick 1

1University of Illinois Urbana-Champaign Urbana United States

Show Abstract

4:45 AM - BB10.08
Highly Conducting ZnO Thin Film as Transparent Conducting Electrode for ZnO Based Organic/Inorganic Hybrid Devices

Budhi Singh 1 Subhasis Ghosh 2

1School of Physical Sciences, Jawaharlal Nehru University New Delhi India2Jawaharlal Nehru University New Delhi India

Show Abstract

5:00 AM - BB10.09
Flash Light Welding of Silver Nanowires for Transparent Electrode with High Electrical Conductivity

Wan Ho Chung 1 Dong Hyun Kim 1 Hak-Sung Kim 1 2

1Hanyang University Seoul Korea (the Republic of)2Hanyang University Seoul Korea (the Republic of)

Show Abstract

5:15 AM - BB10.10
Organic N-Dopants and N-Dopable Polymers

Benjamin Dexter Naab 3 Siyuan Zhang 2 Xiaodan Gu 3 Eric Evans 4 Koen Vandewal 1 Tadanori Kurosawa 3 Glenn Millhauser 4 Alberto Salleo 5 Stephen Barlow 2 Seth R. Marder 2 Zhenan Bao 3

1TU Dresden Dresden Germany2Georgia Institute of Technology Atlanta United States3Stanford University Stanford United States4University of California - Santa Cruz Santa Cruz United States5Stanford University Stanford United States

Show Abstract

5:30 AM - BB10.11
Pulse Voltage Design for Electrostatic Micro Manipulation of Dielectric Particle Utilizing Weak Surface Conductivity and Adhesion

Ryo Fujiwara 1 Pasomphone Hemthavy 1 Kunio Takahashi 1 Shigeki Saito 1

1Tokyo Institute of Technology Tokyo Japan

Show Abstract

BB9: Energy
Session Chairs
Eiichi Kondoh
Jeffery Bielefeld
Thursday AM, April 09, 2015
Moscone West, Level 2, Room 2014

9:30 AM - *BB9.01
Developments of Super Fine Printing Processes for Fabricating the Organic Thin Film Transistors on Flexible Films

Hirobumi Ushijima 1 Yasuyuki Kusaka 1 Mariko Fujita 1 Ken-ichi Nomura 1 Koji Abe 1 Noritaka Yamamoto 1

1National Institute of Advanced Industrial Science and Technology Ibaraki Japan

Show Abstract

10:00 AM - BB9.02
Optimization of Millisecond Photonic Sintering Process and X-Ray Diffraction, TEM Characterization of Inkjet-Printed Silver Nanoparticles on Plastic

Olivier Baudino 1 2 Mohamed Saadaoui 1 Daniel Zymelka 1 Andras Borbely 1 Huguette Bruyas 1 Beatrice Dubois 2 Karim Inal 3 Marc Ramuz 1

1Mines Saint-Etienne Saint-Etienne France2GEMALTO Gemenos France3Mines ParisTech Sophia Antipolis France

Show Abstract

10:15 AM - BB9.03
Direct Patterning of Sol-Gel-Enhanced Silver Nanowire Electrodes by Gravure Printing

William Joseph Scheideler 1 Vivek Subramanian 1

1UC Berkeley EECS Department Berkeley United States

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10:30 AM - BB9.04
Ethylenediamine Mediated Copper Nanowires Ink and Its Application to Flexible Conductive Film via Flash Light Sintering Process

Mallikarjuna Koduru 1 2 Hak-Sung Kim 2 1

1Hanyang University Seoul Korea (the Republic of)2Hanyang University Seoul Korea (the Republic of)

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10:45 AM - BB9.05
Development of Oxidation-Resistant Cu/Ag Alloyed Particles for Realization of Low-Resistance, Low-Cost Printed Conductors

Steven K Volkman 1 Vivek Subramanian 1

1University of California, Berkeley Berkeley United States

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11:00 AM - BB9
BREAK

11:30 AM - BB9.06
Direct Printing Metal Reactive Inks

Owen Hildreth 1 Jignesh Vanjaria 1 Christopher Lefky 1 Avinash Mamidanna 1

1Arizona State University Tempe United States

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11:45 AM - BB9.07
Infra-Red Curing Methodology for Roll-to-Roll (R2R) Manufacturing of Conductive Electrodes through Inkjet Technology Applicable for Devices in the Field of Flexible Electronic

Kalyan Yoti Mitra 1 Dana Weise 1 Melinda Hartwig 1 Reinhard R. Baumann 1 2

1Technische Universitaet Chemnitz Chemnitz Germany2Fraunhofer ENAS Chemnitz Germany

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12:00 PM - BB9.08
Laser -Induced Forward Transfer of High Viscosity Ag Nanopaste for RF Interconnects

Eric Witte Breckenfeld 1 2 Heungsoo Kim 2 Ray Auyeung 2 Nick Charipar 2 Alberto Pique 2

1National Research Council Washington United States2Naval Research Laboratory Washington United States

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12:15 PM - BB9.09
Fabrication of Mechanically-Robust Cu films on Flexible Substrates Using Electron Beam Irradiation

Soyeon Lee 1 2 Ji-Hoon Lee 1 Young-Chang Joo 1 3 Insuk Choi 2

1Seoul National University Seoul Korea (the Republic of)2Korea Institute of Science and Technology Seoul Korea (the Republic of)3Seoul National University Seoul Korea (the Republic of)

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12:30 PM - BB9.10
3D Printed Quantum Dot Light-Emitting Diodes

Yong Lin Kong 3 Ian Tamargo 3 Hyoungsoo Kim 3 Blake Johnson 3 Maneesh Gupta 3 Tae-Wook Koh 3 Huai-An Chin 3 Daniel Steingart 3 Barry P Rand 2 Michael McAlpine 1

1Princeton Univ Princeton United States2<