This tutorial introduced the audience to the basics, principles, and applications of two advanced TEM imaging techniques. The entire session is available for free viewing via MRS OnDemand:
Part I | Part II
8:30 am – 8:40 am—Introduction
8:40 am – 10:10 am—Part I: Liang Jin
High-Speed Direct Electron Detectors for In Situ TEM
In contrast to the scintillator-based Charged Coupled Device (CCD) commonly used in TEM, direct electron detectors produce images directly from high energy electrons. The high sensitivity and high speed properties of these advanced detectors have provided material scientists with a tool to study dynamic processes at the milliseconds time scale while maintaining spatial resolution of sub-nanometer and better. This part of the tutorial covers the physics of image formation, different imaging modes including electron counting, and new image processing methods for in situ observations. Applications of the technique to in situ mechanical, liquid cell and environmental TEM are given.
10:10 am – 10:30 am—Break
10:30 am – 12:00 pm—Part II: Gang Ren
Three-Dimensional Electron Tomographic for Hard and Soft Materials Research
Three-dimensional (3D) structural analysis is essential to understand the relationship between the structure and function of an object. Electron tomography (ET) is a technique that retrieves 3D structural information from a tilt series of 2D projections, and is becoming a mature technology with sub-nanometer resolution. First of all, this part of the tutorial discusses the common basis for 3D characterization, and specifies difficulties and solutions regarding both hard and soft materials research. Additionally, this part covers an overview of different experimental and computational techniques used in ET. Applications are given in 3D structural analysis of both physical-sciences research and soft materials and biomaterials research.