Meetings & Events

fall 1996 logo1996 MRS Fall Meeting & Exhibit

December 2 - 6, 1996 | Boston
Meeting Chairs:
 Werner Lutze, Karen Maex, Karl Sieradzki




Symposium J—Electronic Packaging Materials Science IX

Chairs

Steven Groothuis, Texas Instruments, Inc
Paul Ho, Univ of Texas-Austin
Kenzo Ishida, Intel Japan Corp
Tien Wu, IBM Microelectronics

Symposium Support

  • Intel Corp
  • Texas Instruments, Inc

* Invited paper

SESSION J1: FLIP-CHIP AND SOLDER TECHNOLGOY
Chairs: Paul S. Ho and T. W. Poon
Tuesday Morning, December 3, 1996
Essex East (W)
9:00 AM *J1.1
MATERIALS AND MECHANICS ISSUES IN FLIP-CHIP ORGANIC PACKAGING, Tien Wu, IBM Microelectronics, Dept U12, Endicott, NY; Yutaka Tsukada, IBM Japan Ltd, YASU Tech Application Lab, Kanagawa, JAPAN; William T. Chen, IBM Microelectronics, Endicott, NY.

9:30 AM J1.2
UNDERFILL DELAMINATION TRENDS IN DCA ASSEMBLIES, Yan Sha, Cornell Univ, Dept of T&AM, Ithaca, NY; C. Y. Hui, Cornell Univ, Dept of Theoretical & Applied Mechanics, Ithaca, NY; Edward J. Kramer, Cornell Univ, Dept of MS&E, Ithaca, NY; P. Borgesen, Universal Instruments Corp, Surface Mount Tech Lab, Binghamton, NY.

9:45 AM J1.3
MICROSTRUCTURE AND RELIABILITY OF SPUTTER DEPOSITED Cr-CrCu-Cr THIN FILMS FOR FLIP-CHIP APPLICATIONS, Na Zhang, Mark McNicholas, Neil Colvin, Materials Research Corp, Applications Lab, Orangeburg, NY.

10:00 AM BREAK

10:30 AM *J1.4
HIGH RELIABILITY UNDERFILL FOR FLIP-CHIP APPLICATIONc, Kazuaki Sumita, Kimitaka Kumagae, Shin-Etsu Chemical Co, Silicone Electronic Matls Res, Gunma, JAPAN; Kazuo Dobashi, Toshio Shiobara, Shin-Etsu Chemical Co, Silicone Electronic Matls Res Ctr, Gunma, JAPAN; Masahiro Kuroda, Intel Japan Corp, Package Tech Development, Ibaraki, JAPAN.

11:00 AM *J1.5
SPALLING OF Cu-Sn COMPOUND SPHEROIDS IN SOLDER JOINTS ON Si WAFERS, Harqkyun Kim, King Ning Tu, Univ of California-Los Angeles, Dept of MS&E, Los Angeles, CA.

11:30 AM J1.6
THERMODYNAMIC AND KINETIC STUDY OF PHASE TRANSFORMATIONS IN SOLDER/METAL SYSTEMS, Eric J. Cotts, Binghamton Univ, Dept of Physics & Astronomy, Binghamton, NY; R. R. Chromik, Binghamton Univ, Dept of Physics, Binghamton, NY.

11:45 AM J1.7
MICROSTRUCTURE AND FATIGUE RESISTANCE OF SOLDER INTERFACES, Chunshen Zhang, Jian-Ku Shang, Univ of Illinois-Urbana, Dept of MS&E, Urbana, IL.

SESSION J2: FUTURE PACKAGING TECHNOLOGY
Chairs: Steven K. Groothuis and Thomas Rucker
Tuesday Afternoon, December 3, 1996
Essex East (W)
1:30 PM *J2.1
MATERIALS AND PROCESSES FOR FUTURE PWB ENVIRONMENTAL TECHNOLOGY, Jane Shaw, M. Angelopoulos, S. L. Buchwalter, J. C. Hedrick, S. K. Kang, L. L. Kosbar, J. D. Gelorme, David A Lewis, Ravi F. Saraf, A. Viehbeck, IBM T.J. Watson Research Ctr, Yorktown Heights, NY.

2:00 PM J2.2
APPLICATION OF ELECTROLESS COPPER PLATING TECHNOLOGY FOR THIN FILM LAMINATED MULTILAYER WIRING BOARD, Takeyuki Itabashi, Hitachi Ltd, Hitachi Research Lab, Ibaraki-ken, JAPAN; Haruo Akahoshi, Akio Takahashi, Masahiro Suzuki, Hitachi Ltd, Research Lab, Ibaraki-ken, JAPAN; Masahiko Maeda, Hitachi Kyowa Engineering Co Ltd, Analysis & Testing Div, Ibarki-ken, JAPAN.

2:15 PM J2.3
ULTRAVIOLET EXCIMER LAMP PHOTOASSISTED SELECTIVE PALLADIUM ACTIVATION OF COARSE AND FINE GRAIN ALUMINA CERAMIC FOR SELECTIVE ELECTROLESS COPPER PLATING, Daniel Macauley, Patrick V. Kelly, Gabriel M. Crean, NMRC, Cork, IRELAND.

2:30 PM J2.4
MULTILAYER COMPOSITE DIAMOND HEAT SPREADERS FOR ELECTRONIC PACKAGING, W. D. Fan, North Carolina State Univ, Dept of MS&E, Raleigh, NC; R. B. Dinwiddle, Oak Ridge National Laboratory, Dept of Metallurgy & Ceramics, Oak Ridge, TN; K. Jagannadham, Jagdish Narayan, North Carolina State Univ, Dept of MS&E, Raleigh, NC.

2:45 PM J2.5
A NOVEL LOW-COST C-C COMPOSITE HEAT SINK MATERIAL, Witold Kowbel, V. Chellappa, James C. Withers, MER Corp, Tucson, AZ; W. L. Vaughn, NASA Langley Research Center, Hampton, VA.

3:00 PM BREAK

3:50 PM *J2.6
DEVELOPMENT OF NEW HIGH-MOUNTING DENSITY PACKAGES, Junichi Kasai, Fujitsu Ltd, Kawasaki, JAPAN; Kazuto Tsuji, Fujitsu Ltd, Semiconductor Group, Kawasaki, JAPAN; Yoshiyuki Yoneda, Fujitsu Ltd, Kawasaki, JAPAN.

4:00 PM J2.7
FATIGUE-RESISTANT OPTOELECTRONIC MODULE PACKAGING, H. Hieber, M. Zimmermann, ICR Jena, Jena, GERMANY.

4:15 PM J2.8
INVESTIGATION OF THE FLOW BEHAVIOR OF PARTICULATE-FILLED FLUIDS, T. E. Driscoll, Eric J. Cotts, G. Lehmann, P. C. Li, Binghamton Univ, Dept of Physics & Astronomy, Binghamton, NY.

4:30 PM J2.9
LOCAL STRAIN BEHAVIOR IN CONDUCTIVE ADHESIVES, Elizabeth S. Drexler, NIST, Materials Reliability Div, Boulder, CO; John R. Berger, Colorado School of Mines, Engineering Div, Golden, CO.

SESSION J3: MANUFACTURING TECHNOLOGY IN PACKAGING
Chairs: Raymond Pearson and Robert Sundahl
Wednesday Morning, December 4, 1996
Essex East (W)
8:30 AM *J3.1
MCM DEVELOPMENT USING FINE PITCH BALL BUMP, Morisaki Ikushi, Bonkohara Manabu, Dohya Akihiro, Nakamura Hirofumi, NEC Corporation, Production Material Engr Lab, Kanagawa, JAPAN.

9:00 AM J3.2
FOAMED ELASTOMER FOR PACKAGING INTERCONNECTIONS, TESTING AND BURN-IN APPLICATIONS, Yun-Hsin Liao, Da-Yuan Shih, IBM T.J. Watson Research Ctr, Yorktown Heights, NY; J. L. Hedrick, IBM Almaden Research Center, San Jose, CA; Paul A. Lauro, Keith E. Fogel, IBM T.J. Watson Research Ctr, Yorktown Heights, NY.

9:15 AM J3.3
INTERFACE OF Al ELECTRODE/CERAMIC SUBSTRATE FORMED BY SQ PROCESS, X. S. Ning, Y. Ogawa, Dowa Mining Co Ltd, Central Research Lab, Tokyo, JAPAN; Katsuaki Suganuma, Osaka Univ, Inst of Scientific & Industrial Res, Ibaraki, JAPAN.

9:30 AM J3.4
PROCESS DEVELOPMENT AND RELIABILITY STUDY OF GFPdNi FINISH FOR SEMICONDUCTOR PACKAGING, Irina Boguslavsky, AT&T Bell Laboratories, Lucent Tech, Murray Hill, NJ; Joseph A. Abys, AT&T Bell Laboratories, Murray Hill, NJ.

9:45 AM BREAK

10:15 AM *J3.5
NEW PACKAGING SUBSTRATE TECHNOLOGY, IBSS (INTERPENETRATING POLYMER NETWORK BUILD UP STRUCTURE SYSTEM, Asai Motoo, Ibiden Co Ltd, MCM Project, Gifu Prefecture, JAPAN.

10:45 AM J3.6
STRUCTURE-PROPERTY CORRELATION FOR THIN FILMS OF SEMI-INTERPENETRATING POLYIMIDE NETWORKS, Huey-Chiang Liou, Paul S. Ho, Univ of Texas-Austin, Center for MS&E, Austin, TX.

11:00 AM J3.7
RAPID CURE OF LIQUID ENCAPSULANTS AND CURING OF STRUCTURAL ADHESIVES FOR ELECTRONICS PACKAGING, USING VARIABLE FREQUENCY MICROWAVES, Zak Fathi, J. Billy Wei, Lambda Technologies Inc, Raleigh, NC; C. L. Hutchins, C. Hutchins & Associates, Raleigh, NC.

11:15 AM J3.8
CORROSION MEASUREMENTS OF SEVERAL LOW SOLIDS FLUXES AND PASTES, Brian A. Smith, Georgia Inst of Technology, Dept of MS&E, Atlanta, GA; Laura J. Turbini, Georgia Inst of Technology, School of MS&E, Atlanta, GA.

11:30 AM J3.9
FAST SOLDERING REACTION ON GOLD FOILS, Patrick G. Kim, King Ning Tu, Univ of California-Los Angeles, Dept of MS&E, Los Angeles, CA.

SESSION J4: PACKAGING MATERIALS AND METROLOGY
Chairs: K. S. Kim and Tien Wu
Wednesday Afternoon, December 4, 1996
Essex East (W)
1:30 PM *J4.1
PACKAGING RESEARCH AT THE SEMICONDUCTOR RESEARCH CORPORATION, Ron Bracken, Semiconductor Research Corp, Triangle Park, NC.

2:00 PM *J4.2
ANALYSIS AND CHARACTERIZATION OF ELECTRICALLY CONDUCTIVE ADHESIVES, Michael Gaynes, IBM Corp, Chip Assembly Technology, Endicott, NY; Luis J. Matienzo, Jeffrey A. Zimmerman, Daniel VanHart, IBM Microelectronics, Endicott, NY.

2:30 PM J4.3
THE EFFECT OF ORIENTATION ON ELECTRICALLY CONDUCTING POLYMER COMPOSITE PROPERTIES, William Berlin Genetti, Brian P. Grady, Univ of Oklahoma, School of Chem Engr & Matl Science, Norman, OK.

2:45 PM J4.4
EXPERIMENTAL VARIABLES EFFECTING CHAIN GROWTH IN CONDUCTIVE ADHESIVES, Rebecca E. Hefner, Rensselaer Polytechnic Inst, CII 9015, Troy, NY; Mark A. Palmer, Rensselaer Polytechnic Inst, CIEEM, Troy, NY; Gary E. Wnek, Sonja Krause, Rensselaer Polytechnic Inst, Dept of Chemistry, Troy, NY.

3:00 PM BREAK

3:30 PM *J4.5
IN-SITU MAPPING AND MODELING VERIFICATION OF THERMOMECHANICAL DEFORMATION IN UNDERFILLED FLIP-CHIP PACKAGE USING MOIRE INTERFEROMETRY, Xiang Dai, Univ of Texas-Austin, Dept of Matls Science, Austin, TX; C. Kim, R. Willecke, Paul S. Ho, Univ of Texas-Austin, Center for MS&E, Austin, TX.

4:00 PM J4.6
IN-SITU MEASUREMENTS OF THERMAL PROPERTIES OF DIELECTRIC FILMS IN METAL-DIELECTRIC-SUBSTRATE STRUCTURES, Peter Bloss, NIST, Gaithersburg, MD; Aime S. De Reggi, NIST, Polymers Div, Gaithersburg, MD; Hartmut Schafer, Univ Leipzig, Dept of Physics, Leipzig, GERMANY.

4:15 PM J4.7
IN-SITU MEASURING OF THERMO-MECHANICAL EFFECTS AND PROPERTIES IN THIN-FILM POLYMERS, Stephen D. Bluestein, Tufts Univ, Dept of Mechanical Engr, Medford, MA; Peter Y. Wong, Tufts Univ, Dept of Mech Engr, Medford, MA; Dewi P.Y. Bramono, Eddy K. Chan, Tufts Univ, Dept of Mechanical Engr, Medford, MA; Ioannis N Miaoulis, Tufts Univ, Mechanical Engineering, Medford, MA.

4:30 PM J4.8
RELIABILITY IMPROVEMENT OF ALUMINUM WIREBONDS IN HIGH-POWER IGBT MODULES, Yujing Wu, Motorola Inc, Hybrid Power Module Operation, Phoenix, AZ; Gene Thome, Scott Savage, Motorola Inc, SPS, Phoenix, AZ.

SESSION J5: POSTER SESSION
Chair: Paul S. Ho
Wednesday Evening, December 4, 1996
8:00 P.M.
America Ballroom (W)
J5.1
GRAFTED METALIZED PARTICLE INTERCONNECT, David R. Crotzer, Univ of Massachusetts, Interconnect Products Div, Attleboro Falls, Ma.; Thomas A. Wolf, Univ of Massachusetts, Interconnection Products Div, Attleboro Falls, Ma..

J5.2
VIBRATIONAL ANALYSIS OF A STEARIC ACID ADLAYER ADSORBED ON A SILVER FLAKE SUBSTRATE, Joseph Miragliotta, Richard C. Benson, Terry E. Phillips, Johns Hopkins Univ, Applied Physics Lab, Laurel, MD.

J5.3
A CONVERSION-ELECTRON M tex2html_wrap_inline240 SSBAUER STUDY OF TIN-BASED COMPOUNDS FORMED DURING PADS TREATMENT (PLASMA ASSISTED DRY SOLDERING) OF A SOLDER FOIL, Robert C. Reno, Univ of Maryland Baltimore County, Dept of Physics, Baltimore, MD; Brett Piekarski, U.S. Army Research Laboratory, Adelphi, MD.

J5.4
CORROSION OF ALUMINUM NITRIDE IN AQUEOUS MEDIA, Lynne M Svedberg, Michael J. Cima, MIT, Dept of MS&E, Cambridge, MA.

J5.5
COMPOSITE MATERIALS WITH ADJUSTABLE THERMAL EXPANSION FOR ELECTRONIC PACKAGING APPLICATIONS, J. D. Shi, Florida International Univ, Dept of Mechanical Engr, Miami, FL; Z. J. Pu, Florida International Univ, Dept of Mech Engr, Miami, FL; K. H. Wu, Florida International Univ, Dept of Mechanical Engr, Miami, FL.

J5.6
ELECTROMAGNETIC INTERFERENCE SHIELDING REACHING 130 dB USING FLEXIBLE GRAPHITE, Xiangcheng Luo, SUNY-Buffalo, Composite Mtls Research, Buffalo, NY; Deborah D.L. Chung, SUNY-Buffalo, Dept of Mech & Aero Engr, Buffalo, NY.

J5.7
ASSESSMENT OF CONTINUOUS MONITORING OF SURFACE INSULATION RESISTANCE READINGS FOR EARLY DETECTION OF DENDRITIC FORMATION, W. J. Ready, Georgia Inst of Technology, Dept of MS&E, Atlanta, GA; Laura J. Turbini, Georgia Inst of Technology, School of MS&E, Atlanta, GA.

J5.8
INTERFACIAL DELAMINATION IN PLASTIC ENCAPSULATED INTEGRATED CIRCUITS, Nickolaos Strifas, Univ of Maryland, Dept of Nuclear Engr, College Park, MD; Aris Christou, Univ of Maryland, Dept of Materials Engr, College Park, MD.

J5.9
STRUCTURAL EVOLUTION AND KINETICS OF INTERMETALLIC COMPOUND FORMATION IN DIFFUSION COUPLES COMPOSED OF COPPER AND Sn-BASED SOLDERS, Zhuoming Guan, Univ of Sci & Tech Beijing, Dept of MS&E, Beijing, CHINA; Jian Ding, Zunying Zhang, GuoXun Liu, Univ of Sci & Tech Beijing, Dept of MS&E, Beijing, CHINA.

SESSION J6: INTERFACIAL ADHESION AND FRACTURE
Chairs: Ron Bracken and Che-Yu Li
Thursday Morning, December 5, 1996
Essex East (W)
8:30 AM *J6.1
CONSTITUTIVE RELATION OF ATOMIC-SCALE INTERFACE SEPARATION, K. S. Kim, Brown Univ, Engineering Div, Providence , RI.

9:00 AM J6.2
FRACTURE AND FATIGUE RESISTANCE OF METAL/POLYMER INTERFACES IN MICROELECTRONIC PACKAGING APPLICATIONS, Reinhold H. Dauskardt, Stanford Univ, Dept of MS&E, Stanford, CA; Amol Kirtikar, Intel Corp, Assemble Technology, Chandler, AZ; Daniel Belton, Intel Corp, Assembly Technology, Chandler, AZ.

9:15 AM J6.3
AN ANALYSIS OF THE COHESIVE FAILURE IN THE Cu/POLYIMIDE SYSTEM., Ikseong Park, Jin Yu, KAIST, Dept of MS&E, Seoul, SOUTH KOREA; Eunchol Ahn, Package Development, Seoul, Korea.

9:30 AM J6.4
STUDY OF RESIDUAL STRESSES IN THIN CHROMIUM METALLIZATIONS ON GLASS SUBSTRATE, Chen Zhou, Cornell Univ, Dept of MS&E, Ithaca, NY; Matt Kerhonen, Cornell Univ, Dept of MS&E, Ithaca, NY; Lasse Suominen, American Stress Technologies Inc, Pittsburgh, PA; Che-Yu Li, Cornell Univ, Dept of MS&E, Ithaca, NY.

9:45 AM BREAK

10:15 AM *J6.5
ON RELATING THERMODYNAMIC WORK OF ADHESION TO INTERFACIAL FRACTURE TOUGHNESS, Raymond Pearson, Lehigh Univ, Dept of MS&E, Bethlehem, PA; Thomas B. Lloyd, Lehigh Univ, Microelectronics Pkg Matls Lab, Bethlehem, PA.

10:45 AM J6.6
TECHNIQUE TO MEASURE THERMODYNAMIC ADHESION OF COPPER-POLYIMIDE INTERFACE, Marlon E. Menezes, I. M. Robertson, H. K. Birnbaum, Univ of Illinois-Urbana, Dept of MS&E, Urbana, IL.

11:00 AM J6.7
MIXED MODE FRACTURE IN ELECTRONIC PACKAGES, Winston O. Soboyejo, G-Y. Lu, J. Zhang, V. Sinha, Ohio State Univ, Dept of MS&E, Columbus, OH; S. Chengalva, Ohio State Univ, Dept of Aeronautical Engr, Columbus, OH; V. Kenner, Ohio State Univ, Dept of Aeronautical Engr Applied Mech & Aviation, Columbus, OH.

11:15 AM J6.8
QUANTIFICATION OF GOLD/SLUG-ATTACH ADHESION USING INTERFACIAL FRACTURE TOUGHNESS MEASUREMENTS, Mark Thurston, Intel Corp, Assembly Technology Development, Chandler, AZ; Brad Menzies, Kevin Nix, Intel Corp, Assembly Tech Development, Chandler, AZ.

11:30 AM J6.9
NOVEL TECHNIQUE TO IMPROVE ADHESION BETWEEN METAL-POLYMER INTERFACES, Marlon E. Menezes, I. M. Robertson, H. K. Birnbaum, Univ of Illinois-Urbana, Dept of MS&E, Urbana, IL.

11:45 AM J6.10
LOW TEMPERATURE OXIDATION OF Cu-BASE LEADFRAME AND Cu/EMC INTERFACE ADHESION, Soon-Jin Cho, Kyung-Wook Paik, KAIST, Dept of MS&E, Taejon, SOUTH KOREA.

SESSION J7: PACKAGING RELIABILITY AND TESTING
Chairs: Michael Gaynes and Kenzo Ishida
Thursday Afternoon, December 5, 1996
Essex East (W)
1:30 PM *J7.1
STRESS SIMULATIONS OF AREA ARRAY INTERCONNECT TECHNOLOGIES, Steven K. Groothuis, Nick Hassanzadeh, Texas Instruments, Inc, Dallas, TX.

2:00 PM J7.2
MECHANICAL DEFORMATION MODELING OF DIAMOND/GaAs STRUCTURES, Nickolaos Strifas, Univ of Maryland, Dept of Nuclear Engr, College Park, MD; Aris Christou, Univ of Maryland, Dept of Materials Engr, College Park, MD.

2:30 PM J7.4
RELATIONSHIP BETWEEN SHEAR DEBONDING AND CONTACT ELECTRICAL RESISTIVITY BETWEEN COPPER WIRE AND TiN-LEAD SOLDER, Xiangcheng Luo, SUNY-Buffalo, Composite Mtls Research, Buffalo, NY; Deborah D.L. Chung, SUNY-Buffalo, Dept of Mech & Aero Engr, Buffalo, NY.

2:45 PM BREAK

3:15 PM *J7.5
STRUCTURAL RELIABILITY OF DIRECT-CHIP-ATTACHES BONDED WITH ANISOTROPIC CONDUCTIVE FILM, Conrad Shen, David C.C. Lam, Pin Tong, Karim Zaheed, Hong Kong Univ Sci & Tech, Dept of Mech Engr, Clear Water Bay, HONG KONG.

3:45 PM J7.6
CREEP STUDY FOR FATIGUE LIFE ASSESSMENT OF SOLDER JOINTS OF TWO LEAD-FREE HIGH TEMPERATURE SOLDER ALLOYS, Jin Liang, Advanced Technology Labs, Milwaukee, WI; Ping S. Lee, Neil Gollhardt, Rockwell Automation, Milwaukee, WI; Scott Schroeder, Fred Morris, Rockwell Intl Science Center, Thousands Oaks, CA.

4:00 PM J7.7
GLASSES FOR LOW-TEMPERATURE HERMETIC PACKAGE OF MODERN SEMICONDUCTOR DIODES, Semyon D. Savransky, L. Ganapathi, Sensitron Semiconductor, Deer Park, NY.

4:15 PM J7.8
RELIABILITY AND CHARACTERIZATION OF GLASS-CERAMIC DIELECTRIC THICK FILMS WITH Cu CONDUCTORS FOR MULTILAYER PACKAGES, Yong S. Cho, Alfred Univ, Dept of Ceramics, Alfred, NY; Metin Koyuncu, Walter A. Schulze, Alfred Univ, New York State College of Ceramics, Alfred, NY; Vasantha R.W. Amarakoon, Alfred Univ, College of Ceramics, Alfred, NY.