Thermoformable All-Ceramics Through AM and Particle Assembly

When and Where

Nov 30, 2023
1:30pm - 2:00pm

Sheraton, Second Floor, Republic B



Randall Erb1,Jason Bice1,Echo St. Germain1

Northeastern University1


Randall Erb1,Jason Bice1,Echo St. Germain1

Northeastern University1
Thermoforming processing, traditionally reserved for thermoplastic polymers and sheet metals, has been extended here to boron-based all-ceramics. Specifically, sintered boron nitride composite sheets manufactured via a combined vibration and tape-casting photopolymerization process exhibited highly oriented microstructure which allowed these preform sheets to flow as viscous Bingham pseudoplastics during compression molding. These sintered all-ceramic preforms are thermoformed into thin, complex parts with features down to 200 μm. Further, a new workflow is leveraged to generate bespoke all-ceramic heat spreaders that can be press-fit onto printed circuit boards and outperform metal heat sinks as a low-profile thermal management solution. This work offers a route for other all-ceramics that may be thermoformed through first fabricating pre-forms with highly-ordered anisotropic microstructures.


ceramic | thermal conductivity | thermal diffusivity

Symposium Organizers

Allison Beese, The Pennsylvania State University
A. John Hart, Massachusetts Institute of Technology
Sarah Wolff, The Ohio State University
Wen Chen, University of Massachusetts Amherst

Publishing Alliance

MRS publishes with Springer Nature


Symposium Support