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Symposium EL01-Surfaces and Interfaces in Electronics and Photonics

Surfaces and interfaces have become increasingly important factors for the integration of emerging materials and the implementation of latest fabrication processes into new generation of electronic and photonic devices. When interfaces are formed at the junction between materials surfaces with dissimilar properties, surprising new properties not present in either parent phase emerge at the intersection. These intriguing interfacial properties play key roles in organizing the multilayered device structures and modulating the charge-transfer dynamics across connecting layers. As system dimensions are scaled downward for future electronic device applications and heterogeneous integration of inorganic and organic surfaces are getting prevalent in wearable devices, the nature and complexity of materials interfaces bring tremendous challenges to scientists and engineers resulting in slowing down the progress towards emerging applications. Advanced characterization techniques to study these complex interfaces accurately are also rare. Methods of film and surface preparation and interface formation are often coupled, and they significantly affect the operation of devices. Thus, this symposium is aimed at bringing together experts in the different aspects of materials surfaces and interfaces ranging from advanced characterization, to unconventional film-growth, patterning and device level integration. Both experimental and theoretical papers are welcome. Special emphasis will be given to papers in areas of in situ characterization techniques as well as modelling and multiscale simulations.


Topics will include:

  • Supply chain for materials and tools to address surfaces and interfaces in Electronics and Photonics
  • Interface engineering in emerging photovoltaics including perovskites
  • CHIPS Act and its impact on materials science industry

Invited Speakers (tentative):

  • Julien Bachmann (Friedrich-Alexander-Universität Erlangen-Nürnberg, Germany)
  • Katherine Develos Bagarinao (National Institute of Advanced Industrial Science and Technology, Japan)
  • Stacey Bent (Stanford University, USA)
  • Rebecca Kramer Bottiglio (Yale University, USA)
  • Marla L. Dowell (National Institute of Standards and Technology, USA)
  • Catherine Dubourdieu (Helmholtz-Zentrum Berlin, Germany)
  • Lara A. Estroff (Cornell University, USA)
  • Steven George (University of Colorado Boulder, USA)
  • Oki Gunawan (IBM T.J. Watson Research Center, USA)
  • Melissa Hines (Cornell University, USA)
  • Erwin Kessels (Technische Universiteit Eindhoven, Netherlands)
  • Adrie Mackus (Technische Universiteit Eindhoven, Netherlands)
  • Tse Nga Ng (University of California, San Deigo, USA)
  • Ola Nilsen (University of Oslo, Norway)
  • Robert Opila (University of Delaware, USA)
  • Jeongwon Park (University of Ottawa, Canada)
  • Sang-Hee Park (Korea Advanced Institute of Science and Technology, Republic of Korea)
  • Gregory Parsons (North Carolina State University, USA)
  • Riikka Puurunen (Aalto University, Finland)

Symposium Organizers

Santanu Bag
Huntington Ingalls Industries, USA
Microelectronics Business Unit
USA

Silvia Armini
imec
Belgium

Mandakini Kanungo
Corning Incorporated
USA

Gilad Zorn
General Electric
GE Research Center
USA

Publishing Alliance

MRS publishes with Springer Nature