Call for Papers

Please contact the symposium organizers with questions.

The decreasing dimensions of functional and structural materials in micro-electronic devices, large-scale integrated circuits, thin-film solar cells, electrical sensors, and electronic textiles has motivated research on the micro- and nanoscale mechanical behavior of materials. Consequently, understanding the effects of intrinsic and extrinsic length scales on the mechanical properties and deformation mechanisms of micro/nano-scale materials, and tuning their behavior through micro/nanostructure engineering has drawn considerable attention.

This symposium will cover the mechanical behaviors of current and emerging micro/nano-scale materials and composites. Structural micro/nanomaterials and composites have excellent mechanical performance and multifunctional properties, which can be tuned by altering their structural architecture, microstructural features and exploiting material size effects. These materials are of particular interest as lightweight load bearing structures and in functional devices for use in extreme conditions of stress, temperature, pressure and chemical reactivity, such as in space and within living matter. This symposium will include the fundamental mechanical behaviors of individual structures, as well as the deformation of hierarchical composites.

Topics will include:

• Novel methods to tailor the microstructures of micro- and nanoscale materials
• Mechanical and physical properties of micro/nano-scale materials in extreme environments
• Metallic nanocomposites and multilayers
• Characterization and mechanics of interfaces
• In situ testing on fracture and fatigue of micro/nano-scale materials
• Integration of micro/nano-scale materials into applications and devices
• Deformation behavior of low-dimensional materials
• Advanced sensors and actuators for measuring mechanical, physical properties of materials

Invited Speakers:

• Irene Beyerlein (University of California, Santa Barbara, USA)
• Robert Carpick (University of Pennsylvania, USA)
• Chris Eberl (Fraunhofer Institute for Mechanics of Materials IWM, Germany)
• David Goldsby (University of Pennsylvania, USA)
• Khalid Hattar (Sandia National Laboratories, USA)
• Dongchan Jang (Korea Advanced Institute of Science and Technology, Republic of Korea)
• Takayuki Kitamura (Kyoto University, Japan)
• Jessica Krogstad (University of Illinois at Urbana-Champaign, USA)
• Erica Lilleodden (Helmholtz-Zentrum Geesthacht, Germany)
• Jun Lou (Rice University, USA)
• Michael Mills (The Ohio State University, USA)
• Amit Misra (University of Michigan, USA)
• Warren Oliver (KLA Corporation, USA)
• Taher Saif (University of Illinois at Urbana-Champaign, USA)
• Mitra Taheri (Johns Hopkins University, USA)
• Joost Vlassak (Harvard University, USA)
• Yuntian Zhu (North Carolina State University, USA)

Symposium Organizers