Functional materials and devices under unconventional conditions such as ultralow/ultrahigh temperature, high pressure/strain, high electric/magnetic field, and corrosions are hailed as a revolutionary field for practical applications. Unconventional environmental conditions will induce both physical properties related to device geometry, and new quantum and coupling states. For instance, the combination of high magnetic fields of 60 T and pressure of 4 GPa has recently shed new light on the subtle competition between the hidden-order state and neighboring magnetically ordered quantum states. The resultant external condition change of thermal management based on phonon/electric transports will challenge device performance including durability of material component stability, data communication, and measurement reliability. Discovering and understanding thermal properties in functional materials and devices under unconventional conditions is fundamentally important to harnessing thermal management. The recent experimental development in advanced scattering, spectroscopy, and microscopy measurements made the studies in unconventional conditions feasible.
This symposium will cover fundamental thermal transport theory and modeling of functional materials and devices, elucidating how controlled external unconventional conditions can enable new materials properties and device functions with well-managed thermal performance. Interdisciplinary topics in thermal science at the interaction of mechanical engineering, physics, manufacturing and materials science and engineering will be presented by invited speakers in order to accelerate the understanding of thermal management in unconventional conditions. Interdisciplinary presentations from invited speakers are also aimed to motivate synergistic research collaborations in the field of functional thermal materials, structures and devices.
Symposium Organizers
Annie Xian Zhang
Stevens Institute of Technology
Department of Mechanical Engineering
USA
Satish Kumar
Georgia Institute of Technology
The George W. Woodruff School of Mechanical Engineering
USA
Nenad Miljkovic
University of Illinois at Urbana-Champaign
Department of Mechanical Science and Engineering
USA
Baoxing Xu
University of Virginia
Mechanical and Aerospace Engineering
USA