Mixed dimensional heterostructures formed by stacking 0D, 1D, 2D, and 3D materials together can offer exciting multifunctionalities that cannot be otherwise obtained by pure 1D or 2D or 3D materials. Heterogenous integration can substantially alter the electrical, magnetic, optical, and thermal properties and result in tremendous intriguing functionalities. A great deal of efforts has been made to form unprecedented device architectures via heterostructuring various dimensional materials. To obtain heterostructured systems with high quality interfaces, significant progress has been made on in-situ growth or ex-situ transfer techniques. These are critical to obtain extensive and flexible designs of heterostructures. In this symposium, we provide the opportunity for speakers and audience to share the progress in research of various dimensional material heterostructures which include the methods for synthesis, growth, transfer, lift-off, and even scale-up. The goal of the symposium is to allow the community to come together to advance the heterostructuring concept from the existing 2D heterostructures to various dimensional heterostructures for electronic, photonic, and electrochemical applications.
The symposium will cover a complete range of topics related to heterogeneous integration of various dimensional materials from fundamentals to applications. Interdisciplinary topics related to physics, materials science and engineering will be connected by invited talks in order to accelerate the development of manufacturing of various dimensional heterostructures and their applications. The session will also be dedicated to motivate discussions toward emerging technology to develop new types of heterogeneously integrated structures using 0D, 1D, 2D, and 3D materials.
Massachusetts Institute of Technology
Department of Mechanical Engineering
University of Virginia
University of Illinois at Urbana-Champaign
Electrical and Computer Engineering
School of Physics