MRS Meetings and Events

 

SF03.06.22 2023 MRS Fall Meeting

Thermoelectric Properties of P-Doped and B-Doped Polycrystalline Silicon Thin Films

When and Where

Nov 28, 2023
8:00pm - 10:00pm

Hynes, Level 1, Hall A

Presenter

Co-Author(s)

Keisuke Shibata1,Shinya Kato2,Masashi Kurosawa1,Kazuhiro Gotoh1,3,4,Satoru Miyamoto1,Takashi Itoh1,Noritaka Usami1,5,Yasuyoshi Kurokawa1

Nagoya University1,Nagoya Institute of Technology2,Niigata University3,Interdisciplinary Research Center for Carbon-Neutral Technologies, Niigata University4,Institutes of Innovation for Future Society, Nagoya University5

Abstract

Keisuke Shibata1,Shinya Kato2,Masashi Kurosawa1,Kazuhiro Gotoh1,3,4,Satoru Miyamoto1,Takashi Itoh1,Noritaka Usami1,5,Yasuyoshi Kurokawa1

Nagoya University1,Nagoya Institute of Technology2,Niigata University3,Interdisciplinary Research Center for Carbon-Neutral Technologies, Niigata University4,Institutes of Innovation for Future Society, Nagoya University5
Thermoelectric power generation (TEG) is one of the ambient energy sources and a clean power generation method that directly converts heat, an unutilized energy source, into electrical energy. TEG modules are safe, maintenance-free, and can be expected to be used over the long term because they can be operated with a simple structure that has no driving parts.<br/>Silicon (Si) is the 2nd most abundant materials in the Earth’s crust and is relatively cheap and non-toxic. However, its high thermal conductivity <i>κ</i> is a bottleneck for usage as a TE material. Many silicon-based next-generation TE materials have been investigated to reduce <i>κ</i> and improve the Seebeck coefficient <i>S</i>. In TE materials, a structure called PGEC that behaves like a glass for the phonons responsible for thermal conduction and like a crystal for the carriers responsible for electrical conduction is considered suitable. One of the strategies to decrease high <i>κ</i> by phonon-scattering and maintain high electrical conductivity <i>σ</i> is nanostructure by developing polycrystalline Si (poly-Si) from amorphous Si (a-Si).<br/>This study focused on the annealing process of P-doped and B-doped a-Si thin films prepared by plasma-enhanced chemical vapor deposition (PECVD). In PECVD, it is easy to control a doping concentration at the high doping level, since PECVD is a non-equilibrium process. Moreover, the effective <i>κ</i> of thin films can be decreased by reducing the thickness due to the influence of interfacial thermal resistance and surface phonon scattering. After post-annealing, TE properties of P-doped or B-doped poly-Si thin films were measured from room temperature to 873 K.<br/>P-doped or B-doped hydrogenated a-Si (a-Si:H) thin films were prepared on a quartz substrate by PECVD. After deposition, the samples were annealed at 1173 K for 30 minutes under a forming gas atmosphere (N<sub>2</sub>: 97%, H<sub>2</sub>: 3%). The <i>σ</i>, the <i>S</i>, and thermal diffusivity were evaluated under an Ar atmosphere using a TE property measurement system. The <i>κ</i> was estimated from the data of thermal diffusivity, density, and mass heat capacity of a-Si. From spectroscopic ellipsometry, the thicknesses of P-doped and B-doped poly-Si thin films were estimated to be 480 and 440 nm, respectively. In Raman scattering spectra, the peaks derived from the crystalline silicon phase did not appear in both samples. a sharp peak due to the crystalline silicon phase was observed at 514 cm<sup>-1</sup> for both samples. Crystal volume fractions of P-doped and B-doped thin films were estimated to be 0.32 and 0.51, respectively. The <i>S</i> for both types tended to increase with increasing temperature up to -231 μV/K and 301 μV/K. The <i>σ</i> tended to decrease for P-doped and increase for B-doped with increasing temperature. On the other hand, the <i>κ</i> was not changed with temperature and was lower by about two orders of magnitude compared with that of bulk Si. In the case of P-doped poly-Si, the dimensionless figure of merit <i>ZT</i> exceeded unity around 573 K, and <i>ZT</i> = 1.92 was obtained around 873 K. This <i>ZT</i> value is relatively high compared with Si-based TE materials previously reported. This may be due to the high <i>σ</i> of 629 S/cm with a doping concentration of ~10<sup>21</sup> cm<sup>-3</sup> and the low <i>κ</i> of 1.51 W・m<sup>-1</sup>・K<sup>-1 </sup>at 873 K. The increase in crystallinity enhances dopant activation, leading to the increase in carrier concentration, and also enhances carrier mobility. That is why high <i>σ</i> was obtained. Moreover, the low <i>κ</i> was obtained, which is as low as that of quartz. This may be due to the thermal interfacial resistance (<i>R</i><sub>int</sub>). When the thickness of the poly-Si thin film and the intrinsic <i>κ</i> of bulk Si at 873 K were assumed to be 480 nm and 38 W・m<sup>-1</sup>・K<sup>-1</sup>, the <i>R</i><sub>int</sub> was estimated to be 3.05×10<sup>-7</sup> m<sup>2</sup>・K・W<sup>-1</sup>, which is in the range of previously reported <i>R</i><sub>int</sub> at a Si/SiO<sub>2</sub> interface, suggesting that the low <i>κ</i> is due to <i>R</i><sub>int</sub>. In the presentation, we will also provide the dependence of TE properties on crystal volume fraction and doping concentration.

Symposium Organizers

Craig Brown, National Institute of Standards and Technology
Michelle Dolgos, University of Calgary
Rie Makiura, Osaka Metropolitan University
Brent Melot, University of Southern California

Symposium Support

Bronze
Anton Paar
Hiden Analytical Inc

Session Chairs

Craig Brown
Brent Melot

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